Dell EMC PowerEdge R340 Quick start guide

Dell EMC PowerEdge R340
The PowerEdge R340 delivers the right mix of performance,
redundancy and value in a dense 1-socket, 1U chassis. Powered by
the latest Intel® Xeon® processor family, it is ideal for small,
medium and large enterprises looking to deploy multiple workloads
including but not limited to: collaboration/sharing, le/print, mail/
messaging and backup/recovery.
Technical Guide

© 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
2018 - 10
Rev. A00

Contents
1 Product overview.............................................................................................................5
Introduction........................................................................................................................................................................5
New technologies...............................................................................................................................................................5
2 System features.............................................................................................................. 6
Product comparison........................................................................................................................................................... 6
Product specications........................................................................................................................................................ 7
3 Chassis views and features............................................................................................ 10
Front view of the system.................................................................................................................................................. 10
Back view of the system...................................................................................................................................................10
Internal view of the system................................................................................................................................................11
Locating the information tag of your system......................................................................................................................11
4 Processor...................................................................................................................... 13
Processor features............................................................................................................................................................13
Supported processors....................................................................................................................................................... 13
Chipset..............................................................................................................................................................................14
5 Memory......................................................................................................................... 17
Supported memory........................................................................................................................................................... 17
Memory speed..................................................................................................................................................................18
6 Storage..........................................................................................................................19
Supported drives...............................................................................................................................................................19
Storage controller specications....................................................................................................................................... 19
Optical drive......................................................................................................................................................................19
Tape drive......................................................................................................................................................................... 19
Internal Dual SD Module................................................................................................................................................... 20
Boot Optimized Storage Subsystem (BOSS)..............................................................................................................20
7 Networking and PCIe..................................................................................................... 21
PCIe slots..........................................................................................................................................................................21
PCI card dimensions and power support........................................................................................................................... 21
8 Power, thermal, and acoustics.......................................................................................22
Power supply units........................................................................................................................................................... 22
Thermal............................................................................................................................................................................22
Acoustics..........................................................................................................................................................................23
9 Supported operating systems........................................................................................25
10 Dell EMC OpenManage systems management.............................................................26
3

iDRAC with Lifecycle controller........................................................................................................................................ 26
iDRAC features and comparison................................................................................................................................. 27
Agent-free management................................................................................................................................................... 31
Agent-based management................................................................................................................................................31
Dell EMC consoles............................................................................................................................................................ 31
Dell EMC OpenManage systems management tools, utilities and protocols......................................................................33
Integration with third-party consoles................................................................................................................................34
OpenManage connections with third-party consoles....................................................................................................... 35
11 Appendix A. Additional specications........................................................................... 36
Chassis dimensions.......................................................................................................................................................... 36
Chassis weight................................................................................................................................................................. 36
Video................................................................................................................................................................................ 37
USB ports.........................................................................................................................................................................37
Drives............................................................................................................................................................................... 37
NIC ports..........................................................................................................................................................................37
Environmental specications.............................................................................................................................................37
12 Appendix B. Standards compliance.............................................................................. 40
13 Appendix C Additional resources.................................................................................. 41
14 Appendix D. Support and deployment services............................................................ 42
ProDeploy Enterprise Suite and Residency Services.........................................................................................................42
ProDeploy Plus........................................................................................................................................................... 42
ProDeploy...................................................................................................................................................................42
Basic Deployment.......................................................................................................................................................42
Residency Services.................................................................................................................................................... 43
Deployment services........................................................................................................................................................ 43
Remote Consulting Services.............................................................................................................................................43
Data Migration Service.....................................................................................................................................................43
ProSupport Enterprise Suite.............................................................................................................................................43
ProSupport Plus............................................................................................................................................................... 44
ProSupport.......................................................................................................................................................................44
ProSupport One for Data Center......................................................................................................................................44
ProSupport One for Data Center......................................................................................................................................45
Support Technologies.......................................................................................................................................................45
SupportAssist.............................................................................................................................................................46
TechDirect..................................................................................................................................................................46
Additional professional services........................................................................................................................................ 46
Dell Education Services.................................................................................................................................................... 46
Dell EMC Global Infrastructure Consulting Services......................................................................................................... 47
Dell EMC Managed Services............................................................................................................................................ 47
4

