Dell EMC PowerEdge R640 User manual

PowerEdge R640
Ideal balance of density and scalability
Get scalable computing and storage in a 1U, 2-socket
platform with an ideal mix of performance, cost and
density for most data centers.
The following documentation is designed as both an instructional aid and
online reference material for the Dell EMC PowerEdge R640 rack
server. The material introduces new technologies and features specic to
the PowerEdge R640 in an effort to better prepare technicians to provide
outstanding support to our customers.
TECHNICAL GUIDE

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
Copyright ©2017 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other
trademarks may be trademarks of their respective owners.
2017 - 06
Rev. A00

Contents
1 System overview............................................................................................................................................5
Introduction.........................................................................................................................................................................5
New technologies...............................................................................................................................................................5
2 System features.............................................................................................................................................7
Product comparison...........................................................................................................................................................7
Technical specications..................................................................................................................................................... 9
3 Chassis views and features........................................................................................................................... 11
Front panel view and features......................................................................................................................................... 11
Back panel view and features.......................................................................................................................................... 11
Internal chassis view.........................................................................................................................................................12
Security features...............................................................................................................................................................13
4 Processors................................................................................................................................................... 15
Processor features........................................................................................................................................................... 15
Supported processors......................................................................................................................................................15
Processor congurationsSingle CPU congurationProcessor installation...........................................................17
Chipset............................................................................................................................................................................... 17
5 Memory........................................................................................................................................................19
DIMMs supported.............................................................................................................................................................19
Memory congurations................................................................................................................................................... 20
Memory population guidelines..................................................................................................................................20
Memory RAS features...............................................................................................................................................20
6 Storage........................................................................................................................................................22
Storage controllers...........................................................................................................................................................22
Supported drives..............................................................................................................................................................22
External storage............................................................................................................................................................... 23
IDSDM/vFlash card......................................................................................................................................................... 23
Optical drives....................................................................................................................................................................24
Tape drives........................................................................................................................................................................ 24
7 Networking and PCIe...................................................................................................................................25
PCIe expansion cards...................................................................................................................................................... 25
PCIe expansion card riser congurations................................................................................................................25
PCIe expansion cards................................................................................................................................................ 25
8 Power, Thermal, and Acoustics.................................................................................................................... 27
Power consumption and energy eciency................................................................................................................... 27
Thermal and Acoustics....................................................................................................................................................28
Contents 3

Power supply units...........................................................................................................................................................28
Acoustical design............................................................................................................................................................. 28
9 Rack rails.....................................................................................................................................................30
10 Dell EMC OpenManage systems management........................................................................................... 32
OpenManage systems management.............................................................................................................................33
iDRAC Lifecycle controller.............................................................................................................................................. 33
iDRAC features and comparison.............................................................................................................................. 33
Agent-free management.................................................................................................................................................38
Agent-based management............................................................................................................................................. 38
Dell EMC consoles........................................................................................................................................................... 38
OpenManage systems management tools, utilities and protocols.............................................................................38
Integration with third-party consoles............................................................................................................................ 39
OpenManage connections with third-party consoles................................................................................................. 39
Dell EMC server management operations.................................................................................................................... 39
11 Appendix A. Additional specications.......................................................................................................... 41
Power supply specications............................................................................................................................................ 41
Chassis dimensions..........................................................................................................................................................42
Environmental specications.......................................................................................................................................... 43
Video specications......................................................................................................................................................... 43
12 Appendix B. Standards compliance.............................................................................................................44
13 Appendix C Additional resources................................................................................................................ 45
14 Appendix D. Support and Deployment Services .........................................................................................46
Server Deployment Services.......................................................................................................................................... 46
Remote Consulting Services...........................................................................................................................................47
Data Migration Service....................................................................................................................................................47
ProSupport........................................................................................................................................................................47
ProSupport Plus (for business-critical servers)........................................................................................................... 47
ProSupport Flex for Data Center................................................................................................................................... 47
ProSupport Enterprise Suite...........................................................................................................................................48
Additional professional services......................................................................................................................................49
Dell EMC Education Services.........................................................................................................................................49
Dell EMC Global Infrastructure Consulting Services................................................................................................... 49
Dell EMC managed services...........................................................................................................................................49
4Contents

