DFI TGH960 Guide

© May 18, 2023 DFI Inc.
TGH960
COM Express Basic Module
Carrier Board Design Guide

2Design Guide | TGH960
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation with-
out the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no rep-
resentations or warranties with respect to the contents or use of this manual and specifically
disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The web-
site will always provide the most updated information.
© 2023. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express® Module Base Specification.
http://www.picmg.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the re-
ceiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
• The changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
• Shielded interface cables must be used in order to comply with the emission limits.

3Design Guide | TGH960
Table of Contents
Chapter 1 - Introduction................................................................................................................6
COM Express Overview..........................................................................................................6
Specification ........................................................................................................................... 7
Block Diagram ........................................................................................................................ 9
Board Layout .......................................................................................................................10
Connector ............................................................................................................................10
Terminology .........................................................................................................................11
Chapter 2 - Concept....................................................................................................................12
COM Express Module Standards .......................................................................................12
Chapter 3 - Carrier Board Schematic Guidelines......................................................................13
PCI Express Bus ..................................................................................................................13
Serial ATA .............................................................................................................................20
Gigabit Ethernet (GBE).........................................................................................................22
AC'97 Audio / HD Audio .....................................................................................................25
Universal Serial Bus 2.0 and 3.1 (USB 2.0 and 3.1) ..........................................................29
LVDS/eDP (optional) ............................................................................................................34
VGA........................................................................................................................................39
Digital Display Interface.......................................................................................................42
Miscellaneous.......................................................................................................................48

4Design Guide | TGH960
About this Manual
This manual can be downloaded from the website.
The manual is subject to change and update without notice, and may be based on editions
that do not resemble your actual products. Please visit our website or contact our sales repre-
sentatives for the latest editions.
Warranty
• Warranty does not cover damages or failures that occur from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components
and product specifications.
• The warranty is void if the product has been subjected to physical abuse, improper
installation, modification, accidents or unauthorized repair of the product.
• Unless otherwise instructed in this user’s manual, the user may not, under any cir-
cumstances, attempt to perform service, adjustments or repairs on the product,
whether in or out of warranty. It must be returned to the purchase point, factory or
authorized service agency for all such work.
• We will not be liable for any indirect, special, incidental or consequential damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
• To prevent electrostatic build-up, leave the system board in its anti-static bag until
you are ready to install it.
• Wear an antistatic wrist strap.
• Do all preparation work on a static-free surface.
• Hold the device only by its edges. Be careful not to touch any of the components,
contacts or connections.
• Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the sys-
tem chassis cover for installation or servicing. After installation or servicing, cover
the system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD
protection by wearing an antistatic wrist strap and attaching it to a metal part of
the system chassis. If a wrist strap is unavailable, establish and maintain contact
with the system chassis throughout any procedures requiring ESD protection.

5Design Guide | TGH960
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
The accessories in the package may not come similar to the information listed below. This may
differ in accordance with the sales region or models in which it was sold. For more information
about the standard package in your region, please contact your dealer or sales representative.
• One TGH960-RM590E/QM580E/HM570E board
Optional Items
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Storage devices such as hard disk drive, etc.
You will also need external system peripherals you intend to use which will normally include
at least a keyboard, a mouse and a video display monitor.

6
Chapter 1
INTRODUCTION
Design Guide | TGH960
Chapter 1 - Introduction
XCOM Express Overview
This design guide addendum organizes and provides the recommendations of DFI’s COM car-
rier board design for COM-Express Modules. All other Schematic Guidelines for the carrier
board are applicable and can be found in the PICMG Design Guide V1.0. Please contact DFI
sales and application engineers if there are any questions about designing the carrier board,
or you plan to use this processor in applications other than mobile or desktop platforms.
COM Express complies with COM Express standard from the PCI Industrial Computer Manu-
facturers Group (PICMG) which provides next-generation performance of the smallest state
in the art of embedded modules. DFI’s COM Design Support Services (CDSS) help customers
develop and integrate their carrier boards with DFI’s COM modules. CDSS provides a series
of valuable services such as Product, Design Assistance, Software and Thermal Solution ser-
vices, together they help reduce risks when designing carrier boards. For more details, please
visit at “http://www.dfi.com” DFI offers a wide range of COM products to cater to various
customers’ demands. The modular designs add more flexibilities to the system. The COM Ex-
press form factor allows the COM Express Modules to be easily and securely mounted on a
customized solution board. The design and multiple processor choices eliminate CPU integra-
tion worries and allow fast applications supporting for the most dynamic embedded needs.
COMs are widely used by modular CPU boards with high-integration features.
COM-Express supports a wide range of processors and chipsets. They utilize specialized
technologies, including PCI Express, Serial ATA, USB 2.0, etc. Not only do COMs allow quick
design, they also provide the benefits of easy installation, maintenance and upgrade ease.
Though small in size, COMs implement CPU architectures and basic common circuits.
Many system integrators find that DFI COM solutions have already covered around 80%
of their feature requirements. This makes COM products powerful and cost-efficient.
Carrier board
COM Express Mini Module
Mini
Carrier Board
Compact
Basic
COM Express
Carrier Board

