DFI CS170-Q370 User manual

CS170-Q370/C246/H310
Mini-ITX Industrial Motherboard
User’s Manual

CS170-Q370/C246/H310
2
Copyright
This publication contains information that is protected by copyright. No part of it may be re-
produced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifi-
cally disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this docu-
ment. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The web-
site will always provide the most updated information.
© 2022. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-
able protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli-
ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.

CS170-Q370/C246/H310
3
Table of Contents
Copyright ��������������������������������������������������������������������������������������������������������� 2
FCC and DOC Statement on Class B����������������������������������������������������� 2
Warranty���������������������������������������������������������������������������������������������������������� 4
Static Electricity Precautions����������������������������������������������������������������������� 4
Safety Measures���������������������������������������������������������������������������������������������� 4
Chapter 1 - Introduction����������������������������������������������������������������������������� 6
Specifications...........................................................................6
Features..................................................................................8
Watchdog Timer.............................................................................8
DDR4.............................................................................................8
Graphics ........................................................................................8
PCI Express ...................................................................................8
Serial ATA......................................................................................8
Gigabit LAN....................................................................................8
Audio.............................................................................................8
Wake-On-LAN.................................................................................8
Wake-On-USB ................................................................................8
RTC Timer .....................................................................................8
ACPI STR.......................................................................................8
Power Failure Recovery...................................................................8
USB...............................................................................................8
Chapter 2 - Hardware Installation������������������������������������������������������������ 9
Board Layout...........................................................................9
System Memory.......................................................................9
Installing the SODIMM Module......................................................10
CPU ......................................................................................11
Installing the CPU ........................................................................12
Installing the Fan and Heat Sink...................................................14
Jumper Settings.....................................................................15
Clear CMOS Data JP1...................................................................15
COM1/2 Power Selection JP4/5 .....................................................15
LVDS Backlight Power JP7.............................................................16
LVDS Panel Power JP8..................................................................16
LVDS Inverter Power JP10 ............................................................17
Rear Panel I/O Ports..............................................................18
RJ45 LAN Ports ............................................................................18
USB Ports ....................................................................................19
Graphics Interfaces.......................................................................19
COM (Serial) Ports........................................................................20
Audio...........................................................................................20
Internal I/O Connectors .........................................................21
SATA (Serial ATA) Connectors .......................................................21
Cooling Fan Connector..................................................................22
Digital I/O....................................................................................22
LVDS LCD Panel...........................................................................23
Chassis Intrusion Connector .........................................................24
Front Panel Connector..................................................................24
Expansion Slots............................................................................25
Installing the M.2 Module .............................................................25
Front Audio Connector..................................................................26
LPC Connector .............................................................................27
SMBus Connector ........................................................................27
Battery ........................................................................................28
+12V Power.................................................................................28
USB.............................................................................................29
Chapter 3 - BIOS Setup�����������������������������������������������������������������������������30
Overview ..............................................................................30
Main .....................................................................................31
Advanced .............................................................................32
RC ACPI Settings..........................................................................32
CPU Configuration........................................................................33
Power & Performance...................................................................34
PCH-FW Configuration..................................................................34
Trusted Computing.......................................................................37
PTN3460 Configuration.................................................................37
NCT6116D Super IO Configuration ...............................................38
NCT6116D HW Monitor.................................................................39
Serial Port Console Redirection......................................................40
USB Configuration........................................................................41
CSM Configuration........................................................................42
USB Power Control.......................................................................42
Network Stack Configuration.........................................................43
Chipset..................................................................................44
Security.................................................................................48
Boot......................................................................................49
Save & Exit ...........................................................................49
Updating the BIOS.................................................................50
Notice: BIOS SPI ROM...........................................................50
Chapter 4 - RAID����������������������������������������������������������������������������������������51
RAID Levels Introduction........................................................51
Settings.................................................................................51
Chapter 5 - Intel AMT Settings����������������������������������������������������������������53
Overview ..............................................................................53

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CS170-Q370/C246/H310
4
Warranty
1. Warranty does not cover damages or failures that arise from misuse of the product, inabil-
ity to use the product, unauthorized replacement or alteration of components and product
specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal-
lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-
stances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in han-
dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-
nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic-
ing. After installation or servicing, cover the system chassis before plugging the power
cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD pro-
tection by wearing an antistatic wrist strap and attaching it to a metal part of the
system chassis. If a wrist strap is unavailable, establish and maintain contact with
the system chassis throughout any procedures requiring ESD protection.