System overview
The Dell EMC PowerEdge R640 is the ideal dual-socket, 1U platform for dense scale-out data center computing. The R640 combines
density, performance and scalability to optimize application performance and data center density.
Introduction
The PowerEdge R640 is a general purpose platform expandable up to 1.5TB of memory, up to twelve 2.5 inch drives, and exible I/O
options. The R640 can handle demanding workloads such as virtualization, dense private cloud, High Performance Computing (HPC) and
software-dened storage.
The R640 features:
• Intel Xeon Scalable Processor product family (with up to 28 cores and two threads per core)
• Up to six DDR4 memory channels with two DIMMs per channel per CPU and 24 DIMMs (supports DDR4 RDIMM/LRDIMM/NVDIMM-
N)
• PCI Express® (PCIe) 3.0 enabled expansion slots (with up to 48 lanes per CPU)
• Networking technologies, such as Ethernet, Inniband, OCP, OPA
New technologies
The following are the new technologies featured on the PowerEdge R640:
Table 1. New technologies
New technology Detailed description
Intel Xeon Scalable Processor The processor product family has embedded PCIe lanes for
improved I/O performance. For details, see the Processor section.
Intel C620 series chipset The R640 system uses the Intel Lewisburg chip. It is a 2 chip
platform - CPU and PCH.
2666 MT/s DDR4 memory The Intel Xeon Scalable Processor product family that supports
2666 MT/s memory and twenty-four 288-pin DIMMs.
The R640 system supports:
• Two DIMMs per channel for single‐rank and/or dual‐rank
DIMMs
• One or two DIMMs per channel for quad‐rank DIMMs
For details, see the Memory section.
iDRAC9 with Lifecycle Controller The new embedded systems management solution for the Dell
EMC systems features hardware and rmware inventory and
alerting, data center level power monitoring, and faster
performance.
For details, see the Dell EMC OpenManage systems management
section.
1
System overview 5

New technology Detailed description
2.5-inch PCIe SSD Supports up to eight CPU Direct Attach PCIe SSD
PERC S140 This new software RAID solution supports:
• RAID 0, 1, 5, and Non-RAID
• SATA HDD and SSD devices only
• Up to eight 2.5-inch hot-plug SATA HDDs or SSDs
• Software RAID is through the Intel Lewisburg chipset
• Software RAID solution is supported on Linux and Windows
For details, see the Storage section.
LCD bezel The PowerEdge R640 LCD control panel is embedded in the front
bezel for easy access and management.
6 System overview