7
Chapter 1
INTRODUCTION
Design Guide | TGH960
XSpecification
SYSTEM Processor 11th Gen Intel®Core™ Processors, BGA 1787
Intel®Xeon®W-11865MRE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E) Intel® Xeon® W-11865MLE, 8 Cores, 24M Cache, 1.5GHz (4.5GHz), 25W (RM590E)
Intel®Core™ i7-11850HE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E/QM580E) Intel® Xeon® W-11555MRE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E)
Intel®Xeon®W-11555MLE, 6 Cores, 12M Cache, 1.9GHz (4.4Hz), 25W (RM590E)
Intel®Core™ i5-11500HE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E/QM580E)
Intel®Xeon®W-11155MRE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E) Intel® Xeon® W-11155MLE, 4 Cores, 8M Cache, 1.8GHz (3.1GHz), 25W (RM590E)
Intel®Core™ i3-1100HE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E/QM580E/HM570E)
Intel®Celeron®6600HE, 2 Cores, 8M Cache, 2.6GHz, 35W (RM590E/QM580E/HM570E)
Chipset Intel®RM590E/QM580E/HM570E Chipset
Memory 3pcs DDR4 3200MHz SO-DIMM up to 96GB,
4th DIMM by request.
Dual Channel DDR4 3200MHz
ECC support
BIOS AMI SPI 256Mbit
GRAPHICS Controller Intel®Iris®Xe Graphics
Feature OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: MPEG2, WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display 1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DDI (DP/DP++)
Multi-displays VGA + LVDS + 2 DDI or
VGA + 3 DDI or
LVDS + 3 DDI
EXPANSION Interface 1 x PCIe x16 (Gen 4)
8 x PCIe x1 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
AUDIO Interface HD Audio
ETHERNET Phy 1 x Intel® I225 series (10/100/1000Mbps/2.5G)
I/O USB 4 x USB 3.2 Gen2
8 x USB 2.0
SATA 4 x SATA 3.0 (up to 6Gb/s)
Support RAID 0/1
DIO 1 x 8-bit DIO (Default 4 inputs and 4 outputs)

8
Chapter 1
INTRODUCTION
Design Guide | TGH960
WATCHDOG TIMER Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds
STORAGE (Optional) NVMe SSD PCIe x4 Gen4, 64GB~1TB
SSD and 2nd DDR4 SO-DIMM(DIMM2) is alternative function
SECURITY TPM TPM2.0 (Available Upon Request)
Power Type 8.5V~20V, 5VSB, VCC_RTC (ATX mode)
8.5V~20V, VCC_RTC (AT mode)
Consumption Typical: 19V @ 2.66A (50.54 Watt)
Max.: 19V @ 6.72A (127.68 Watt)
OS SUPPORT Microsoft Windows 10 IoT Enterprise 64-bit
Linux Ubuntu 20.04
ENVIRONMENT Temperature Operating: 0 to 60°C, -40 to 70°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF TBD
MECHANICAL Dimensions COM Express®Basic 95mm (3.74") x 125mm (4.9")
Compliance PICMG COM Express® R3.0, Type 6

9
Chapter 1
INTRODUCTION
Design Guide | TGH960
XBlock Diagram

10
Chapter 1
INTRODUCTION
Design Guide | TGH960
XBoard Layout XConnector
TOP VIEW
SPI Flash BIOS
Intel
CM246/QM370/HM370
DDR4_1 SODIMM DDR4_3 SODIMM
CPU fan 1
1
JP8000
DDR4_2 SODIMM DDR4_4 SODIMM
D110 D1
C110 C1
B110 B1
A110 A1
COM Express Connector
COM Express Connector
BOTTOM VIEW
DDR4_2 SODIMM DDR4_4 SODIMM
D110 D1
C110 C1
B110 B1
A110
A1
COM Express Connector
COM Express Connector
The COM Express connector is used to interface the TGH960 COM Express board to a carrier
board. Connect the COM Express connector (located on the solder side of the board) to the
COM Express connector on the carrier board.Refer to the following pages for the pin functions
of the connector.
COM Express Connector

