Dell PowerEdge M610 Quick start guide

PowerEdge M610
Technical Guide
The Dell PowerEdge
M610 blade server
helps cut operating
expenses through
energy efficiency,
product flexibility,
and efficient use of
data center space.

Dell
Dell PowerEdge M610 Technical Guide ii
Dell, PowerEdge, EqualLogic, PowerVault, OpenManage, and ReadyRails are trademarks of Dell, Inc.
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December 2012 | Version 4.0

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Dell PowerEdge M610 Technical Guide iii
Table of Contents
1Product Comparison ...........................................................................................1
1.1 Overview ..................................................................................................1
1.1.1 Strong IT Foundation...............................................................................1
1.1.2 Purposeful Design ..................................................................................1
1.1.3 Scalability for Growth .............................................................................1
1.1.4 Smart Investment ..................................................................................1
1.1.5 Simplified Systems Management .................................................................2
1.1.6 Lifecycle Controller................................................................................2
1.2 Product Comparison .....................................................................................2
2New Technologies..............................................................................................5
2.1 Overview ..................................................................................................5
3System Information ............................................................................................6
4Mechanical ......................................................................................................8
4.1 Chassis Description.......................................................................................8
4.2 Dimensions and Weight..................................................................................8
4.3 Internal Module View ....................................................................................9
4.4 Cover Latch ...............................................................................................9
4.5 Security....................................................................................................9
4.5.1 TPM (Trusted Platform Module) ..................................................................9
4.5.2 Power Off Security .................................................................................9
4.6 USB Key.................................................................................................. 10
4.7 Battery................................................................................................... 10
4.8 Field Replaceable Units (FRU)........................................................................ 10
4.9 User Accessible Jumpers, Sockets, and Connectors............................................... 10
5Power, Thermal, Acoustic .................................................................................. 11
5.1 Power Supplies ......................................................................................... 11
5.2 Power Efficiency ....................................................................................... 11
5.3 Thermal Operating and Storage Specifications .................................................... 11
5.4 Acoustics ................................................................................................ 12
6Processors..................................................................................................... 14
6.1 Overview ................................................................................................ 14
6.2 Features ................................................................................................. 14
6.3 Supported Processors.................................................................................. 16
6.4 Processor Installation.................................................................................. 17
7Memory ........................................................................................................ 18
7.1 Overview ................................................................................................ 18
7.2 DIMMs Supported ....................................................................................... 18
7.3 Memory Features....................................................................................... 19
7.4 Memory Speed Limitations............................................................................ 19
8Chipset ........................................................................................................ 21
8.1 Overview ................................................................................................ 21
8.2 I/O Hub (IOH) ........................................................................................... 21
8.2.1 QuickPath Interconnect (QPI) .................................................................. 21
8.2.2 IOH PCI Express................................................................................... 21
8.2.3 Direct Media Interface (DMI) ................................................................... 21
8.3 I/O Controller Hub 9 (ICH9) .......................................................................... 21
9BIOS ............................................................................................................ 23
9.1 Overview ................................................................................................ 23

