Delta 10GBASE-SR XFP Optical Transceiver... User manual

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
1 Revision: S3
04/10/2007
www.deltaww.com
10GBASE-SR XFP Optical Transceiver
FEATURES
 RoHS compliant
 850nm Vertical Cavity Surface Emitting Laser
(VCSEL) light source
 Standard LC duplex fiber-optic connector
 Compliant with XFP MSA
 I2C for integrated Digital Optical Monitoring
 Power consumption <1.37 W
 User friendly Plug-and-play style "Hot Swap"
 Small footprint which enables high board
density
 XFI high speed I/O electrical interface
 Integrated signal conditioner to extend
200mm FR4 PCB trace signaling
Description
The TSP-10G3A1EER is a hot pluggable
10Gbps small form factor transceiver module
integrated with the high performance 850nm
VCSEL transmitter, high sensitivity PIN receiver
and signal conditioner for 10Gbps applications.
It is compliant with the INF-8077i XFP
Multi-source Agreement (MSA).
The TSP-10G3A1EER is designed to be
compliant with INF-8077i XFP Multi-source
Agreement (MSA) with five digital monitoring
functions: Temperature, Vcc, Tx optical power,
TX laser bias current and RX received optical
power.
Application
 10G LAN switch
 10G Ethernet switch/router
 10G Fiber channel
 SAN applications

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
2 Revision: S3
04/10/2007
www.deltaww.com
1. Absolute Maximum Ratings
Parameter Symbol Min Typ Max Units Notes
Storage Temperature TS-40 85 °C
Storage Ambient Humidity HA5 90 %
+5V Power Supply VCC5 0 6.0 V
+3.3V Power Supply VCC3 0 3.6 V
2. Recommended Operating Conditions
Parameter Symbol Min Typ Max Units Notes
Operating Ambient
Temperature TA0 70 °C
Ambient Humidity HA5 85 % [1]
+3.3V Power Supply VCC3 3.135 3.3 3.465 V
+5V Power Supply VCC5 4.75 5 5.25 V
+3.3V Supply Current IVCC3 270 350 mA
+5V Supply Current IVCC5 10 30 mA
Total Power Dissipation PD1.37 W
Differential TX Data Input TD+- TD-150 500 1000 mVp-p [2,3]
Differential RX Data Output RD+- RD-500 650 800 mVp-p [4]
Notes:
1. Non-condensing
2. The data rate of input data is 10.3125Gb/s
3. Input voltage swing (differential) measured peak-to-peak
4. Output voltage swing (differential) measured peak-to-peak
ASIC / SerDes XFP
ASIC / SerDes
XFP
10Gbps optical signal10Gbps XFI electrical signal 10Gbps XFI electrical signal
Application Block Diagram

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
3 Revision: S3
04/10/2007
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3. Optical Transmitter Characteristics (TA=0 ºC to 70 ºC)
Parameter Symbol Min Typ Max Units Notes
Data Rate R 10.3125 Gb/s
Signaling speed variation from
nominal
±100 ppm
Average Output Power Pavg -5 -1.8 dBm
Wavelength λ840 860 nm
Spectral Width RMS 0.45 nm
Transmitter OFF Output Power Poff -30 dBm
Extinction Ratio ER 3.7 dB
Optical Modulaion Amplitude OMA Compliant with Minimum OMA relation table dBm
Relative Intensity Noise RIN12OMA -128
dB/Hz
Optical Return Loss Tolerance ORLT 12
dB
Transmitter eye mask definition
{X1, X2, X3, Y1, Y2, Y3} {0.25, 0.40, 0.45, 0.25, 0.28, 0.40}
Transmitter eye mask definition
Minimum optical modulation amplitude (dBm) relation table
Up to
0.05
0.05 to
0.1
0.1 to
0.15
0.15 to
0.2
0.2 to
0.25
0.25 to
0.3
0.3 to
0.35
0.35 to
0.4
0.4 to
0.45
840to842 -4.2-4.2-4.1-4.1-3.9-3.8-3.5-3.2-2.8
842to844 -4.2-4.2-4.2-4.1-3.9-3.8-3.6-3.3-2.9
844to846 -4.2-4.2-4.2-4.1-4.0-3.8-3.6-3.3-2.9
846to848 -4.3-4.2-4.2-4.1-4.0-3.8-3.6-3.3-2.9
848to850 -4.3-4.2-4.2-4.1-4.0-3.8-3.6-3.3-3.0
850to852 -4.3-4.2-4.2-4.1-4.0-3.8-3.6-3.4-3.0
852to854 -4.3-4.2-4.2-4.1-4.0-3.9-3.7-3.4-3.1
854to856 -4.3-4.3-4.2-4.1-4.0-3.9-3.7-3.4-3.1
856to858 -4.3-4.3-4.2-4.1-4.0-3.9-3.7-3.5-3.1
858to860 -4.3-4.3-4.2-4.2-4.1-3.9-3.7-3.5-3.2
Center
Wavelength
(nm)
RMS Specrtal width (nm)