11
Chapter 1
INTRODUCTION
Design Guide | TGH960
XTerminology
Conventions and Terminology
BTB Board to board COMe connector
COM A serial port interface on IBM PC-compatible computers running
Microsoft Windows or MS-DOS
COM-Express New generation technology of Computer On Module
CPU Central Processing Unit
CRT Cathode Ray Tube
LPDDR4/4X Low Power Double Data Rate IV SDRAM memory technology
DVI Digital Visual Interface
DVO Digital Video Out
EMI Electromagnetic Interference
ESD Electrostatic Discharge
FSB Front Side Bus, synonymous with Host or CPU bus
PCH Refers to the Peripheral Component Interface (PCI) Controller Hub
HD Audio High Denition Audio
I2CInter-IC (a two wire serial bus created by Philips)
IDE (ATA) Integrated Drive Electronics (Advanced Technology Attachment)
INTx An interrupt request signal where x stands for interrupts A, B, C,
and D
LAN A local area network (LAN) is a computer network covering a small
physical area
LCD Liquid Crystal Display
LPC The Low Pin Count (LPC) Interface Specication for legacy I/O has
facilitated the industry's transition toward ISA-less systems
LVDS LCD Low Voltage Dierential Signaling: A high speed, low power data
transmission standard used for display connections to LCD panels
MCH Refers to the Memory Controller Hub chipset component
NTSC National Television Standards Committee
PAL Phase Alternate Line
PCI Peripheral Component Interface
PCI-Express New generation PCI interface with serial interconnection technology
RTC Real Time Clock
SATA Serial ATA interface
SMBus System Management Bus
TMDS Transition Minimized Dierential Signaling
TV Television supports NTSC and PAL
UART A universal asynchronous receiver/transmitter that translates data
between parallel and serial forms.
USB Universal Serial Bus

12
Chapter 2
CONCEPT
Design Guide | TGH960
Chapter 2 - Concept
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50 4.00 0.00
Extended
BasicCompact
Mini
74.20 80.00 91.00 121.00 151.00
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
XCOM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
TGH960 is a COM Express Basic. The dimension is 95mm x 125mm.

13
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
Chapter 3 - Carrier Board Schematic Guidelines
XPCI Express Bus
PCI Express Lanes Signals Descriptions
Signal
Pin#
Module Pin
Type
Pwr Rail
/Tolerance
TGH960 PU/PD
Carrier Board
Description
PCIE_TX0+
A68
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect to PCIE device or slot
PCI
Express differential transmit pairs 0
PCIE_TX0-
A69
AC Coupling capacitor
PCIE_RX0+
B68
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin
PCI
Express differential receive pairs 0
PCIE_RX0-
B69
PCIE_TX1+
A64
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect to PCIE device or slot
PCI
Express differential transmit pairs 1
PCIE_TX1-
A65
AC Coupling capacitor
PCIE_RX1+
B64
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin
PCI
Express differential receive pairs 1
PCIE_RX1-
B65
PCIE_TX2+
A61
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect to PCIE device or slot
PCI
Express differential transmit pairs 2
PCIE_TX2-
A62
AC Coupling capacitor
PCIE_RX2+
B61
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin
PCI
Express differential receive pairs 2
PCIE_RX2-
B62
PCIE_TX3+
A58
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect to PCIE device or slot
PCI
Express differential transmit pairs 3
PCIE_TX3-
A59
AC Coupling capacitor
PCIE_RX3+
B58
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin
PCI
Express differential receive pairs 3
PCIE_RX3-
B59
PCIE_TX4+
A55
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect to PCIE device or slot
PCI
Express differential transmit pairs 4
PCIE_TX4-
A56
AC Coupling capacitor
PCIE_RX4+
B55
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin PCI Express differential receive pairs 4
PCIE_RX4-
B56
PCIE_TX5+
A52
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect
to PCIE device or slot PCI Express differential transmit pairs 5
PCIE_TX5-
A53
AC Coupling capacitor
PCIE_RX5+
B52
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin PCI Express differential receive pairs 5 (
PCIE_RX5-
B53
PCIE_TX6+
D19
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect
to PCIE device or slot PCI Express differential transmit pairs 6
PCIE_TX6-
D20
AC Coupling capacitor
PCIE_RX6+
C19
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF
Slot - Connect to PCIE Conn pin PCI Express differential receive pairs 6
PCIE_RX6-
C20
PCIE_TX7+
D22
O
PCIE AC coupled on
Module
AC Coupling capacitor
Connect
to PCIE device or slot PCI Express differential transmit pairs 7
PCIE_TX7-
D23
AC Coupling capacitor
PCIE_RX7+
C22
I PCIE
AC coupled off
Module
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3
Slot - Connect to PCIE Conn pin PCI Express differential receive pairs 7
PCIE_RX7-
C23
PCIE0_CK_REF+
A88
O PCIE
PCIE
Connect to
PCIE device, PCIe CLK Buffer or slot
Reference clock output for all PCI Express and PCI Express Graphics lanes.
PCIE0_CK_REF-
A89
PCI Express Lanes Signals Descriptions (PCIE Gen4 on board NVME SSD Only)
Signal
Pin#
Module
Pin Type
Pwr Rail /Tolerance
TGH960 PU/PD
Carrier Board
Description
PCIE4_TX0+
NA
O PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential transmit pairs 0
PCIE4_TX0-
NA
AC Coupling capacitor
PCIE4_RX0+
NA
I PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential receive pairs 0
PCIE4_RX0-
NA
AC Coupling capacitor
PCIE4_TX1+
NA
O PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential transmit pairs 1
PCIE4_TX1-
NA
AC Coupling capacitor
PCIE4_RX1+
NA
I PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential receive pairs 1
PCIE4_RX1-
NA
AC Coupling capacitor
PCIE4_TX2+
NA
O PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential transmit pairs 2
PCIE4_TX2-
NA
AC Coupling capacitor
PCIE4_RX2+
NA
I PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential receive pairs 2
PCIE4_RX2-
NA
AC Coupling capacitor
PCIE4_TX3+
NA
O PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential transmit pairs 3
PCIE4_TX3-
NA
AC Coupling capacitor
PCIE4_RX3+
NA
I PCIE AC coupled on Module
AC Coupling capacitor
NA (for On board NVME SSD only)
PCI Express differential receive pairs 3
PCIE4_RX3-
NA
AC Coupling capacitor
Signal Description
The table listed below illustrates the signal descriptions of PCI Express Bus, including the following information:
Signal: signal name
Pin: pin number
Pin Type: the methods of transmission and reception
I input to the Module
O output from the Module
I/O bi-directional input/output signal
OD open drain output
Pwr Rail/Tolerance: power voltage
TGH960: the description of Module board
Module Base Specification R2.1 Description
COM Express Carrier Design Guide R2.0 Description