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CS170-Q370/C246/H310
5
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One CS170-Q370/C246/H310 motherboard
• One Serial ATA data cable (Length: 500mm)
• One I/O shield
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance to the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Optional Items
• USB port cable (Length: 200mm)
• Serial ATA data cable (Length: 500mm)
• Thermal solution (For 35W, Height: 37.3mm)
• Thermal solution (For 65W, Height: 72.8mm)
• Thermal solution (For 80W, Height: 77.1mm)
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance to the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• A CPU
• Memory module
• Storage devices such as hard disk drive, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.

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Chapter 1 - Introduction
6
CS170-Q370/C246/H310
SYSTEM Processor 9th Generation Intel® Core™ Processors, LGA 1151 Socket,
TDP up to 95W
• Xeon E-2278GE Processor (Core 8; Max speed 4.7 GHz;
TDP 80W) (support ECC memory)
• i9-9900K Processor (Core 8, Max speed 5.0 GHz; TDP
95W)
• i7-9700E Processor (Core 8; Max speed 4.4 GHz; TDP
65W)
• i7-9700TE Processor (Core 8; Max speed 3.8 GHz; TDP
35W)
• i5-9500E Processor (Core 6; Max speed 4.2 GHz; TDP
65W)
• i5-9500TE Processor (Core 6; Max speed 3.6 GHz; TDP
35W)
• i3-9100E Processor (Core 4; Max speed 3.7 GHz; TDP
65W) (support ECC memory)
• i3-9100TE Processor (Core 4; Max speed 3.2 GHz; TDP
35W) (support ECC memory)
8th Generation Intel® Core™ Processors, LGA 1151 Socket,
TDP up to 95W
• Xeon E-2176G Processor (Core 6; Max speed 4.7 GHz;
TDP 80W) (support ECC memory)
• i7-8700 Processor (Core 6; Max speed 4.6 GHz; TDP
65W)
• i7-8700T Processor (Core 6; Max speed 4.0 GHz; TDP
35W)
• i5-8500 Processor (Core 6; Max speed 4.1 GHz; TDP
65W)
• i5-8500T Processor (Core 6; Max speed 3.5 GHz; TDP
35W)
• i3-8100 Processor (Core 4; Max speed 3.6 GHz; TDP
65W) (support ECC memory)
• i3-8100T Processor (Core 4; Max speed 3.1 GHz; TDP
35W) (support ECC memory)
• Pentium G5400 Processor (Core 2; Max speed 3.7 GHz;
TDP 58W) (support ECC memory)
• Celeron G4900 Processor (Core 2; Max speed 3.1 GHz;
TDP 54W) (support ECC memory)
Memory Dual Channel DDR4 2400/2666MHz
C246: Two 260-pin ECC/non-ECC SODIMM up to 32GB
(Core™ i5/i7 only support non-ECC)
Q370/H310: Two 260-pin non-ECC SODIMM up to 32GB
Chipset Intel® Q370/C246/H310 Chipset
BIOS AMI SPI 128Mbit
GRAPHICS Controller Intel® UHD Graphics 630 (only Pentium G5400, Celeron
G4900 support 610 )
Chapter 1 - Introduction
Feature OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG,
HEVC/H265, VP8, VP9
HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8,
VP9
Display 1 x LVDS up to 1920x1200 @ 60Hz
1 x VGA up to 1920x1200 @ 60Hz
2 x DP++ up to 4096x2304 @ 60Hz
Triple-
Displays (LVDS & VGA & DP++), (LVDS & DP++ & DP++),
(VGA & DP++ & DP++)
EXPANSION Interface Q370/C246:
1 x PCIe x16 (Gen 3)
1 x M.2 2280 M Key (PCIe x4/SATA) (support NVMe and
Intel® Optane memory)
1 x M.2 2230 E Key (USB/PCIe) (bottom side)
H310:
1 x PCIe x16 (Gen 3)
1 x M.2 2280 M Key (PCIe) (support NVMe)
1 x M.2 2230 E Key (USB/PCIe)
AUDIO Audio
Codec Realtek ALC887S-VD2-GR
ETHERNET Controller Q370/C246:
1 x Intel® I219LM PHY with iAMT12 and vPro
(10/100/1000Mbps) (Core i7/i5 supports iAMT)
1 x Intel® I210AT PCIe (10/100/1000Mbps)
H310:
1 x Intel® I219V PHY (10/100/1000Mbps)
1 x Intel® I210T PCIe (10/100/1000Mbps)
REAR I/O Ethernet 2 x GbE (RJ-45)
USB Q370/C246:
2 x USB 3.1 Gen2
4 x USB 3.1 Gen1
H310:
4 x USB 3.1 Gen1
2 x USB 2.0
Display 1 x VGA (DB-15)
2 x DP++
- Specifications