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
4 Revision: S3
04/10/2007
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Triple tradeoff curve
4. Optical Receive Characteristics (TA=0 ºC to 70 ºC)
Parameter Symbol Min Typ Max Units Notes
Signaling speed (nominal) Ts 10.3125 Gb/s
Signaling speed variation from
nominal
±100 ppm
Center Wavelength λ840 860 nm
Overload PO-1 dBm
Receiver sensitivity in OMA RSO -11.1 dBm [1]
LOS De-assert LOSD-13 dBm
LOS Assert LOSA-30 dBm [2]
LOS Hysteresis LOSD–LOSA0.5 dB
Receiver Reflectance -12 dB [3]
Stressed Receive sensitivity
OMA
-7.5 dBm
Notes:
1. Measured by reference TX with 4.75dB extinction ratio at 12
10
−
BER
2. When LOS asserted, the data output is Low-level (fixed)
3. When the terminal is viewed from the optical path, the reflection toward the optical path of the optical
signal with a central wavelength of 840nm to 860nm transmitted to terminal.

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
5 Revision: S3
04/10/2007
www.deltaww.com
5. XFI Module Receiver Output Jitter Specifications at C’
Parameter – C’ Symbol Min Typ Max Units Notes
Deterministic Jitter DJ 0.18 UI (p-p) [1]
Total Jitter TJ 0.34 UI (p-p) [1]
X1 0.17 UI
X2 0.42 UI
Y1 170 mV
Eye Mask
Y2 425 mV
Notes:
1. Includes jitter transferred from the optical receiver during any valid operational input condition.
XFI Module Receiver Differential Output Compliance Mask
XFI Termination and AC Coupling

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
6 Revision: S3
04/10/2007
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6. Pin Description
XFP Host Board Connector Pad Layout (Top View)
Recommended Host Board Supply Filtering Network