14
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
PEG Signals Descriptions (PCIE Gen4)
Signal
Pin#
Module Pin Type
Pwr Rail /Tolerance
TGH960 PU/PD
Carrier Board
Description
PEG_TX0+
D52
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 0
PEG_TX0-
D53
AC Coupling capacitor
PEG_RX0+
C52
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 0
PEG_RX0-
C53
PEG_TX1+
D55
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 1
PEG_TX1-
D56
AC Coupling capacitor
PEG_RX1+
C55
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 1
PEG_RX1-
C56
PEG_TX2+
D58
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 2
PEG_TX2-
D59
AC Coupling capacitor
PEG_RX2+
C58
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 2
PEG_RX2-
C59
PEG_TX3+
D61
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot
- Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 3
PEG_TX3-
D62
AC Coupling capacitor
PEG_RX3+
C61
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 3
PEG_RX3-
C62
PEG_TX4+
D65
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 4
PEG_TX4-
D66
AC Coupling capacitor
PEG_RX4+
C65
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 4
PEG_RX4-
C66
PEG_TX5+
D68
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 5
PEG_TX5-
D69
AC Coupling capacitor
PEG_RX5+
C68
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 5
PEG_RX5-
C69
PEG_TX6+
D71
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 6
PEG_TX6-
D72
AC Coupling capacitor
PEG_RX6+
C71
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 6
PEG_RX6-
C72
PEG_TX7+
D74
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 7
PEG_TX7-
D75
AC Coupling capacitor
PEG_RX7+
C74
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 7
PEG_RX7-
C75
PEG_TX8+
D78
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 8
PEG_TX8-
D79
AC Coupling capacitor
PEG_RX8+
C78
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 8
PEG_RX8-
C79
PEG_TX9+
D81
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 9
PEG_TX9-
D82
AC Coupling capacitor
PEG_RX9+
C81
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 9
PEG_RX9-
C82
PEG_TX10+
D85
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin
PCI Express Graphics transmit differential pairs 10
PEG_TX10-
D86
AC Coupling capacitor
PEG_RX10+
C85
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 10
PEG_RX10-
C86
PEG_TX11+
D88
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot
- Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 11
PEG_TX11-
D89
AC Coupling capacitor
PEG_RX11+
C88
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 11
PEG_RX11-
C89
PEG_TX12+
D91
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 12
PEG_TX12-
D92
AC Coupling capacitor
PEG_RX12+
C91
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 12
PEG_RX12-
C92
PEG Signals Descriptions
Signal
Pin#
Module Pin Type
Pwr Rail /Tolerance
TGH960 PU/PD
Carrier Board
Description
PEG_TX13+
D94
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 13
PEG_TX13-
D95
AC Coupling capacitor
PEG_RX13+
C94
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 13
PEG_RX13-
C95
PEG_TX14+
D98
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 14
PEG_TX14-
D99
AC Coupling capacitor
PEG_RX14+
C98
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 14
PEG_RX14-
C99
PEG_TX15+
D101
O PCIE AC coupled on Module
AC Coupling capacitor
Device - Connect AC Coupling cap 0.1uF for Gen1/2 ; 0.22uF for Gne3/4
Slot - Connect to PCIE Conn pin PCI Express Graphics transmit differential pairs 15
PEG_TX15-
D102