1
Product overview
Introduction
The PowerEdge R340 rack system consists of the Coee Lake-S processor used in conjunction with the Cannon Lake-H PCH
(C246) Platform Controller Hub (PCH). The PowerEdge R340 rack system is a two‐chip platform (enabled by the chipset) when
compared to the traditional three‐chip platforms (Processor, Memory controller, and I/O controller). It also includes an integrated
memory controller (IMC) and integrated I/O (IIO) (such as PCI Express and DMI3) on a single silicon die.
New technologies
The PowerEdge R340 is the ideal entry-level server for data centers & SMB to address small scale enterprise applications designed
for productivity and data intensive applications for remote oce/branch oces requiring maximum uptime. The PowerEdge R340
provides a choice of either 8x2.5” or 4x3.5” hot-plug drive congurations for added storage exibility. 50% increase in core count
signicantly improves performance while a quiet, short-depth form factor is optimized for constrained spaces. R340 is perfect for
web hosting, backup/recovery, le/print, mail/messaging, and collaboration/sharing.
The following table shows the list of new technologies oered by the PowerEdge R340:
New Technologies Detailed Descriptions
Intel® C246 series chipset Please refer to the chipset section for details
Intel® Xeon® processor E- 2100 Product Family The Intel® Xeon® E-2100 processor has increased core count
and embedded PCIe lanes that will improve the IO performance.
Please refer processor section for additional details.
Next Generation SW RAID, PERC S140 The new 1-socket servers support the latest S140 software
RAID along with H330 and H730P controller cards with
improved functionality and faster performance. New SW RAID
supports RAID 0, 1, 5 and 10. Please refer to storage section for
additional details.
iDRAC 9 The new embedded system management solution for Dell EMC
server features hardware and rmware inventory and alerting, in
depth memory alerting, faster performance, dedicated gigabit
port, email alerts, electronic licensing, editable user work notes
log and more. Dedicated iDRAC Direct microUSB port improves
at-the-box management. Please refer to section iDRAC section
for additional details.
5

2
System features
Product comparison
The following table shows the comparison between the PowerEdge R330 and PowerEdge R340:
Table 1. Product comparison with predecessor
Feature PowerEdge R330 PowerEdge R340
Processor • Intel Xeon® E3-1200 v6 Processor family
• Intel Pentium®
• Intel Celeron®
• Intel Core i3®
• Intel Xeon® E-2100 Processor family
• Intel Pentium®
• Intel Celeron®
• Intel Core i3®
Number of processors • 1 • 1
Number or cores • Up to 4 cores • Up to 6 cores
L2/L3 cache • 2.0 MB per core
• Up to 8 MB
• 2.0 MB per core
• Up to 12 MB
Chipset • Intel C236 • Intel C246
Memory Module • DDR4: 4 UDIMMs with ECC
• Speed: Up to 2400MT/s
• Min RAM: 4 GB
• Max RAM: 64 GB
• DDR4: 4 UDIMMs with ECC
• Speed: Up to 2666MT/s
• Min RAM: 8GB
• Max RAM: 64 GB
Hard drive bays • 4 x 3.5-inch cabled or hot plug
• 8 x 2.5-inch hot plug
• 2 x 1.8-inch cabled
• 4 x 3.5-inch hot plug
• 8 x 2.5-inch hot plug
Hard drive types • Default SATA. Optional SAS
• Enterprise HDD
• Entry HDD
• Default SATA. Optional SAS
• Enterprise HDD
• Entry HDD
External hard drive bays • 1x slim ODD 9.5mm • 1x slim ODD 9.5mm
RAID controllers • Chipset based SATA, PERC S130
• PERC H330
• PERC H730
• PERC H830
• Chipset based SATA, PERC S140
• PERC H330
• PERC H730P
Host Bus Adapter (HBA) • 12Gb SAS External HBA • 12Gb SAS External HBA
• HBA330 Internal adapter
Boot optimized storage
subsytem
• Not supported • 2x M.2 240GB (RAID 1 or No RAID)
• 1x M.2 240GB (No RAID only)
6