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
7 Revision: S3
04/10/2007
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Module Electrical Pin Function Definition
Pin Logic Symbol Name/Description Note
1 GND Module Ground [1]
2 VEE5 Optional -5.2V Power Supply --Not Required
3 LVTTL-I Mod_DeSel
Module De-select; When held low allows module to respond to
2-wire serial interface
4 LVTTL-O Interrupt Bar
Interrupt Bar; Indicates presence of an important condition
which can be read over the 2-wire serial interface [2]
5 LVTTL-I TX_DIS Transmitter Disable; Turns off transmitter laser output
6 VCC5 +5V Power Supply
7 GND Module Ground [1]
8 VCC3 +3.3V Power Supply
9 VCC3 +3.3V Power Supply
10 LVTTL-I/O SCL 2-Wire Serial Interface Clock [2]
11 LVTTL-I/O SDA 2-Wire Serial Interface Data Line [2]
12 LVTTL-O Mod_Abs Indicates Module is not present. Grounded in the Module [2]
13 LVTTL-O Mod_NR Module Not Ready; Indicating Module Operational Fault [2]
14 LVTTL-O RX_LOS Receiver Loss Of Signal Indicator [2]
15 GND Module Ground [1]
16 GND Module Ground [1]
17 CML-O RD- Receiver Inverted Data Output
18 CML-O RD+ Receiver Non-Inverted Data Output
19 GND Module Ground [1]
20 VCC2 +1.8V Power Supply --Not Required
21 LVTTL-I P_Down/RST
Power down; When high, requires the module to limit power
consumption to 1.5W or below. 2-Wire serial interface must be
functional in the low power mode.
22 VCC2 +1.8V Power Supply --Not Required
23 GND Module Ground [1]
24 PECL-I RefCLK-
Reference Clock Non-Inverted Input, AC coupled on the host board,
Not required
25 PECL-I RefCLK+
Reference Clock Inverted Input, AC coupled on the host board,
Not required
26 GND Module Ground [1]
27 GND Module Ground [1]
28 CML-I TD- Transmitter Inverted Data Input
29 CML-I TD+ Transmitter Non-Inverted Data Input
30 GND Module Ground [1]
Notes:
1. Module ground pins Gnd are isolated from the module case and chassis ground within the module.

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
8 Revision: S3
04/10/2007
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2. Shall be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.45V on the host board.
7. Low Speed Electrical Hardware Pins
In addition to the 2-wire serial interface the XFP module has the following low speed pins for control and status:
•Mod_NR
•Mod_DeSel
•Interrupt
•TX_DIS
•Mod_ABS
•RX_Los
•P_Down/RST.
1 MOD_NR
The Mod_NR is an output pin that when High, indicates that the module has detected a condition that renders
transmitter and or receiver data invalid, shall consist of logical OR of the following signals:
•Transmit Signal Conditioner Loss of Lock
•Transmitter Laser Fault
•Receiver Signal Conditioner Loss of Lock
Other conditions deemed valuable to the detection of fault may be added to the Mod_NR.
The Mod_NR output pin is an open collector and must be pulled to Host_Vcc on the host board.
2 MOD_DESEL
The Mod_DeSel is an input pin. When held Low by the host, the module responds to 2-wire serial communication
commands. The Mod_DeSel allows the use of multiple XFP modules on a single 2-wire interface bus.
When the Mod_DeSel pin is “High”, the module shall not respond to or acknowledge any 2-wire interface
communication from the host. Mod_DeSel pin must be pulled to VCC3 in the module.
In order to avoid con.icts, the host system shall not attempt 2-wire interface communications within the Mod_DeSel
assert time after any XFP modules are deselected. Similarly, the host must wait at least for the period of the
Mod_DeSel deassert time before communicating with the newly selected module. The assertion and de-assertion
periods of different modules may overlap as long as the above timing requirements are met.
3 INTERRUPT
Interrupt is an output pin. When “Low”, indicates possible module operational fault or a status critical to the host
system. The Interrupt pin is an open collector output and must be pulled up to Host_Vcc the host board.
4 TX_DIS
TX_DIS is an input pin. When TX_DIS is asserted High, the XFP module transmitter output must be turned off. The
TX_DIS pin must be pulled up to VCC3 in the XFP module.