AC Coupling capacitor
PEG_RX15+
C101
I PCIE AC coupled off Module
Connect
to PCIE device or slot PCI Express Graphics receive differential pairs 15
PEG_RX15-
C102
PEG_LANE_RV#
D54
I CMOS
3.3V / 3.3V
PU 20K to 3.3V
PCI Express Graphics lane reversal input strap. Pull low on the Carrier board to reverse lane order.
DDI Signals Descriptions
Signal
Pin#
Module Pin
Type
Pwr Rail
/Tolerance
TGH960 PU/PD
Carrier Board
Description
DDI1_PAIR0+
D26
O PCIE AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP1_LANE0+/- for DP / TMDS1_DATA2+/- for HDMI or DVI
DDI1_PAIR0-
D27
Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1+
D29
O PCIE AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP1_LANE1+/- for DP / TMDS1_DATA1+/- for HDMI or DVI
DDI1_PAIR1-
D30
Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2+
D32
O PCIE AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP1_LANE2+/- for DP / TMDS1_DATA0+/- for HDMI or DVI
DDI1_PAIR2-
D33
Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3+
D36
O PCIE AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP1_LANE3+ for DP / TMDS1_CLK+/-
DDI1_PAIR3-
D37
Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR4+
C25
I PCIE AC coupled off
Module
NA (No support)
NA (No support)
DDI1_PAIR4-
C26
NA (No support)
NA (No support)
DDI1_PAIR5+
C29
I PCIE AC coupled off
Module
NA (No support)
NA (No support)
DDI1_PAIR5-
C30
NA (No support)
NA (No support)
DDI1_PAIR6+
C15
I PCIE AC coupled off
Module
NA (No support)
NA (No support)
DDI1_PAIR6-
C16
NA (No support)
NA (No support)
DDI1_CTRLCLK_AUX+
D15
I/O PCIE AC coupled on
Module
PD 100K to GND
(S/W IC between Rpu/PCH) Connect to DP1AUX+ DP AUX+ function if DDI1_DDC_AUX_SEL is no connect
I/O OD CMOS
3.3V / 3.3V
PU 2.2K to 3.3V, PD 100K to GND
(S/W IC between Rpu/Rpd
resistor)
Connect to HDMI1/DVI1I2C CTRLCLK
HDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high
DDI1_CTRLCLK_AUX-
D16
I/O PCIE AC coupled on
Module
PU 100K to 3.3V
(S/W IC between Rpu/PCH) Connect to DP1AUX-DP AUX- function if DDI1_DDC_AUX_SEL is no connect
I/O OD CMOS
3.3V / 3.3V
PU 2.2K to 3.3V/PU 100K to 3.3V
(S/W IC between 2.2K/100K
resistor)
Connect to HDMI1/DVI1I2C CTRLDATA
HDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high
DDI1_HPD C24 I CMOS 3.3V / 3.3V
PD
1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect
DDI1_DDC_AUX_SEL
D34
I CMOS
3.3V / 3.3V
PD 1M to GND
The DDC_AUX_SEL pin should be routed to pin 13 of the DisplayPort connector, to enable
Dual
-Mode
PU 100K to
3.3V for DDC(HDMI/DVI)
Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-. DDI[n]_DDC_AUX_SEL
shall be pulled to 3.3V on the Carrier with a 100K Ohm resistor to configure the DDI[n]_AUX pair as
the DDC channel.
Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
DDI2_PAIR0+ D39
O PCIE
AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device DP2_LANE0+/- for DP / TMDS2_DATA2+/- for HDMI or DVI
DDI2_PAIR0-D40
Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1+ D42
O PCIE
AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP2_LANE1+/- for DP / TMDS2_DATA1+/- for HDMI or DVI
DDI2_PAIR1-D43
Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2+ D46
O PCIE
AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP2_LANE2+/- for DP / TMDS2_DATA0+/- for HDMI or DVI
DDI2_PAIR2-D47
Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3+ D49
O PCIE
AC coupled off
Module
Connect AC Coupling Capacitors 0.1uF to Device
DP2_LANE3+ for DP / TMDS2_CLK+/-
DDI2_PAIR3-D50
Connect AC Coupling Capacitors 0.1uF to Device