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9.2 Supported ACPI States................................................................................. 23
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 24
10.1 Overview ................................................................................................ 24
10.2 Platform Networking LAN on Motherboard (LOM) Technology Overview....................... 24
11 I/O Slots (I/O Mezzanine Card Options for M1000e) .................................................... 25
11.1 Overview ................................................................................................ 25
11.2 Options .................................................................................................. 25
12 Storage ........................................................................................................ 26
12.1 Overview ................................................................................................ 26
12.2 Hard Disk Drive Carriers............................................................................... 26
12.3 Empty Drive Bays....................................................................................... 26
12.4 Diskless Configuration Support ....................................................................... 26
12.5 RAID Configurations.................................................................................... 26
12.6 Storage Controllers .................................................................................... 26
12.6.1 SATA Repeater (MOD N014K) ................................................................... 26
12.6.2 SAS 6/iR ........................................................................................... 27
12.6.3 CERC 6/iR ......................................................................................... 27
12.6.4 PERC 6/i ........................................................................................... 27
12.6.5 PERC H200 (Modular version) ................................................................... 27
12.6.6 PERC H700 (Modular version) ................................................................... 27
12.7 Hard Drive LED Indicators............................................................................. 27
12.8 Optical Drives........................................................................................... 27
13 Video (PCI Video) ............................................................................................ 28
14 Rack Information............................................................................................. 29
15 Operating Systems ........................................................................................... 30
16 Virtualization ................................................................................................. 31
16.1 Resources................................................................................................ 31
16.2 Advanced Infrastructure Manager by Scalent ...................................................... 31
17 Systems Management........................................................................................ 32
17.1 Overview ................................................................................................ 32
17.2 Server Management.................................................................................... 32
17.3 Embedded Server Management ...................................................................... 33
17.4 Lifecycle Controller and Unified Server Configurator ............................................ 33
17.5 Integrated Dell Remote Access Controller.......................................................... 34
17.6 iDRAC6 Enterprise...................................................................................... 34
17.7 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ............................................. 34
17.8 Chassis Management Controller (CMC) .............................................................. 36
18 Peripherals.................................................................................................... 37
18.1 USB Peripherals......................................................................................... 37
18.2 External Storage........................................................................................ 37
Appendix A. Statement of Volatility .......................................................................... 38
Appendix B. Certifications ..................................................................................... 42
Regulatory Certifications ............................................................................. 42B 1.
Product Safety Certifications......................................................................... 42B 2.
Electromagnetic Compatibility....................................................................... 43B 3.
Ergonomics, Acoustics and Hygienics ............................................................... 43B 4.
Appendix C. Industry Standards ............................................................................... 45

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Dell PowerEdge M610 Technical Guide v
Tables
Table 1. Product Comparisons .................................................................................2
Table 2. Product Features Summary ..........................................................................6
Table 3. Operating and Storage Specifications ............................................................ 12
Table 4. Acoustical Performance of M1000e Chassis with Eight M610 Blades Installed.............. 13
Table 5. Comparison of Processor Technology ............................................................ 15
Table 6. Supported Processors ............................................................................... 16
Table 7. Maximum Supported Memory Frequencies ...................................................... 20
Table 8. Supported Video Modes ............................................................................ 28
Table 9. Server Management Documentation and Information.......................................... 32
Table 10. Unified Server Configurator Features and Description......................................... 33
Table 11. Features List for Base Management Functionality, iDRAC, and vFlash Media .............. 34
Table 12. PowerEdge M610 Statement of Volatility ........................................................ 38
Table 13. Product Safety Certifications...................................................................... 42
Table 14. Electromagnetic Compatibility Certifications................................................... 43
Table 15. Ergonomics, Acoustics and Hygienics............................................................. 43
Table 16. Standards Compliance and Specifications ....................................................... 45
Figures
Figure 1. PowerEdge M1000e ...................................................................................8
Figure 2. Internal view...........................................................................................9
Figure 3. 2.5‖ HDD Carrier .................................................................................... 26

1Product Comparison
1.1 Overview
The Dell™ PowerEdge™ M610 is a half-height blade server that offers a robust and scalable enterprise
platform that can help you simplify and save on IT expenses.
1.1.1 Strong IT Foundation
To build the most efficient data center solutions, Dell sought input from IT professionals. You asked
for reliability, scalability, energy efficiency, and a lower total cost of ownership (TCO). Our M610
blade servers deliver, becoming the cornerstone of a high-performance data center capable of
keeping pace with your changing business demands.
1.1.2 Purposeful Design
Designed with your needs in mind, the M610 uses the Intel®Xeon®processor 5500 and 5600 series.
These processors adapt to your software in real time, processing more tasks simultaneously. Using
Intel®Turbo Boost Technology, the M-Series blades can increase performance during peak usage
periods. When demand decreases, Intel®Intelligent Power Technology helps reduce operating costs
and energy usage by proactively putting your server into lower power states.
The M610 delivers quick virtualization with software from leading industry vendors by offering
optional integrated SD storage or internal USB for embedded hypervisors, and includes the features
necessary to meet the demands for performance, high availability and redundancy in modern data
centers, such as a large memory capacity of up to 192 GB of total RAM.
1.1.3 Scalability for Growth
As your application needs increase, M610 blades allow you to scale up to 192 cores and 3072 GB of
memory per 10U chassis, with opportunities for even greater capacities in the future.
To keep pace with changing requirements, you can effectively scale I/O application bandwidth with
end-to-end 10 Gbe or Fibre Channel solutions. Use NPIV and Port Aggregator modes on a variety of
switches to virtualize Ethernet or Fibre Channel ports for integration into heterogeneous fabrics. By
harnessing Dell’s FlexIO modular switches, you can cost-effectively scale your I/O needs, adding
ports and functionality through expansion modules—including 10 Gb uplinks and stacking ports—
instead of needing to buy complete new switches. Dell provides a range of solutions for building on
your investment to avoid costly ―rip and replace‖ scenarios.
1.1.4 Smart Investment
The M610 is a foundational component of smart M-Series blade solutions that can help protect your
infrastructure investments, simplify your IT environment, and drive real and sustainable savings in
power efficiency and productivity. Features include:
A future-ready, passive midplane capable of supporting multiple generations of blade servers
and a full array of upcoming I/O technologies
FlexIO eliminates ―rip and replace‖ blade switch upgrades; modularity is built into the
switches
FlexAddress™ technology simplifies efforts and interactions between server and networking
teams by providing slot-assigned, persistent WWN/iSCSI/MAC addresses for maintenance,
without additional management tools or proprietary hardware