System features
Compared to previous generations, the PowerEdge R640 oers faster processing power and advanced system management.
The R640 system is a powerhouse 2S/1U rack system, which emphasizes performance and reliability in areas such as virtualization, power,
thermal and systems management, and usability. It is designed for mid-size to large data centers that require high memory capacity and
performance.
The R640 system consists of the planar subsystem with control panel, SAS backplane, storage card, riser card, VGA port, Storage
Enclosure Processor (SEP) (4 x HDD back plane, eight HDD back plane and 2 x rear back plane), expander—10 HDD system. It is a two-
chip platform (CPU and PCH) because this family of processors includes an Integrated Memory Controller (IMC) and Integrated I/O (IIO)
(such as PCI Express and DMI3) on a single silicon die.
Topics:
• Product comparison
• Technical specications
Product comparison
Table 2. Feature comparison
Feature PowerEdge R640 PowerEdge R630
Processors Intel Xeon Scalable Processor Family Intel® Xeon processor E5-2600 v3
(Haswell) or E5- 2600 v4 (Broadwell)
Chipset Intel C620 Intel C610
Memory 24x DDR4 RDIMM/LR-DIMM
12x NVDIMM + 12 x RDIMM
24x DDR4 RDIMM/LR-DIMM
Chassis Storage design modularity
• 4 Hard Drive Chassis
• 8 Hard Drive Chassis
• 10 Hard Drive Chassis
Three individual chassis for three SKU
• 8 Hard Drive Chassis
• 10 Hard Drive Chassis
• 24 Hard Drive Chassis
Disk Drives • Front drive bays: Up to 10 x 2.5 inch
SAS/SATA (HDD/SSD) with up to 8
NVMe SSD 58TB (maximum) or up to 4
x 3.5 inch SAS/SATA HDD 40TB
(maximum)
• Rear drive bays: Up to 2 x 2.5 inch SAS/
SATA (HDD/SSD), NVMe SSD 12TB
(maximum)
• 8 x 2.5 inch SAS/SATA or SATA only
• 10 x2.5 inch SAS/SATA or SAS/SATA/
NVMe (NVMe up to 4)
• 24 x 1.8 inch SATA (single PERC or dual
PERCs)
PCIe SSD Up to 8x CPU Direct Attach PCIe SSD Up to 4x PCIe SSD from PCIe bridge card
2
System features 7

Feature PowerEdge R640 PowerEdge R630
RAID Controller S140, HBA330, H330, H730, H730P, H740P,
H840P, 12Gbps SAS HBA(External)
S130, H330, H730, H730P, H830 (External)
Support for 2 internal RAID controllers for
x24 SSD conguration only
LCD Module LCD module option in bezel LCD by default in base x8 chassis, not
available on x10 and x24 chassis.
Backplane • 8 x 2.5 inch SATA/SAS
• 4 x 3.5 inch SATA/SAS
• 8 x 2.5 inch SAS/SATA
• 10 x 2.5 inch SAS/SATA
• 10 x 2.5 inch SAS/SATA/PCIe SSD
• 24 x 1.8 inch SATA
Riser Up to 2 riser connectors (left/right) Up to 3 riser connectors (left/center/right)
PCIe Slots Up to 3x PCIe Gen3 (x16/x16/x16) Up to 3x PCIe Gen3 (x16/x8/x16)
Embedded NIC • Broadcom 1G 4 x RJ45
• Broadcom 2 x 1G RJ45 + 2 x 10G SFP+
• Broadcom 2x 1G RJ45 + 2 x 10G RJ45
• Intel 1G 4 x RJ45
• Intel 2 x 1G RJ45 + 2 x 10G RJ45
• Broadcom 5730 Base-T
• Intel 1350 Base-T
• Broadcom 57800 SFP+
• Broadcom 57800 Base-T
• Intel X540 Base-T
Power Supplies • 495 W AC Platinum
• 750 W AC Platinum
• 750 W AC Titanium
• 750 W Mixed Mode HVDC Gold (for
China only)
• 1100 W DC
• 1100 W Mixed Mode HVDC Platinum (for
China and Japan only)
• 1100 W AC Platinum
• 1600 W Platinum
• 495 W AC
• 750 W AC
• 1100 W AC
• 1100 W DC
Remote Management iDRAC9 iDRAC8
TPM TPM China, TPM1.2, TPM2.0 TPM China, TPM1.2, TPM2.0
USB 3.0 Hub board Extra USB3.0 connector to front plane None
iDRAC Direct front port Micro USB USB type A
Fan Up to eight FAN support. (1X6 type) Up to seven FAN support (2X3 type)
IDSDM Module Internal Dual SD Module (IDSDM) and vFlash Internal Dual SD Module (IDSDM)
BOSS Module M.2 SATA interface None
PERC Mini-PERC 10 Mini-PERC 9
NVDIMM Battery External 12 V power bank for NVDIMM used None
ODD/TBU ODD via NPIO TBU and ODD via 7-pin connectors
On board PCH SATA Connectors 4x NPIOs 2x Mini SAS_HDs
8 System features