15
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
• Schematic Guidelines
Each PCI Express lane is AC coupled between its corresponding transmitter (TX) and receiver (RX). The figure below displays the connection for COM Express signals and
PCI Express connectors. The AC coupling capacitors of TX+/- is shown on COM Express Module. The AC coupling capacitors of RX+/- should be close to TX+/- pin oh the
PCIE device. The RX+/- of the PCIe slot pin should be connected to BTB RX+/- pin directly.
Use the exactly same package size for the capacitor on each signal in a differential pair. The reference for the PCI Express capacitor is indicated below.
AC Coupling
Capacitor Value Gen1 or Gen2
Min = 75 nF
Max = 265 nF
AC Coupling
Capacitor Value Gen3
Min = 180 nF
Max = 265 nF

16
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
The table listed below summaries the layout routing guidelines of PCI Express Lanes.
Max VIA Count Impedance
(Intel Spec)
Total Trace
Length GEN3
(Intel Spec)
Pin# BTB Pin Name Module Board trace Length ML BTB Length Carrier Board maximum
Trace Length CL
3Differential
85Ω±7% 8000
A68 PCIE_TX0+ 2303 500 5197
A69 PCIE_TX0-
B68 PCIE_RX0+ 2238 500 5262
B69 PCIE_RX0-
A64 PCIE_TX1+ 2413 500 5087
A65 PCIE_TX1-
B64 PCIE_RX1+ 2159 500 5341
B65 PCIE_RX1-
A61 PCIE_TX2+ 2382 500 5118
A62 PCIE_TX2-
B61 PCIE_RX2+ 2184 500 5316
B62 PCIE_RX2-
A58 PCIE_TX3+ 2398 500 5102
A59 PCIE_TX3-
B58 PCIE_RX3+ 2238 500 5262
B59 PCIE_RX3-
A55 PCIE_TX4+ 2574 500 4926
A56 PCIE_TX4-
B55 PCIE_RX4+ 2328 500 5172
B56 PCIE_RX4-
A52 PCIE_TX5+ 2437 500 5063
A53 PCIE_TX5-
B52 PCIE_RX5+ 2291 500 5209
B53 PCIE_RX5-
D19 PCIE_TX6+ 1421 500 6079
D20 PCIE_TX6-
C19 PCIE_RX6+ 1513 500 5987
C20 PCIE_RX6-
D22 PCIE_TX7+ 1478 500 6022
D23 PCIE_TX7-
C22 PCIE_RX7+ 1694 500 5806
C23 PCIE_RX7-
* Trace length Unit: mils
• PCI Express Layout Guidelines (PCH)

17
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
The table listed below summaries the layout routing guidelines of PEG Express.
Max VIA Count Impedance
(Intel Spec)
Total TX
Trace Length
(Intel Spec)
Pin# BTB Pin Name Module Board trace Length ML BTB Length Carrier Board maximum
Trace Length CL
2Differential
85Ω±10% 6869
D52 PEG_TX0+ 1221 500 5,247
D53 PEG_TX0-
D55 PEG_TX1+ 992 500 5,476
D56 PEG_TX1-
D58 PEG_TX2+ 855 500 5,613
D59 PEG_TX2-
D61 PEG_TX3+ 957 500 5,511
D62 PEG_TX3-
D65 PEG_TX4+ 837 500 5,631
D66 PEG_TX4-
D68 PEG_TX5+ 906 500 5,562
D69 PEG_TX5-
D71 PEG_TX6+ 809 500 5,659
D72 PEG_TX6-
D74 PEG_TX7+ 820 500 5,648
D75 PEG_TX7-
D78 PEG_TX8+ 831 500 5,637
D79 PEG_TX8-
D81 PEG_TX9+ 808 500 5,660
D82 PEG_TX9-
D85 PEG_TX10+ 818 500 5,650
D86 PEG_TX10-
D88 PEG_TX11+ 838 500 5,630
D89 PEG_TX11-
D91 PEG_TX12+ 858 500 5,610
D92 PEG_TX12-
D94 PEG_TX13+ 853 500 5,615
D95 PEG_TX13-
D98 PEG_TX14+ 821 500 5,647
D99 PEG_TX14-
D101 PEG_TX15+ 929 500 5,539
D102 PEG_TX15-
* Trace length Unit: mils
• PEG Express Layout Guidelines

