Service Manual
 
2
Table of Contents 
CHAPTER 1- PRECAUTIONS & SAFETY NOTICES.....................................................................................................................0
H3
1. SAFETY PRECAUTIONS .................................................................................................................................................... 1
H3
2. PRODUCT SAFETY NOTICE.............................................................................................................................................. 2
H3
3. SERVICE NOTES.................................................................................................................................................................. 3
H3
CHAPTER 2- SERVICE TOOLS & EQUIPMENT REQUIRED .....................................................................................................4
H4
CHAPTER 3- CIRCUIT THEORY ......................................................................................................................................................5
H5
1. BLOCK DIAGRAM ................................................................................................................................................................... 6
H5
2. ELECTRONIC CIRCUIT THEORY ............................................................................................................................................... 7
H5
3. FACTORY PRESET TIMING TABLE ................................................................................................................................ 8
H11 
4. POWER ON/OFF SEQUENCY .................................................................................................................................................. 9
H11 
5. D-SUB CONNECTOR PIN ASSIGNMENT................................................................................................................................. 12 
6. AC OUTLET PIN ASSIGNMENT .............................................................................................................................................. 12 
7. INNER CONNECTOR PIN ASSIGNMENT................................................................................................................................... 10
H13 
8. KEY PARTS PIN ASSIGNMENTS .............................................................................................................................................. 14 
CHAPTER 4- DISASSEMBLY &ASSEMBLY.................................................................................................................................11
H18 
1. EXPLODED DIAGRAM ........................................................................................................................................................... 12
H18 
2. E190SF DISASSEMBLY BLOCK.............................................................................................................................................. 19 
3. ASSEMBLY BLOCK ................................................................................................................................................................ 20 
CHAPTER 5- TESTAND ADJUSTMENT........................................................................................................................................ 21 
1. FUNCTION KEY DEFINITIONS ................................................................................................................................................ 13
H21 
2. OSD CONTROL ...................................................................................................................................錯誤!尚未定義書籤。 
3. FACTORY MODE INTRODUCTION........................................................................................................................................... 14
H22 
4. BURN-IN PATTERN................................................................................................................................................................. 15
H22 
5. AUTO COLOR BALANCE (AUTOMATICALLY CALIBRATE CHIP ADC PARAMETER BY USING CHIP INTERNAL DAC.)................ 16
H22 
6. EDID (REWRITE EDID DATA TO EEPROM).........................................................................................................................17
H23 
7. UPLOAD FIRMWARE TO MCU VIA VGA CABLE .................................................................................................................... 18
H23 
8. AFTER REPAIR,TO ENSURE THE QUALITY YOU SHOULD DO THE FOLLOWING TEST AND ADJUSTMENT. ................................... 19
H25 
CHAPTER 6- TROUBLE SHOOTING..............................................................................................................................................20
H25 
1. COMMON ACKNOWLEDGE .................................................................................................................................................... 21
H25 
2. NO POWER &POWER LED OFF............................................................................................................................................ 22
H26 
3. POWER LED AMBER............................................................................................................................................................. 23
H26 
4. BACKLIGHT CAN’T BE TURNED ON ........................................................................................................................................ 27 
5. NO PICTURE &BACKLIGHT ON ............................................................................................................................................. 24
H29 
6. AT 32-GRAY SCALE PATTERN,COLOR LOST IN SOME SCALE ................................................................................................... 29 
7. DIAGNOSTIC TEST PAT T E R N .................................................................................................................................................. 29 
CHAPTER 7- RECOMMENDED PART LIST ................................................................................................................................. 32 
ATTACHMENT 1- BILLOF MATERIAL......................................................................................................................................... 25
H34 
ATTACHMENT 2- SCHEMATIC.......................................................................................................................................................26
H44 
ATTACHMENT 3- PCB LAYOUT..................................................................................................................................................... 54