Feature PowerEdge R330 PowerEdge R340
Server management • BMC
• IPMI 2.0 compliant; Full Open Manage suite
• Optional iDRAC8 Express
• Optional iDRAC8 Enterprise
•Vash
• BMC
• IPMI 2.0 compliant; Full Open Manage suite
• Optional iDRAC9 Express
• Optional iDRAC9 Enterprise
•Vash
I/O slots • 1 x16 slot PCIe Gen3 for HL/FH from CPU1(x8
lanes)
• 1 x 8 slot PCIe Gen3 for LP from CPU1(x4
lanes)
• 1 x16 slot PCIe Gen3 for HL/FH from CPU1(x8
lanes)
• 1 x 8 slot PCIe Gen3 for LP from CPU1(x4
lanes)
NIC/LOM • 2x GbE LOM • 2x GbE LOM
USB • 2 rear USB 3.0
• 2 front USB 2.0
• 1 internal USB 3.0
• 2 rear USB 3.0
• 1 front USB 2.0
• 1 internal USB 3.0
Power supplies • Single or Dual Redundant hot-pluggable 350W
(Platinum) • Single or Dual Redundant hot-pluggable 350W (Platinum) or 550W (Platinum)
Fans • 3 or 4 non-redundant, non-hot swappable fans • 3 or 4 non-redundant, non-hot swappable fans
Form factor • 1U rack • 1U rack
Dimensions (HxWxD) • 42.8 x 434.0 x 664 (mm) (w/o bezel)
• 1.67” x 17.09” x 26.2”(in)
• 4x 3.5” chassis:
– 42.8 x 434.0 x 596 (mm) (w/o bezel)
– 1.67” x 17.09” x 23.5”(in)
• 8x 2.5" chassis:
– 42.8 x 434.0 x 545 (mm) (w/o bezel)
– 1.67” x 17.09” x 21.5”(in)
Weight • Max 29.54 lb/13.4 Kg • Max 29.98 lb/13.6 Kg
Product specications
The following able list the technical specications for the PowerEdge R340:
Table 2. Technical specications
Features Specications
Form Factor • 1U rack
Processors • Intel® Xeon® processor E-2100 product family
• Intel® Core™ i3 8100 processor
• Intel® Pentium® G5500 processor
• Intel® Celeron G4900 processor
Processor sockets • 1
Front Side Bus or HyperTransport • Intel DMI 3.0
Cache • 2.0 MB per core
• 8 MB or 12 MB
7

Features Specications
Chipset • Intel C246 Chipset
Memory • Up to 64GB (4 DIMM Slots)
• 8GB/16GB 2666MT/s Unbuered with ECC only
• MIN/ MAX RAM: 8GB/64GB
I/O slots • 2 GEN 3 PCIe slots:
– X16 slot FH (1x8 Gen3)
– X8 Slot LP (1X4 Gen3)
RAID controller • S140
• PERC H330
• PERC H730P
Host Bus Adapter (HBA) • 12Gb SAS External HBA
• HBA330 Internal adapter
Drive bays • Up to 8 x 2.5” Hot-Plug drives
• Up to 4 x 3.5” Hot-Plug drives
Maximum internal storage • 56.0TB for 4 x 3.5” HDD cong
• 19.2TB for 8 x 2.5” HDD cong
Hard drives • 2.5” SSD SATA 6Gb
• 2.5” SATA 7.2K
• 2.5” SAS 15K HDs
• 2.5” Near Line SAS 7.2K
• 2.5” SAS 10K HDDs
• 3.5” Enterprise SATA 7.2K HDDs
• 3.5” Near Line SAS 7.2K HDDs
• Capacity: 14TB; 12TB; 10TB; 8TB; 6TB; 4TB; 2TB; 1TB
Embedded LOM/NIC • Integrated BROADCOM BCM5720 Gigabit Ethernet
Controller
Communications Optional add-in cards:
• 10GbE Intel (Dual) Sageville Sage Pond Dual port 10Gb
Base-T adapter – FH or LP
• 10GbE Intel (Dual) Fortville Eagle Fountain Dual port 10Gb
SFP+ adapter – FH or LP
• 1GbE Intel (Dual) Powerville Troi-Stony Dual port 1Gb Base-T
adapter – FH or LP
• 1GbE Intel (Quad) Powerville Lore-Stony Quad port 1Gb
Base-T adapter – FH or LP
• 1GbE Broadcom (Dual) 5720 Bashir Dual port 1Gb Base-T
adapter – FH or LP
• 1GbE Broadcom (Quad) 5719 Cardassia Quad port 1Gb
Base-T adapter – FH or LP
• FC8 Emulex (Dual) Saturn Wildre Dual port FC8 SFP+
adapter – FH or LP
Power supply • Single or dual 350W or 550W hot-plug redundant platinum
power supplies (100–240 V AC)
Availability • TPM/No TPM
8