18
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
The table listed below summaries the layout routing guidelines of PEG Express.
Max VIA Count Impedance
(Intel Spec)
Total RX
Trace Length
(Intel Spec)
Pin# BTB Pin Name Module Board trace Length ML BTB Length Carrier Board maximum
Trace Length CL
2Differential
85Ω±10% 6869
C52 PEG_RX0+ 1295 500 5,173
C53 PEG_RX0-
C55 PEG_RX1+ 1304 500 5,164
C56 PEG_RX1-
C58 PEG_RX2+ 1294 500 5,174
C59 PEG_RX2-
C61 PEG_RX3+ 1302 500 5,166
C62 PEG_RX3-
C65 PEG_RX4+ 1171 500 5,297
C66 PEG_RX4-
C68 PEG_RX5+ 1208 500 5,260
C69 PEG_RX5-
C71 PEG_RX6+ 1128 500 5,340
C72 PEG_RX6-
C74 PEG_RX7+ 1236 500 5,232
C75 PEG_RX7-
C78 PEG_RX8+ 1097 500 5,371
C79 PEG_RX8-
C81 PEG_RX9+ 1179 500 5,289
C82 PEG_RX9-
C85 PEG_RX10+ 1140 500 5,328
C86 PEG_RX10-
C88 PEG_RX11+ 1213 500 5,255
C89 PEG_RX11-
C91 PEG_RX12+ 1058 500 5,410
C92 PEG_RX12-
C94 PEG_RX13+ 1183 500 5,285
C95 PEG_RX13-
C98 PEG_RX14+ 1104 500 5,364
C99 PEG_RX14-
C101 PEG_RX15+ 1289 500 5,179
C102 PEG_RX15-
* Trace length Unit: mils
• PEG Express Layout Guidelines

19
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
Board-to-Board
COMe Module Carrier Board
TX
RX
AC
Couple
Note:
The RX+/-AC Cap on the carrier board is only for PEG 3.0