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Dell PowerEdge M610 Technical Guide 2
Energy Smart Technologies, including ultra-efficient fans and power supplies for outstanding
energy efficiency
With savings in time and money previously needed for maintenance, you free up resources that can
be used for true innovation.
1.1.5 Simplified Systems Management
The next generation Dell™ OpenManage™ suite offers enhanced operations and standards-based
commands designed to integrate with existing systems for effective control.
1.1.6 Lifecycle Controller
Lifecycle Controller is the engine for advanced systems management integrated on the server.
Lifecycle Controller simplifies administrator tasks so you can perform a complete set of provisioning
functions such as system deployment, system updates, hardware configuration and diagnostics from a
single intuitive interface called Unified Server Configurator (USC) in a pre-OS environment. This
eliminates the need to use and maintain multiple pieces of disparate CD/DVD media.
1.2 Product Comparison
Table 1. Product Comparisons
M610x
M610
M710HD
M710
Description
Special purpose
full-height
General purpose
half-height
General purpose
half-height
General purpose
full-height
Processor
Intel®Xeon®processors 5500 and 5600 series
Front Side
Bus
Intel QuickPath Interconnect (QPI)
Sockets
Two
Max Cores
per Socket
Up to six
L2/L3 Cache
8MB (5500 Series) or 12MB (5600 Series)
Chipset
Intel 5520
DIMMs
12 x DDR3 DIMMs
800/1066/1333MT/s
12 x DDR3 DIMMs
800/1066/1333MT/s
18 x DDR3 DIMMs
800/1066/1333MT/s
18 x DDR3 DIMMs
800/1066/1333MT/s
Min/Max RAM
4GB/192GB
(16GB DIMMS)
4GB/192GB
(16GB DIMMS)
4GB/288GB
(16GB DIMMS)
4GB/288GB
(16GB DIMMS)
Form Factor
Full-height blade,
dual-socket,
expansion module
Half-height blade,
dual-socket
Half-height blade,
dual-socket
Full-height blade,
dual-socket
Hard Drive
Bays
(2.5” only)
SAS: 2 x 2.5‖
(hot-pluggable)
SATA: 1 x 2.5‖
SAS: 2 x 2.5‖
(hot-pluggable)
SATA: 1 x 2.5‖
SAS: 2 x 2.5‖
(hot-pluggable)
SSD SATA: 2 x 2.5‖
SAS: 2 x 2.5‖
(hot-pluggable)
SSD SATA: 2 x 2.5‖
Hard Drive
Types
SAS/SSD