Features Specications
• ECC memory, UDIMM
• Hot-plug hard drives
• Dual hot-plug redundant power supplies
Video • Integrated Matrox G200 with iDRAC9
Remote management • Lifecycle Controller 3.0
• iDRAC9 Enterprise
• VFlash (Optional)
Systems management • Dell Open Manage featuring Dell Management Console
• Lifecycle Controller 3.0
• iDRAC9 Enterprise
• VFlash (Optional)
Rack support • ReadyRails™ static rails for tool-less mounting in 4-post
racks with square or unthreaded round holes or tooled
mounting in 4-post threaded and 2-post (Telco) racks
Featured database applications • Microsoft® SQL Server® solutions
9

3
Chassis views and features
Front view of the system
Figure 1. Front view of the 8 x 2.5-inch rack system
Figure 2. Front view of the 4 x 3.5-inch rack system
Back view of the system
Figure 3. Back view of the systems
10

Internal view of the system
Figure 4. Inside the system
1. Intrusion switch 2. Optical drive
3. Power distribution board 4. PERC card
5. Expansion card riser 6. Heat sink
7. Memory module sockets 8. System board
9. Cooling fans 10. Drive backplane
Locating the information tag of your system
You can identify your system using the unique Express Service Code and Service Tag. Pull out the information tag in front of the
system to view the Express Service Code and Service Tag. Alternatively, the information may be on a sticker on the back of the
system chassis. The mini Enterprise Service Tag (EST) is found on the back of the system chassis. This information is used by Dell to
route support calls to the appropriate personnel.
11

Figure 5. Locating the information tag of your system
1. Information tag (Top view)
2. Information tag (Bottom view)
3. OpenManage Mobile (OMM) label
4. iDRAC MAC address and iDRAC secure password label
NOTE: If you have opted for secure default access to iDRAC, the iDRAC secure default password is available on the
back of the system Information tag. This label will be blank, if you have not opted for secure default access to
iDRAC, then the default user name and password are root and calvin.
5. Service Tag
12

4
Processor
The PowerEdge R340 is single-socket rack server in a dense 1U form factor designed for productivity and data intensive applications
for remote oce/branch oces featuring the Intel® Xeon® E-2100 processor family.
Processor features
The following list highlights the features of the Intel® Xeon E-2100 processor family:
• Up to six execution cores per processor
• Four DMI3 lanes
• 16 PCIe Gen 3 links capable of 8.0 GT/s
• Socket H4, LGA package (LGA1151)
• Integrated 2 channel DDR4 memory controller
• Execute Disable Bit
• Support Turbo Boost Technology 2.0
• Increases CPU frequency if operating below thermal, power, and current limits
• Intel® Virtualization Technology (Intel® VT)
NOTE: We do not support graphics with E-2100 processors, Graphics cannot be enabled on Dell servers using this
processor due to technical restrictions.
Supported processors
The following table lists the supported processors for the PowerEdge R340:
Model Speed
(GHz)
Power
(Watts)
Cores L3 Cache
(MB)
Threads Turbo Max
Memory
Speed
(MT/s)
Hyper-
threading
E-2186G 3.8 95 6 12 12 Yes 2666 Yes
E-2176G 3.7 80 6 12 12 Yes 2666 Yes
E-2174G 3.8 71 4 8 8 Yes 2666 Yes
E-2146G 3.5 80 6 12 12 Yes 2666 Yes
E-2144G 3.6 71 4 8 8 Yes 2666 Yes
E-2136 3.3 80 6 12 12 Yes 2666 Yes
E-2134 3.5 71 4 8 8 Yes 2666 Yes
E-2126G 3.3 80 6 12 6 Yes 2666 No
E-2124 3.3 71 4 8 4 Yes 2666 No
Core i3 8100 3.6 65 4 6 4 No 2666 No
Pentium
G5500
3.8 54 2 4 2 No 2666 No
13