20
Chapter 3
CARRIER BOARD SCHEMATIC GUIDELINES
Design Guide | TGH960
XSerial ATA
Signal Description
The table listed below illustrates the signal descriptions of Serial ATA devices, including the following information:
Signal: signal name
Pin: pin number
Pin Type: the methods of transmission and reception
I input to the Module
O output from the Module
I/O bi-directional input/output signal
OD open drain output
Pwr Rail/Tolerance: power voltage
TGH960: the description of Module board
Module Base Specification R2.1 Description
COM Express Carrier Design Guide R2.0 Description
HDA Signals Descriptions
Signal
Pin#
Module Pin
Type
Pwr Rail
/Tolerance
TGH960 PU/PD
Carrier Board
Description
HAD_RST#
A30
O CMOS
3.3V Suspend/3.3V
series 33Ω resistor/PD 100KΩ
Connect to CODEC pin 11 RESET#
Reset output to CODEC, active low.
HDA_SYNC
A29
O CMOS
3.3V/3.3V
series 33Ω resistor/PD 100KΩ
Connect to CODEC pin 10 SYNC
Sample-synchronization signal to the CODEC(s).
HDA_BITCLK
A32
I/O CMOS
3.3V/3.3V
series 33Ω resistor/PD 100KΩ
Connect to CODEC pin 6 BIT_CLK
Serial data clock generated by the external CODEC(s).
HDA_SDOUT
A33
O CMOS
3.3V/3.3V
series 33Ω resistor/PD 10KΩ
Connect to CODEC pin 5 SDATA_OUT
Serial TDM data output to the CODEC.
HDA_SDIN2
B28
I/O CMOS
3.3V Suspend/3.3V
HDA_SDIN2 NA
NC
Serial TDM data inputs from up to 3 CODECs.
HDA_SDIN1
B29
I/O CMOS
3.3V Suspend/3.3V
Connect 33 Ωin series to CODEC1 pin 8 SDATA_IN
HDA_SDIN0
B30
I/O CMOS
3.3V Suspend/3.3V
Connect 33 Ωin series to CODEC0 pin 8 SDATA_IN
Gigabit Ethernet Signals Descriptions
Signal
Pin#
Module Pin
Type
Pwr Rail
/Tolerance
TGH960 PU/PD
Carrier Board
Description
GBE0_MDI0+
A13
I/O Analog
3.3V max Suspend
i225 2.5GbE signal
Connect to Magnetics Module MDI0+/-
Gigabit Ethernet Controller 0: Media Dependent Interface DifferentialPairs 0,1,2,3. The MDI can
operate in 1000, 100 and 10 Mbit / sec modes or in 2.5, 5.0 and 10 Gbps modes. Some pairs are
unused in some modes, per the following:
1000BASE-T
2.5GBASE-T
5.0GBASE-T
10GBASE-T
100BASE-TX
10BASE-T
MDI[0]+/-
B1_DA+/-
TX+/-
TX+/-
MDI[1]+/-
B1_DB+/-
RX+/-
RX+/-
MDI[2]+/-
B1_DC+/-
MDI[3]+/-
B1_DD+/-
GBE0_MDI0-
A12
I/O Analog
3.3V max Suspend
GBE0_MDI1+
A10
I/O Analog
3.3V max Suspend
Connect to Magnetics Module MDI1+/-
GBE0_MDI1-
A9
I/O Analog
3.3V max Suspend
GBE0_MDI2+
A7
I/O Analog
3.3V max Suspend
Connect to Magnetics Module MDI2+/-
GBE0_MDI2-
A6
I/O Analog
3.3V max Suspend
GBE0_MDI3+
A3
I/O Analog
3.3V max Suspend
Connect to Magnetics Module MDI3+/-
GBE0_MDI3-
A2
I/O Analog
3.3V max Suspend
GBE0_ACT#
B2
OD CMOS
3.3V Suspend/3.3V
Connect to LED and recommend current limit resistor 150 Ω to 3.3VSB
Gigabit Ethernet Controller 0 activity indicator, active low.
GBE0_LINK#
A8
OD CMOS
3.3V Suspend/3.3V
Gigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100#
A4
OD CMOS
3.3V Suspend/3.3V
Connect to LED and recommend current limit resistor 150 Ω to 3.3VSB
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
GBE0_LINK1000#
A5
OD CMOS
3.3V Suspend/3.3V
Connect to LED and recommend current limit resistor 150 Ω to 3.3VSB
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
GBE0_CTREF
A14
REF
GND min 3.3V max
NC
Reference voltage for Carrier Board Ethernet channel 0 magnetics center tap. The reference voltage is
determined by the requirements of the Module PHY and may be as low as 0V and as high as 3.3V.
The reference voltage output shall be current limited on the Module. In the case in which the reference
is shorted to ground, the current shall be
limited to 250 mA or less.
SATA Signals Descriptions
Signal
Pin#
Module Pin
Type
Pwr Rail
/Tolerance
TGH960 PU/PD
Carrier Board
Description
SATA0_TX+
A16
O SATA
AC coupled on
Module
AC Coupling capacitor
Connect to SATA0 Conn TX pin Serial ATA Channel 0 transmit differential pair.
SATA0_TX-
A17
O SATA
AC coupled on
Module
AC Coupling capacitor
SATA0_RX+
A19
I SATA
AC coupled on
Module
AC Coupling capacitor
Connect to SATA0 Conn RX pin Serial ATA Channel 0 receive differential pair.
SATA0_RX-
A20
I SATA
AC coupled on
Module
AC Coupling capacitor
SATA1_TX+
B16
O SATA
AC coupled on
Module
AC Coupling capacitor
Connect to SATA1 Conn TX pin Serial ATA Channel 1transmit differential pair.
SATA1_TX-
B17
O SATA
AC coupled on
Module
AC Coupling capacitor
SATA1_RX+
B19
I SATA
AC coupled on
Module
AC Coupling capacitor
Connect to SATA1 Conn RX pin Serial ATA Channel 1receive differential pair.
SATA1_RX-
B20
I SATA
AC coupled on
Module
AC Coupling capacitor
SATA2_TX+
A22
O SATA
AC coupled on
Module
AC Coupling capacitor
NA (No support) Serial ATA Channel 2 transmit differential pair.
SATA2_TX-
A23
O SATA
AC coupled on
Module
AC Coupling capacitor
SATA2_RX+
A25
I SATA
AC coupled on
Module
AC Coupling capacitor
NA (No support) Serial ATA Channel 2 receive differential pair.
SATA2_RX-
A26
I SATA
AC coupled on
Module
AC Coupling capacitor
SATA3_TX+
B22
O SATA
AC coupled on
Module
AC Coupling capacitor
NA (No support) Serial ATA Channel 3 transmit differential pair.
SATA3_TX-
B23
O SATA
AC coupled on
Module
AC Coupling capacitor
SATA3_RX+
B25
I SATA
AC coupled on
Module
AC Coupling capacitor
NA (No support) Serial ATA Channel 3 receive differential pair.
SATA3_RX-
B26
I SATA
AC coupled on
Module
AC Coupling capacitor
ATA_ACT#
A28
I/O CMOS
3.3V / 3.3V
Connect to LED and recommend current limit resistor 220Ωto 3.3V
ATA (parallel and serial) activity indicator, active low.