Technical specications
Table 3. Technical specications
Feature PowerEdge R640 technical specication
Form factor 1U rack
Processor Intel Xeon Processor Scalable Family
Processor sockets 2 sockets
Internal interconnect Up to 3 Intel Ultra Path Interconnect (Intel® UPI); up to 11.2 GT/s
Chipset Intel C620 series Chipset
Memory Up to 1536 GB—24 DIMM slots: 8 GB, 16 GB, 32 GB, 64 GB DDR4 up to 2666 MT/s
Supports DDR4 RDIMM/LRDIMM/NVDIMM-N
I/O slots Up to 3 x PCIeGen slots plus a dedicated PERC and rNDC slot
RAID controller Internal controllers: PERC S140 (SW RAID SATA), PERC H330, PERC H730, PERC H730P,
PERC H740P
Internal HBA (RAID): PERC HBA330
External HBA—non-RAID: 12 Gb/s SAS HBA
Hard drives • 4 x 3.5 inch SAS/SATA
• 8 x 2.5 inch SAS/SATA
• 8 x 2.5 inch SATA only—PCH SATA
• 10 x 2.5 inch SAS/SATA
Embedded NIC Supports four Network Interface Controller (NIC) ports on the back panel, which are
available in the following congurations:
• Broadcom 1G 4 x RJ45
• Broadcom 2 x 1G RJ45 + 2 x 10G SFP+
• Broadcom 2 x 1G RJ45 + 2 x 10G RJ45
• Intel 1G 4 x RJ45
• Intel 2 x 1G RJ45 + 2 x 10G RJ45
NOTE: You can install up to six PCIe add-on NIC cards.
Power supply Dual, hot-plug, redundant, and high-eciency power supply units:
• 495 W, 750 W, 1100 W, and 1600 W Platinum
• 750 W Titanium
• 1100 W - (48 - 60) VDC
• 750 W 240 HVDC
Availability • Cluster support
• ECC memory
• Hot-plug hard drives
• Hot-plug, redundant cooling
System features 9

Feature PowerEdge R640 technical specication
• Hot-plug, redundant power
• IDSDM Module
• Single Device Data Correction (SDDC)
• Spare Rank
• Support for high availability, and virtualization
• Proactive systems management alerts
Operating systems • Microsoft Windows system 2012 R2
• Microsoft Windows system 2016
• Novell SUSE Linux Enterprise System 11 SP4
• Novell SUSE Linux Enterprise System 12 SP1
• Red Hat Enterprise Linux 6.8
• Red Hat Enterprise Linux 7.2
• VMware ESX
Virtualization options:
• Microsoft Windows system 2012 R2 with Hyper-V
• Citrix XenServer 6.5
• VMware vSphere ESXi 2016
For more information on the specic versions and additions, visit Dell.com/OSsupport.
Systems management Systems management: IPMI 2.0 compliant; Dell EMC OpenManage Essentials; Dell EMC
OpenManage Mobile; Dell EMC OpenManage Power Center
Remote management: iDRAC9 with Lifecycle Controller, iDRAC9 Express (default), iDRAC9
Enterprise (upgrade); 8 GB vFlash media (upgrade), 16 GB vFlash media (upgrade) iDRAC
Quick Sync
Dell EMC OpenManage Integrations: Dell EMC OpenManage Integration Suite for
Microsoft® System Center, Dell EMC OpenManage Integration for VMware® vCenter™
Dell EMC OpenManage Connections: HP Operations Manager, IBM Tivoli® Netcool®, and
CA Network and Systems Management, Dell EMC OpenManage Plug-in for Oracle®
Database Manager
Dimensions and weight • Height: 42.8 mm—1.68 inches
• Width: 434.0 mm—17.08 inches
• Depth: 70.47 mm, 27.74 inch, for x 8
• Depth: 75.55 mm, 29.74 inch, for x4/x10
Recommended support Dell EMC ProSupport Plus for critical systems or Dell EMC ProSupport for premium hardware
and software support for your PowerEdge solution. Consulting and deployment oerings are
also available.
Contact your Dell EMC representative for more information. Availability and terms of Dell
EMC Services vary by region. For more information, visit Dell EMC.com/ ServiceDescriptions.
10 System features