Model Speed
(GHz)
Power
(Watts)
Cores L3 Cache
(MB)
Threads Turbo Max
Memory
Speed
(MT/s)
Hyper-
threading
Celeron
G4900
3.1 54 2 2 2 No 2666 No
Chipset
The following table shows the high level features supported by the C246 chipset implemented on the PowerEdge R340:
Chipset feature C246 R340
TXT Y Y
Node Manager Y N
ECC Y Y
FlexIO - USB3.0 - 10 (means 6 is enough) 10 3
USB 2.0 4 4
FlexIO - 8 SATA ports 8 5
FlexIO - SATA Express 3 0
FlexIO - PCIE 3.0 ports - additional
required
20 8
SPI (MB) FW image 7 UI
Intel vPRO/AMT11 Y N
Rapid Strorage technology Y N
Rapid Strorage technology enterprise Y N
Data Center Graphics N N
supported displays 3 N
Int. Gbe MAC Y N
eSPI Y N
IO Flex - ability to change SATA/
PCIE/USB
Y N
Software Guard Extensions (SGX) N Y
The following table shows the features supported by the R340 chipset:
Feature Description
DMI Interface Direct Media Interface 3 (DMI3) connects the CPU1 to the PCH.
DMI3 is similar to a four‐lane PCI Express supporting a speed of
8 GT/s per lane.
PCI Express interface PCI Express Generation 3 (PCIe Gen3) is capable of 8 GT/s bit
rate (compared to PCIe Gen 2’s 5 GT/s) per lane. Because PCIe
Gen3 uses a “scrambling” encoding instead of PCIe Gen2’s
8b/10b encoding, it is able to have double the bandwidth of
PCIe Gen2. The PCIe Gen 3 will be fully compatible with prior
14

Feature Description
generations of this technology, from software to clocking
architecture to mechanical interfaces.
AHCI The SATA controller provides hardware support for Advanced
Host Controller Interface (AHCI), a standardized programming
interface for SATA host controllers developed through a joint
industry eort. Platforms supporting AHCI may take advantage
of performance features such as port independent DMA Engines
—each device is treated as a master—and hardware-assisted
native command queuing.
AHCI denes transactions between the SATA controller and
software and enables advanced performance and usability with
SATA. Platforms supporting AHCI may take advantage of
performance features such as no master/slave designation for
SATA devices—each device is treated as a master— and
hardware assisted native command queuing. AHCI also provides
usability enhancements such as hot-plug and advanced power
management. AHCI requires appropriate software support (such
as, an AHCI driver) and for some features, hardware support in
the SATA device or additional platform hardware. Visit the Intel
web site for current information on the AHCI specication.
Low Pin Count Interface (LPC) The Low Pin Count (LPC) Interface Specication for legacy I/O
has facilitated the industry's transition toward ISA-less systems.
The key enhancements to the 1.1 revision of the LPC Interface
Specication is the inclusion of Firmware Memory cycles and
addition of multibyte read capability.
The LPC Interface allows the legacy I/O motherboard
components, typically integrated in a Super I/O chip, to migrate
from the ISA/X-bus to the LPC Interface, while retaining full
software compatibility. The LPC Specication oers several key
advantages over ISA/X-bus, such as reduced pin count for
easier, more cost-eective design. The LPC Interface
Specication is software transparent for I/O functions and
compatible with existing peripheral devices and applications.
The LPC Interface Specication describes memory, I/O and
DMA transactions. Unlike ISA, which runs at 8MHz, it will use
the PCI 33MHz clock and will be compatible with more
advanced silicon processes. Mobile designers will also benet
from the reduced pin count because it uses less space and
power and is more thermal ecient.
Serial Peripheral Interface (SPI) The interface implements 3 Chip Select signals (CS#), allowing
up to two ash devices and one TPM device to be connected to
the PCH. The CS0# and CS1# are used for ash devices and
CS2# is dedicated to TPM.
Advanced Programmable Interrupt Controller (APIC) The chipset contains a Motorola MC146818B-compatible real-
time clock with 256 bytes of battery-backed RAM. The Real-
Time Clock (RTC) performs two key functions—keeping track
of the time of day and storing system data, even when the
system is powered down. The RTC operates on a 32.768-KHz
crystal and a 3V battery.
GPIO GPIO Serial Expander (GSX) is the capability provided by the
chipset to expand the GPIOs on a platform that needs more
15