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Dell PowerEdge M610 Technical Guide 3
M610x
M610
M710HD
M710
Hard Drive
Controller
PERC Η200
PERC Η700
PERC Η800
SAS 6/E
PERC H200
Non-RAID SATA (one
hard drive only)
PERC H700
CERC 6/i
SAS 6/iR
PERC 6/i with RAID
battery
Embedded H200
PERC H200
PERC H700
CERC 6/i
SAS 6/iR
PERC 6/i with RAID
battery
Optional HD
Controller
Embedded H200
SAS 6/iR
PERC 6/i with RAID
battery
Embedded H200
SAS 6/iR
PERC 6/i with RAID
battery
Availability
Hot-plug hard drives
Hot-plug redundant power and cooling
ECC memory
Single Device Data Correction (SDDC)
supports memory demand and patrol scrubbing
High availability failover cluster support
Server
Management
Integrated Dell Remote Access Controller iDRAC6 Express/Enterprise (both standard) w/
IPMI 2.0 +vMedia/vKVM, and CMC (on the PowerEdge M1000e chassis)
Mezzanine
Slots
2 x8 (PCIe Gen2);
Fabric B limited to
a small form factor
(SFF) mezzanine
card
2 x8 (PCIe Gen2);
Fabric B limited to a
small form factor
(SFF) mezzanine card
2 x8 PCIe mezzanine
cards
1 x4 and 3 x 8 PCIe
mezzanine cards
IO Slots
Two x16 PCIe Gen2
H800 / 6GB SAS
NVIDIA®Tesla™
M1060 and M2050-
204
NA
NA
NA
RAID
0,1
0,1
0,1
0,1,5
NIC/LOM
2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator
2-port Broadcom®
5709S 1Gb w/ TOE
plus optional iSCSI
Accelerator
4 x 1GbE dual
Broadcom®
BCM5709S
4 x TOE with
optional iSCSI
offload
USB
2 external, 1
internal
2 external, 1 internal
2 x external USB 2.0
ports at front bezel
1 x internal USB port
3 x external USB 2.0
ports at front bezel
1 x internal USB port

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Dell PowerEdge M610 Technical Guide 4
M610x
M610
M710HD
M710
SD Card
2: 1 for Persistent
Storage 1 for
Management
2: 1 for Persistent
Storage 1 for
Management
2 x internal SD slot
1 for Persistent
Storage
1 for Management
(can also be
configured as
redundant SD cards
for embedded
hypervisor)
1 x internal SD slot
1 for Persistent
Storage
1 for Management
TPM
Yes, except in China where TCM is the standard
Video
Matrox®G200eW integrated into iDRAC chip
Power
Supplies
See the PowerEdge M1000e Technical Guide.
Fans
See the PowerEdge M1000e Technical Guide.
Chassis
See the PowerEdge M1000e Technical Guide.

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Dell PowerEdge M610 Technical Guide 5
2New Technologies
2.1 Overview
The Dell™ PowerEdge™ M610 is a half-height blade within a PowerEdge M1000e full-height blade
enclosure. The PowerEdge M610 features include:
Dual quad- and six-core Intel Xeon processor 5500 and 5600 series
Intel IOH (24D I/O Hub)
Intel QuickPath Architecture
DDR3 memory
DIMM thermal sensors
Internal SD Module
iDRAC6 Express