Chassis views and features
The PowerEdge R640 is a two socket, 1U rack system that is available in three dierent chassis congurations:
• Four hard drive chassis
• Eight hard drive chassis
• 10 hard drive chassis
Topics:
• Front panel view and features
• Back panel view and features
• Internal chassis view
• Security features
Front panel view and features
The PowerEdge R640 provides three chassis options: 4 x 3.5-inch, 8 x 2.5-inch, or 10 x 2.5-inch drives.
Figure 1. Front view 4 x 3.5-inch drive chassis
Figure 2. Front view 8 x 2.5-inch drive chassis
Figure 3. Front view 10 x 2.5-inch drive chassis
Back panel view and features
The back panel of a PowerEdge system contains access to I/O connectors for both embedded and add-in devices, including networking,
video, serial, USB, system ID, and system management access ports. Most add-in PCI cards are accessible through the back panel. It is also
the default location for power supply units (PSU), including the points for AC/DC connections.
The PowerEdge R640 system provides four backplane options:
• 4 x 3.5 inch SATA/SAS
3
Chassis views and features 11

• 8 x 2.5 inch SATA/SAS
The images below illustrate the types of backplanes supported on PowerEdge R640:
Figure 4. Back panel view of 2 x 2.5 inch hard drives with 1 PCIe expansion slot
Figure 5. Back panel view of system with 3 PCIe expansion slots
Figure 6. Back panel view of system with 2 PCIe expansion slots
Internal chassis view
The chassis design of the PowerEdge R640 is optimized for easy access to components and for ecient cooling. The PowerEdge R640
supports up to 24 DIMMs, two processors, hot-plug redundant fans, system board and hard drive bays, and many other components and
features. For more system views, see the Dell EMC PowerEdge R640 Installation and Service Manual at Dell.com/Support/Manuals.
Figure 7. Internal chassis view - 1 PCIe expansion riser
12 Chassis views and features

Figure 8. Internal chassis view - 2 PCIe expansion risers
Figure 9. Internal chassis view - 3 PCIe expansion risers
Security features
The latest generation of PowerEdge servers has the features listed in the table to help ensure the security of your data center.
Chassis views and features 13

Table 4. Security features
Security feature Description
Cover latch A tooled latch is integrated in the side cover to secure it to the rack chassis.
Bezel A standard bezel is an optional metal bezel mounted to the chassis front and shows the Dell EMC ID. A lock
on the bezel protects unauthorized access to hard drives. NFC bezel enables the iDRAC QuickSync
management function for managing the server from the front using an NFC-capable device and the free Dell
EMC OpenManage Mobile App (currently Android only). Available only from the factory and not supported
after purchase of sale.
TPM The Trusted Platform Module (TPM) is used to generate/store keys, protect/authenticate passwords, and
create/store digital certicates. TPM 1.2 is supported.
Power-o security BIOS has the ability to disable the power button function.
14 Chassis views and features