Feature Description
GPIOs than the ones provided by the PCH. The solution requires
external shift register discrete components
System Management Bus (SMBus 2.0) The chipset provides a System Management Bus (SMBus) 2.0
host controller as well as an SMBus Slave Interface. The chipset
is also capable of operating in a mode in which it can
communicate with I2C compatible devices. The host SMBus
controller supports up to 100-KHz clock speed.
JTAG Boundary-Scan This section contains information regarding the chipset
testability signals that provides access to JTAG, run control,
system control, and observation resources. PCH JTAG (TAP)
ports are compatible with the IEEE Standard Test Access Port
and Boundary Scan Architecture 1149.1 and 1149.6 Specication,
as detailed per device in each BSDL le. JTAG Pin denitions are
from IEEE Standard Test Access Port and Boundary-Scan.
16

5
Memory
The Integrated Memory Controller (IMC) supports DDR4/-RS protocols with two independent, 64-bit wide channels. The maximum
system population at launch will be 64GB (4 DIMM slots x16 GB DDR4 U-DIMM).
Supported memory
DDR4 DIMM types include Un-buered DIMMs (UDIMM ECC). Operational memory speeds of 2666MT/s, 2400MT/s, and
2133MT/s are supported but depends on DIMM capability. Standard DIMM voltage of 1.2v which supports speeds up to 2666MT/s
at launch.
System is capable to support up to two DR or SR DIMMs per channel.
With UDIMM ECC, there is no buering so each DRAM chip is 1 load, with a dual rank x2 UDIMM having 64 loads on address and
command signals and 8 loads on the data signals.
The following table list the supported memory DIMMs for the PowerEdge R340:
NOTE: The R340 can support mixed DIMM congurations with two dierent DIMM capabilities.
DIMM PN MOD PN DIMM
Speed
DIMM
Type
DIMM
Capacity
(GB)
Ranks per
DIMM
Data
Width
SDDC
Support
DIMM
Volts
Comments
D715X 1DV5N 2666 UDIMM 8 1 x8 Advanced
ECC
1.2
1T3YJ JTVWT 2666 UDIMM 8 1 x8 Advanced
ECC
1.2 BCC
Version
VDFYD TJKP0 2666 UDIMM 16 1 x8 Advanced
ECC
1.2
XY4YR TH0V5 2666 UDIMM 16 1 x8 Advanced
ECC
1.2 BCC
Version
FPFP6 12YG7 2400 UDIMM 4 1 x8 Advanced
ECC
1.2
MT9MY 7YR44 2400 UDIMM 8 1 x8 Advanced
ECC
1.2
V7CCK 26YCJ 2400 UDIMM 8 1 x8 Advanced
ECC
1.2 BCC
Version
2TX5N Y2RYH 2400 UDIMM 16 2 x8 Advanced
ECC
1.2
F6RWY 4F1W8 2400 UDIMM 16 2 x8 Advanced
ECC
1.2 BCC
Version
N8MT5 0WNKM 2133 UDIMM 4 1 x8 Advanced
ECC
1.2
17