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Dell PowerEdge M610 Technical Guide 6
3System Information
Table 2 summarizes the product features for the Dell™ PowerEdge™ M610. For the latest information
on supported features for the PowerEdge M610, visit Dell.com.
Table 2. Product Features Summary
Feature
Technical Specifications
Processors
Quad-core or six-core Intel®Xeon®processors 5500 and 5600 series
Chipset
Intel 5520
Memory1
Up to 192GB (12 DIMM slots) 1GB/2GB/4GB/8GB/16GB ECC DDR3 up to 1333MT/s
Drive Bays
Two 2.5‖ SAS/SSD hot-pluggable drives
Storage1
Hot-plug hard drive options:
2.5" SAS SSD, SATA SSD, SAS (15K, 10K), nearline
SAS (7.2K), SATA (7.2K)
Maximum internal storage:
Up to 1.8TB per blade
External storage:
For information about Dell
external storage options, visit
Dell.com/Storage.
RAID Controller Options
Internal:
PERC H200 Modular (6Gb/s)
PERC H700 Modular (6Gb/s) with 512MB battery-backed cache;
512MB, 1GB non-volatile battery-backed cache
SAS 6/iR Modular
CERC 6/i Modular
PERC 6/i Modular with 256MB battery-backed cache
I/O Mezzanine Card
Options
1Gb and 10Gb Ethernet:
Dual-Port Broadcom®Gb Ethernet with TOE (BCM-
5709S)
Quad-Port Intel®Gb Ethernet (BCM-82576)
Quad-Port Broadcom®Gb Ethernet (BCM-5709S)
Dual-Port Broadcom®10Gb Ethernet (BCM-57711)
10Gb Enhanced Ethernet and Converged
Network Adapters (CEE/DCB):
Dual Port Intel 10GB Enhanced Ethernet Server
Adapter X520-DA2 (FcoE ready for future
enablement)
Dual-Port QLogic®CNA (QME8142) (supports
CEE/DCB 10GbE + FCoE)
Dual-Port QLogic CNA (QME8242-k) - Supports
10GbE + NPAR
Brocade® BR1741M-k Dual-Port Mezzanine CNA
Fibre Channel:
Dual-Port QLogic®FC8 Fibre
Channel Host Bus Adapter
(HBA) (QME2572)
Dual-Port Emulex®FC8 Fibre
Channel HBA (LPe1205-M)
Emulex®8 or 4 Gb/s Fibre
Channel Pass-Through Module
InfiniBand™:
Dual-Port Mellanox®ConnectX®
Quad Data Rate (QDR)
InfiniBand
Dual-Port Mellanox®ConnectX
Dual Data Rate (DDR)
InfiniBand
Operating Systems
Microsoft®Windows Server®2012

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Dell PowerEdge M610 Technical Guide 7
Feature
Technical Specifications
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2)
Microsoft Windows®HPC Server 2008
Novell®SUSE®Linux Enterprise Server
Red Hat®Enterprise Linux®
Oracle®Solaris™
Virtualization Options:
Citrix®XenServer®
Microsoft Hyper-V with Microsoft Windows Server 2008
VMware®vSphere®including ESX™and ESXi™
Red Hat Enterprise Virtualization®
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
Featured Database
Applications
Microsoft SQL Server®solutions (see Dell.com/SQL)
Oracle®database solutions (see Dell.com/Oracle)
Power Supply
Supplied by Dell™ PowerEdge™ M1000e Blade Chassis
Video
Matrox®G200 with 8 MB of cache
Systems Management
Dell™ OpenManage™ featuring Dell Management Console
Unified Server Configurator Lifecycle Controller
BMC, IPMI2.0 compliant
iDRAC6 Enterprise with optional vFlash
Remote Management: iDRAC6 Enterprise with optional vFlash
Embedded Hypervisor
Optional embedded SD media
1GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.

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Dell PowerEdge M610 Technical Guide 8
4Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ M610 is a half-height blade server that requires an M1000e chassis to operate.
Figure 1. PowerEdge M1000e
The M610 server occupies one slot in the M1000e rack chassis for a maximum of 16 blades in one
M1000e chassis. It can be mixed with other existing Dell blades and is designed to mix with possible
future half- and full-height double-wide blades. Some highlights are:
Support for RAID
Support for persistent storage (internal USB connector and two external SD card slots)
Refer to the PowerEdge M1000e Technical Guide for information on fans, power and power supply,
racks, security, and other chassis information.
4.2 Dimensions and Weight
The PowerEdge M610 dimensions and weight are as follows:
Height: 18.9cm (7.4in)
Width: 5cm (2in)
Depth: 48.6cm (19.2in)
Weight (Maximum Configuration): 11.1kg (24.5lb)

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Dell PowerEdge M610 Technical Guide 9
4.3 Internal Module View
A view of the internal module is shown in Figure 2. See the Opening and Closing the Blade section in
the Installing Blade Components chapter in the Dell PowerEdge Modular Systems Hardware Owner’s
Manual on Support.Dell.com/Manuals for more information.
Figure 2. Internal view
4.4 Cover Latch
The blade module includes a latch for the cover. See the Opening and Closing the Blade section in
the Installing Blade Components chapter in the Dell PowerEdge Modular Systems Hardware Owner’s
Manual on Support.Dell.com/Manuals for more information.
4.5 Security
The M610 offers a configurable client IP address range for clients connecting to iDRAC6. For
additional information regarding the PowerEdge M610 security features, see the Dell PowerEdge
Modular Systems Hardware Owner’s Manual on Support.Dell.com/Manuals.
4.5.1 TPM (Trusted Platform Module)
The TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008. TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. TCM is
available in China.
4.5.2 Power Off Security
Through the BIOS, the front blade server USB ports and power button can be disabled so as to not
allow any control of the system from the front of the blade. The enclosure video can also be
restricted.