Processors
The PowerEdge R640 server features the exceptional performance, value, and power eciency of the Intel Xeon Scalable Processor.
These processors provide high performance no matter what your constraint—oor space, power, or budget—and on workloads that range
from the most complicated scientic exploration to crucial web-serving and infrastructure applications. In addition to providing raw
performance gains, improved I/O is also made possible with Intel Integrated I/O, which can reduce latency by adding more lanes and
doubling bandwidth. This helps to reduce network and storage bottlenecks, which improves the processor performance capabilities.
Topics:
• Processor features
• Supported processors
• Chipset
Processor features
The new processor family is the next generation core architecture with improved Instructions per Cycle (IPC) and other architectural
improvements.
The Intel Xeon Scalable Processor family not only adds new features, but also improves upon many features of the predecessor Intel Xeon
processor E5-2600 v4 product family, including:
• Virtual address space of 48 bits and a physical address space of 46 bits
• Intel Hyper-Threading Technology (Intel® HT Technology) when enabled allow each core to support two threads
• First-Level Cache (FLC) 64 KB total. The FLC is composed of a 32 KB ICU (Instruction Cache) and 32 KB DCU—Data Cache
• MB MidLevel Cache (MLC) per core (noninclusive with the LLC)
• Intel® Advanced Vector Extensions 512 (Intel® AVX-512) with a single AVX512 fused multiply-add (FMA) execution units. Processors
which support Advanced RAS enable a second FMA execution unit.
Supported processors
Table 5. Supported processors for PowerEdge R640
Model Intel SKU SKU type Speed(GH
z)
Cache(M
B)
QPI—
GT/s
Max
Memory
Speed—
MT/s
Cores Turbo TDP
Intel Xeon Scalable
Processor
3106 Bronze 1.7 24.75 9.6 2133 8 No Turbo 85 W
Intel Xeon Scalable
Processor
3104 Bronze 1.7 19.25 9.6 2133 6 No Turbo 85 W
Intel Xeon Scalable
Processor
6148 Gold 2.4 27.5 10.4 2400 20 Turbo 150 W
Intel Xeon Scalable
Processor
6154 Gold 3 24.75 10.4 2400 18 Turbo 200 W
4
Processors 15

Model Intel SKU SKU type Speed(GH
z)
Cache(M
B)
QPI—
GT/s
Max
Memory
Speed—
MT/s
Cores Turbo TDP
Intel Xeon Scalable
Processor
6150 Gold 2.7 24.75 10.4 2400 18 Turbo 165 W
Intel Xeon Scalable
Processor
6142 Gold 2.6 22 10.4 2400 16 Turbo 150 W
Intel Xeon Scalable
Processor
6132 Gold 2.6 19.25 10.4 2400 14 Turbo 140 W
Intel Xeon Scalable
Processor
6136 Gold 3 24.75 10.4 2400 12 Turbo 150 W
Intel Xeon Scalable
Processor
6126 Gold 2.6 19.25 10.4 2400 12 Turbo 125 W
Intel Xeon Scalable
Processor
6134 Gold 3.2 24.75 10.4 2400 8 Turbo 130 W
Intel Xeon Scalable
Processor
6128 Gold 3.4 19.25 10.4 2400 6 Turbo 115 W
Intel Xeon Scalable
Processor
5122 Gold 3.6 16.5 10.4 2400 4 Turbo 105 W
Intel Xeon Scalable
Processor
6152 Gold 2.1 30.25 10.4 2400 22 Turbo 140 W
Intel Xeon Scalable
Processor
6138 Gold 2 27.5 10.4 2400 20 Turbo 125 W
Intel Xeon Scalable
Processor
6140 Gold 2.3 24.75 10.4 2400 18 Turbo 140 W
Intel Xeon Scalable
Processor
6130 Gold 2.1 22 10.4 2400 16 Turbo 125 W
Intel Xeon Scalable
Processor
5120 Gold 2.2 19.25 10.4 2400 14 Turbo 105 W
Intel Xeon Scalable
Processor
5118 Gold 2.3 16.5 10.4 2400 12 Turbo 105 W
Intel Xeon Scalable
Processor
5115 Gold 2.4 13.75 10.4 2400 10 Turbo 85 W
Intel Xeon Scalable
Processor
8180 Platinum 2.5 38.5 10.4 2666 28 Turbo 205 W
Intel Xeon Scalable
Processor
8168 Platinum 2.7 33 10.4 2666 24 Turbo 205 W
Intel Xeon Scalable
Processor
8158 Platinum 3 24.75 10.4 2666 12 Turbo 150 W
Intel Xeon Scalable
Processor
8156 Platinum 3.6 16.5 10.4 2666 4 Turbo 105 W
Intel Xeon Scalable
Processor
8176 Platinum 2.1 22 10.4 2666 16 Turbo 120 W
16 Processors