DIMM PN MOD PN DIMM
Speed
DIMM
Type
DIMM
Capacity
(GB)
Ranks per
DIMM
Data
Width
SDDC
Support
DIMM
Volts
Comments
FD7GV DM0YK 2133 UDIMM 4 1 x8 Advanced
ECC
1.2 BCC
Version
H5P71 K4KPT 2133 UDIMM 8 2 x8 Advanced
ECC
1.2
RXGPP PKTX9 2133 UDIMM 8 1 x8 Advanced
ECC
1.2 BCC
Version
7XRW4 14FH6 2133 UDIMM 16 2 x8 Advanced
ECC
1.2
FXGXT WTPK0 2133 UDIMM 16 2 x8 Advanced
ECC
1.2 BCC
Version
Memory speed
The system will run all memory on all CPUs and channels at the same speed and voltage. By default the system will run at the
highest speed for the lowest voltage of the worst case channel DIMM conguration. Operating speed of the memory is determined
by:
• Supported speed of the DIMMs
• DIMM conguration on any channel
• Max speed supported by the CPU
• Speed requested by user in BIOS setup screen
• Operating voltage of the system. Determined by:
– Voltages supported by the DIMMs.
– Voltages supported by the platform (R340 does not support 1.25V)
– Voltage requested by user in BIOS setup screen.
The following table shows the memory populations and the system speed frequencies:
Table 3. Memory populations and system speed
DIMM
Type
DIMM Ranking Capacity DIMM Rated voltage 1 DIMM per channel 2 DIMMs per channel
UDIMM 1R/2R 8GB, and 16GB DDR4 (1.2V) 2666 2666
18

6
Storage
The PowerEdge R340 provides various storage options which includes dierent drive types, internal and external storage controllers,
and dierent chassis for dierent number of drive supports. The PowerEdge R340 supports the following drive-bay options:
• 4x 3.5" hot-plug drive option
• 8x 2.5" hot-plug drive option
Supported drives
The PowerEdge R340 system supports SAS, SATA, Nearline SAS drives/SSD drives.
Table 4. Supported Drives - SAS and SATA or SSD
Form
Factor Type Speed Rotational Speed Capacities
2.5-inch
SATA 6 Gbps 7.2K 1TB, 2TB
SAS 12
Gbps
7.2K 1TB, 2TB,
10K 600GB, 1.2TB, 1.8TB, 2.4TB
15K 300GB, 600GB, 900GB
SSD 6 Gbps 512n 480GB, 960GB, 1.92TB, 3.84TB, 200GB, 240GB, 400GB, 800GB, 960GB, 1.92TB,
120GB, 240GB
3.5-inch SATA 6 Gbps 7.2K 1TB, 2TB. 4TB, 8TB, 10TB, 12TB, 14TB
SAS 12 gbps 7.2K 2TB, 4TB, 8TB, 10TB,12TB
Storage controller specications
The PowerEdge R340 system supports:
• Internal storage controller cards: PERC H330, H730P, S140, HBA330 and Boot Optimized Storage Subsystem (BOSS) modules.
• External storage controller cards: 12 Gbps SAS HBA.
Optical drive
One ultra-slim type, 9.5mm, ODD is supported on the PowerEdge R340 via the system board embedded SATA. The R340 supports
both the ultra-slim SATA DVD-ROM and DVD+/-RW.
If the drive is not ordered with the system, a blank should be installed in its place. ODD cable is 100% included in the chassis even if
no ODD is ordered.
Tape drive
No internal tape drive support due to the dense rack form factor. External tape drive is supported via the 12 Gbps SAS HBA. The list
below are the supported external tape drives for the PowerEdge R340:
19

• LTO-6 SAS
• LTO-7 SAS
• LTO-8 SAS
Internal Dual SD Module
The Internal Dual SD Module (IDSDM) is optional. The IDSDM contains two SD ports directly on the motherboard. The modules are
redundant. Supported iDSDM microSD cards capacity are 8/16/32/64GB
The IDSDM card provides the following functions:
• Dual SD interface is maintained in a mirrored conguration (primary and secondary SD)
• Provides full RAID1 functionality
• Dual SD cards are not required; the module can operate with only one card but will provide no redundancy
• Enables support for Secure Digital eXtended Capacity (SDXC) cards
• USB interface to host system
• I2C interface to host system and onboard EEPROM for out-of-band status reporting
• Onboard LEDs show status of each SD card
• A BIOS Setup Redundancy setting supports Mirror Mode or Disabled
Boot Optimized Storage Subsystem (BOSS)
BOSS is oered as a means of booting the PowerEdge R340 servers to a full OS when:
• A solution such as IDSDM may be desired, but the target OS for BOSS is a full OS (not just a hypervisor)
• The user needs to maximize their number of drive bays
BOSS cards take up a PCIe slot and are not hot-plug capable. 1x or 2x 240GB modules are available. Dual (2x) module congs can be
set up for either RAID 1 or No RAID. Single (1x) module congs can only be set up in a No RAID cong.
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