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Dell PowerEdge M610 Technical Guide 10
The BIOS System Setup program’s system security screen allows administrators to set the system
password, control TPM activation and reporting, clear the TPM’s memory, and disable the power
button and USB ports.
4.6 USB Key
The M610 supports the following USB devices:
•DVD (bootable; requires two USB ports)
•USB Key (bootable)
•Keyboard (only one USB keyboard is supported)
•Mouse (only one USB mouse is supported)
4.7 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH9 chip.
4.8 Field Replaceable Units (FRU)
The planar contains a serial EEPROM to contain FRU information including Dell part number, part
revision level, and serial number.
4.9 User Accessible Jumpers, Sockets, and Connectors
For information, see the System Board Information chapter in the Dell PowerEdge Modular Systems
Hardware Owner’s Manual on Support.Dell.com/Manuals.

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Dell PowerEdge M610 Technical Guide 11
5Power, Thermal, Acoustic
5.1 Power Supplies
See the PowerEdge M1000e Technical Guide for information on power supplies and power supply
specifications.
5.2 Power Efficiency
One of the main features of blade servers is enhanced power efficiency. The Dell™ PowerEdge™ M610
achieves higher power efficiency by implementing the following features:
•User-configurable power options through the M1000e Chassis Management Controller (CMC)
(see the M1000e documentation online at Dell.com/Support for further details)
•Improved power budgeting
•Voltage Regulator (VR) efficiency improvements
•Processor VR dynamic phase shedding
•Switching regulators instead of linear regulators
•Closed loop thermal throttling
•Use of DDR3 memory (lower voltage compared to DDR2)
•Memory VR static phase shedding
•BIOS Power/Performance options page
•Active Power Controller (BIOS-based processor P-state manager)
•Ability to throttle memory
•Ability to disable a processor core
•Ability to turn off embedded NICs when not being used
•Energy Smart components at the M1000e chassis level to selectively enable more computing
performance with less power consumption.
5.3 Thermal Operating and Storage Specifications
The M610 thermal solution includes:
Optimized airflow impedance for individual blade and chassis level airflow balancing
Custom air baffling directs airflow through the components to maintain proper cooling
Custom designed heat sinks maintain processor, DIMM, and board-level chip temperatures
within thermal design targets
Highly Optimized Fan Control Algorithm
oBase fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
oComponent algorithms: CPU PID, DIMMs, HW Configuration, IOH, GPU, and External
Ambient.
oThe highest fan speed request from the above algorithms is used to set the
appropriate fan speed for the blade.
oAmbient and HW Configuration sets the minimum –other algorithms increase fan speed
to maintain proper cooling.
Thermal specifications for the PowerEdge M610 are detailed in Table 3 along with other important
operating and storage information.

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Dell PowerEdge M610 Technical Guide 12
Table 3. Operating and Storage Specifications
Temperature
Operating
10o to 35o C (50oto 95oF) with a maximum temperature gradation of
10oC per hour
Note: For altitudes above 2950 feet, the maximum operating
temperature is derated 1oF/500ft
Storage
-40oto 65oC (-40oto 149oF) with a maximum temperature gradation
of 20oC per hour
Relative Humidity
Operating
20% to 80% (noncondensing) with a maximum humidity gradation of
10% per hour
Storage
5% to 95% (noncondensing) with a maximum humidity gradation of
10% per hour
Maximum Vibration
Operating
0.26 Grms at 5-350 Hz in operational orientations
Storage
1.54 Grms at 10-250 Hz in all orientations
Maximum Shock
Operating
Half sine shock in all operational orientations of 31 G +/- 5% with a
pulse duration of 2.6 ms +/- 10%
Storage
Half sine shock on all six sides of 71 G +/- 5% with a pulse duration
of 2 ms +/- 10%
Altitude
Operating
-15.2m to 3048 m (-50 to 10,000 ft)
Note: For altitudes above 2950 ft, the maximum temperature is
derated 1oF/550 ft
Storage
-16 to 10,600 m (-50 to 35,000 ft)
Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels
measured at ≤ 50% relative humidity)
5.4 Acoustics
The acoustical design of the PowerEdge M610 reflects adherence to Dell’s high sound quality
standards. Sound quality is different from sound power level and sound pressure level in that it
describes how humans respond to annoyances in sound, like whistles, hums, etc. One of the sound
quality metrics in the Dell specification is prominence ratio of a tone.
Table 4 shows the acoustical performance for a typical configuration of the M1000e chassis with eight
PowerEdge M610 blade servers installed. Acoustical performance varies with hardware
configurations.