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
9 Revision: S3
04/10/2007
www.deltaww.com
5 MOD_ABS
Mod_ABS is pulled up to Host_Vcc on the host board and grounded in the XFP module. Mod_ABS is then asserted
“High”when the XFP module is physically absent from a host slot.
6 RX_LOS
The RX_LOS when High indicates insuf.cient optical power for reliable signal reception. The RX_LOS pin is an open
collector output and must be pulled up to Host_Vcc on the host board.
7 P_DOWN/RST
This is a multifunction pin for module Power Down and Reset. The P_Down/RST pin must be pulled up to VCC3 in the
XFP module.
7.1 POWER DOWN FUNCTION
The P_Down pin, when held High by the host, places the module in the standby (Low Power) mode with a maximum
power dissipation of 1.5W.
This protects hosts which are not capable of cooling higher power modules which may be accidentally inserted.
The module’s 2-wire serial interface and all laser safety functions must be fully functional in this low power mode.
During P_Down, the module shall still support the completion of reset Interrupt, as well as maintain functionality of the
variable power supply as described in XFP MSA Revision 3.1 section 5.7.
7.2 RESET FUNCTION
The negative edge of P_Down/RST signal initiates a complete module reset.
7.3 MODULE BEHAVIOR DURING POWER DOWN AND RESET
During execution of a reset (t_init) or while held in Power Down mode, a module may be unable to determine the
correct value for Mod_NR and RX_LOS. These outputs as well as all interrupt related .ags, except completion of
Reset .ag, shall be disregarded by the host. When the module completes a Reset and is not in Power Down mode,
the module must represent the correct value of both signals on its outputs before posting a completion of reset
interrupt to the host (see XFP MSA Revision 3.1 Table 39, bit 0 register address 84).
At no time shall a module cause spurious assertion of the Interrupt pin.
When a host initially applies power to a module with the P_Down/RST signal asserted, a module comes up in power
down mode. The module shall only assert the Interrupt signal pin to informthe host it has completed a reset. The
completion of reset .ag (see XFP MSA Revision 3.1 Table 39, bit 0 register address 84) shall be the only interrupt
source .ag set during power down mode.
The host is expected to clear this interrupt before releasing the module from the power down mode. The transition
from power down mode to normal mode will trigger a reset of the module and result in a 2nd module reset and a 2nd
reset completion interrupt to the host

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
10 Revision: S3
04/10/2007
www.deltaww.com
8. Memory Map of Management Interface
The lower memory table (Byte 0~127) is for digital diagnostics and control functions. Besides, it has
been allocated three upper memory tables for serial ID, user writable and vendor specific functions. The
detail definition of memory content is listed as following table.

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
11 Revision: S3
04/10/2007
www.deltaww.com
9. Mechanical Outline Dimensions
Transmitter Wavelength / Application Latch Color Identifier
850nm / SR Beige
Week (52Weeks/Year) : 1月2日=01

TSP-10G3A1EER
DELTA ELECTRONICS, INC.
12 Revision: S3
04/10/2007
www.deltaww.com
10. Regulatory Compliance
Feature Test Method Reference Performance
Human Body Model
(HBM)
MIL-STD-883E Method 3015.7
EIA-JESD22-A114
Electrostatic Discharge
(ESD) to the Electrical
Pins Machine Model (MM) EIA-JESD22-A115
Contact Discharge IEC/EN 61000-4-2Electrostatic Discharge
(ESD) to the Duplex LC
Receptacle Air Discharge IEC/EN 61000-4-2
Radio Frequency
Electromagnetic Field
Immunity
IEC/EN 61000-4-3
Electromagnetic
Interference (EMI)
FCC Part 15 Class B
EN 55022 Class B
(CISPR 22A)
(1) Satisfied with
electrical
characteristics of
product spec.
(2) No physical damage
Laser Eye Safety
FDA/CDRH
TUV
FDA 21CFR 1040.10, 1040.11
IEC/EN 60825-1
IEC/EN 60825-2
CDRH File # 0420993
TUV Certificate #
R50067719
Component Recognition
TUV
UL/CSA
IEC/EN 60950
UL 60950
UL File # E239394
Appendix A. Document Revision
Version No. Date Description
S0 2006-04-25 Preliminary datasheet for RoHS version
S1 2006-08-25 Update module characteristics
S2 2007-01-04 Update Spectral Width RMS from 0.65nm to 0.45nm
S3 2007-04-10 Update Optical Modulaion Amplitude (OMA) specification