Model Intel SKU SKU type Speed(GH
z)
Cache(M
B)
QPI—
GT/s
Max
Memory
Speed—
MT/s
Cores Turbo TDP
Intel Xeon Scalable
Processor
8170 Platinum 2.1 35.75 10.4 2666 26 Turbo 165 W
Intel Xeon Scalable
Processor
8164 Platinum 2 35.75 10.4 2666 26 Turbo 150 W
Intel Xeon Scalable
Processor
8160 Platinum 2.1 33 10.4 2666 24 Turbo 150 W
Intel Xeon Scalable
Processor
8153 Platinum 2 22 10.4 2666 16 Turbo 125 W
Intel Xeon Scalable
Processor
4116 Silver 2.1 16.5 9.6 2400 12 Turbo 85 W
Intel Xeon Scalable
Processor
4114 Silver 2.2 13.75 9.6 2400 10 Turbo 85 W
Intel Xeon Scalable
Processor
4112 Silver 2.6 16.5 9.6 2400 4 Turbo 85 W
Intel Xeon Scalable
Processor
4110 Silver 2.1 24.75 9.6 2400 8 Turbo 85 W
Intel Xeon Scalable
Processor
4108 Silver 1.8 24.75 9.6 2400 8 Turbo 85 W
Processor congurations
The PowerEdge R640 supports up to two processors and up to 28 cores per processor.
Single CPU conguration
The PowerEdge R640 functions normally if there only a single processor placed in the CPU1 socket. However, CPU and memory blanks
associated with CPU2 are required to be populated to maintain thermal eciency. The system will not boot if only CPU2 socket is
populated. With single CPU conguration, Riser 1 (1A/1B/1C/1D) card and Riser 2B is operational.
Processor installation
For processor installation instructions, see the Dell EMC PowerEdge R640 Installation and Service Manual at Dell.com/Support/Manuals.
Chipset
The PowerEdge R640 systems use the Intel C620 chipset, which provides extensive I/O support.
The functions and capabilities of the Intel C620 chipset include:
• ACPI Power Management Logic Support, Revision 4.0a
• PCI Express Base Specication, Revision 3.0
• Integrated Serial ATA host controller, supports data transfer rates of up to 6 GB/s on all ports
Processors 17

• xHCI USB controller with SuperSpeed USB 3.0 ports
• Direct Media Interface
• Enhanced Serial Peripheral Interface
• Flexible I/O - Allows some high-speed I/O signals to be congured as the PCIe root ports, the PCIe uplink for use with certain PCH,
SATA (and sSATA), or USB 3.0.
• General Purpose Input Output (GPIO)
• Low Pin Count interface, interrupt controller, and timer functions
• System Management Bus Specication, Version 2.0
• Integrated Clock Controller, Real Time Clock Controller
• Intel® High Denition Audio and Intel® Smart Sound Technology
• Integrated 10/1 Gb Ethernet
• Supports Intel® Rapid Storage Technology Enterprise
• Supports Intel® Active Management Technology and Server Platform Services
• Supports Intel® Virtualization Technology for Directed I/O
• Supports Intel® Trusted Execution Technology
• JTAG Boundary Scan support
• Intel® QuickAssist Technology
• Intel® Trace Hub for debug
For more information, visit Intel.com
18 Processors