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Dell PowerEdge M610 Technical Guide 13
Table 4. Acoustical Performance of M1000e Chassis with Eight M610 Blades Installed
Typical Configuration (per blade) @ 23±2°C Ambient in M1000e Chassis
Operating Mode
LwA-UL (bels)
Idle
7.4
Definitions
Typical configuration: The system is populated with projected average quantity, type, capacity,
speed, etc., of components.
Idle: Reference ISO7779 (2010) definition 3.1.7; system is running in its OS but no other specific
activity.
LwA –UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988)
and measured in accordance to ISO 7779 (2010).

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Dell PowerEdge M610 Technical Guide 14
6Processors
6.1 Overview
The Intel®Xeon®processor 5500 and 5600 series are designed specifically for servers and workstation
applications. These processors feature quad-core processing to maximize performance and
performance-per-watt for data center infrastructures and highly-dense deployments. They feature
Intel Core™ micro-architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit
applications and operating systems, and they use a 1366-contact Flip-Chip Land Grid Array (FC-LGA)
package that plugs into a surface-mount socket. The M610 provides support for up to two processors.
6.2 Features
Key features of the Intel Xeon processor 5500 series include:
Up to four cores per processor
Two point-to-point QuickPath Interconnect links at 6.4 GT/s
45 nm process technology
No termination requirement for non-populated processors (must populate CPU socket 1 first)
Integrated QuickPath DDR3 memory controller
64-byte cache line size
RISC/CISC hybrid architecture
Compatibility with existing x86 code base
MMX™ support
Execute Disable Bit
Intel Wide Dynamic Execution
Ability to execute up to four instructions per clock cycle
Simultaneous Multi-Threading (SMT) capability
Support for processor Turbo Mode (on certain SKUs)
Processor frequency increases if operating below thermal, power, and current limits
Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
Intel®64 Technology
Intel®VT-x and VT-d technology for virtualization support
Enhanced Intel®SpeedStep®technology
Demand-based switching for active processor power management as well as support for ACPI
P-States, C-States and T-States
The Intel Xeon processor 5600 series encompasses all the features of the 5500 series, and also
includes the following:
•New top BIN processors at 130W TDP
•Support for DDR3L, 1.35v DIMMs for even lower system power
•Support for memory sparing
•AES-NI (hardware encryption assist) for more efficient encryption for uses such as online
transactions SSL.
•Intel TXT (Trusted Execution Technology) provides hardware assisted protection against
emerging software attacks

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Dell PowerEdge M610 Technical Guide 15
Table 5. Comparison of Processor Technology
Intel®Xeon®Processor
5400 Series
5500 Series
5600 Series
Cores
4
4
6
Last Level Cache
2 x 6MB shared
8MB shared
12MB shared
FSB (MT/s) / Link
Frequency (GT/s)
1333MT/s
Up to 6.4 GT/s
Up to 6.4 GT/s
Max TDP
120W
130W for WS
95W for Server
130W for WS and
Server
Max Frequency
>3GHz
>3GHz
>3GHz
Memory Controller
Separate in chipset
Integrated 3-channel
DDR3
Integrated 3-channel
DDR3
Process Technology
45nm
45nm
32nm
Intel®Trusted Execution
Technology
No
No
Yes
Intel®Advanced
Encryption Security- New
Instructions
No
No
Yes
Intel®Virtualization
Technology
Yes
Yes
Yes
Intel®64
Yes
Yes
Yes
Intel®Hyper-Threading
Technology
No
Yes
Yes
Socket
LGA771
LGA1366
LGA1366