Memory
The PowerEdge R640 supports up to 1536 GB (RDIMM) or 768 GB (LRDIMMs) of memory (24 DIMMs), and at speeds up to 2666 MT/s,
providing high performance in various applications. High memory density ensures that there is no compromise in virtualization.
The PowerEdge R640 supports both registered DIMMs (RDIMM) and load-reduced DIMMs (LRDIMMs), which use a buer to reduce
memory loading and provide greater density, allowing for the maximum platform memory capacity.
NOTE: Mixing of DIMM types is not supported ‐ either the platform is populated with all RDIMMs, or all LRDIMMs. Maximum
two types of DIMMs allowed per system and only NVDIMM-Ns and RDIMMs are supported. NVDIMM-Ns are only supported on
CPU 1 and CPU 2, that is, six per CPU with a total of 12. RDIMM with LRDIMM and LRDIMM with NVDIMM-N cannot be mixed.
The system supports:
• Up to six channels with two DPC and total 24 DIMMs
• DDR4 RDIMM/LRDIMM/NVDIMM-N
• Only registered ECC DDR4 DIMMs
• DDR4 speeds up to 2666 MT/s
DIMMs supported
Table 6. Memory technologies
Feature RDIMM LRDIMM NVDIMM-N
Register Yes Yes Yes
Buer No Yes No
Frequencies Up to 2666 MT/s Up to 2666 MT/s Up to 2666 MT/s
Ranks supported Single or dual rank Quad rank Single rank
Capacity per DIMM 4 GB, 8 GB, 16 GB, 32 GB or 64
GB
32 GB 16 GB
Maximum DIMMs per channel 2 1, 2 1x NVDIMM-N for each channel
Or
Combined 2x (NVDIMM-N
+RDIMM) for each channel
DRAM technology x4 or x8 x4 x4
Temperature sensor Yes Yes Yes
Error Correction Code (ECC) Yes Yes Yes
Single Device Disable Code
(SDDC)
Yes Yes Yes
Address parity Yes Yes Yes
5
Memory 19

Table 7. Intel Xeon SP RDIMM/LRDIMM support
Type Ranks per
DIMM and
data width
DIMM capacity (GB) Speed (MT/s); Voltage (V)
Slot Per Channel (SPC) and DIMM Per Channel
(DPC)
1 Slot Per
Channel (SPC)
2 Slots Per Channel (SPC)
1DPC 1DPC 2DPC
4 GB 8 GB 16 GB 1.2 V 1.2 V 1.2 V
RDIMM SR x 4 8 GB 16 GB 32 GB 2666 2666 2440
RDIMM SR x 8 4 GB 8 GB 16 GB
RDIMM DR x 8 8 GB 16 GB 32 GB
RDIMM DR x 4 16 GB 32 GB 64 GB
LRDIMM QR x 4 32 GB 64 GB -
Memory congurations
The PowerEdge R640 systems support exible memory congurations ranging from capacities of 8 GB (minimum), to 1536 GB (maximum).
The PowerEdge R640 supports up to 12 DIMMs per processor—up to 24 DIMMs in a dual-processor conguration. Each system has six
memory channels per processor, with each channel supporting up to two DIMMs.
Memory population guidelines
Both systems support a exible memory conguration, according to the following population guidelines:
• Speed: If DIMMs of dierent speeds are mixed, all channels across all processors operate at the common frequency of the slowest
DIMM.
• DIMM type: Maximum two types of DIMMs allowed per system and only NVDIMM-Ns and RDIMMs are supported. RDIMM with
LRDIMM and LRDIMM with NVDIMM-N cannot be mixed.
• DIMMs with dierent data widths can be mixed. For 14G, DIMMs with x4 and x8 data widths are supported and mixing is allowed.
• Can mix DIMMs with dierent capacities:
• Population rules require the largest capacity DIMM be placed rst (slot A1 populated rst, then A2, and so on. The second CPU
mirrors the rst CPU population).
• Maximum of two dierent capacity DIMMs allowed in a system
• Can mix DIMMs with dierent ranks:
• Maximum of two dierent rank DIMMs allowed in a system
For more information on memory conguration and population, see the Dell EMC PowerEdge R640 Installation and Service Manual at
Dell.com/Support/Manuals.
Memory RAS features
Reliability, Availability, and Serviceability (RAS) features help keep the system online and operational without signicant impact to
performance. RAS can decrease data loss and crashing due to errors. RAS helps in rapid, accurate diagnosis of faults that requires
servicing.
20 Memory