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Chapter 1 - Introduction
7
CS170-Q370/C246/H310
Serial 2 x RS-232 (DB-9)
Audio Audio 1 x Line-out, 1 x Mic-in,
1 x Line-in (available upon request)
Internal I/O Display 1 x LVDS
Audio 1 x Front Audio (2.00mm pitch)
USB 2 x USB 2.0 (2.00mm pitch)
SATA 2 x SATA 3.0 (up to 6Gb/s) RAID 0/1/5
DIO 1 x 8-bit DIO, 1 x DIO Power
SMBus 1 x SMBus
LPC 1 x LPC
WATCHDOG
TIMER Output &
Interval
System Reset, Programmable via Software from 1 to 255
Seconds
SECURITY TPM dTPM2.0 (default)
POWER Type ATX
Connector 4-pin ATX 12V power, 24-pin ATX power
RTC Battery CR2032 Coin Cell
OS
SUPPORT Windows /
Linux Microsoft Windows 10 IoT Enterprise 64-bit
Linux
Environment Temerature Operating: -5 to 65°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MECHANICAL Dimensions Mini-ITX Form Factor
170mm (6.7") x 170mm (6.7")
Height PCB: 1.6mm
Top Side: 20mm
Bottom Side: 3mm
- Specifications

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Chapter 1 - Introduction
8
CS170-Q370/C246/H310
- Features
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
DDR4
DDR4 delivers increased system bandwidth and improves performance at a lower power than
DDR3/DDR2.
Graphics
The integrated Intel®UHD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with out-
standing graphics responsiveness. These enhancements deliver the performance and compat-
ibility needed for today’s and tomorrow’s business applications.
PCI Express
PCI Express is a high bandwidth I/O infrastructure that possesses the ability to scale speeds
by forming multiple lanes. The PCI Express architecture also supports high performance graph-
ics infrastructure by enhancing the capability.
Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel
ATA whose data transfer rate is 100MB/s.
Gigabit LAN
Two Intel®Gigabit LAN controllers (Intel®I210AT PCIe and Intel®I219V PCIe) support up to
1Gbps data transmission. (CS170-H310)
Two Intel®Gigabit LAN controllers (Intel®I210AT PCIe and Intel®I219LM PCIe) support up to
1Gbps data transmission. (CS170-Q370/C246)
Audio
The Realtek ALC887S-VD2-GR audio codec provides High Definition audio output.
Wake-On-LAN
This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is
supported via the onboard LAN port or via a PCI LAN card that uses the PCI PME (Power Man-
agement Event) signal. However, if your system is in the Suspend mode, you can power-on
the system only through an IRQ or DMA interrupt.
Wake-On-USB
This function allows you to use a USB keyboard or USB mouse to wake up a system from the
S3 (STR - Suspend To RAM) state.
RTC Timer
The RTC installed on the system board allows your system to automatically power-on on the
set date and time.
ACPI STR
The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)
specification. ACPI has energy saving features that enables PCs to implement Power Manage-
ment and Plug-and-Play with operating systems that support OS Direct Power Management.
ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM
function.
With the Suspend to RAM function enabled, you can power-off the system at once by pressing
the power button or selecting “Standby” when you shut down Windows®without having to go
through the sometimes tiresome process of closing files, applications and operating system.
This is because the system is capable of storing all programs and data files during the entire
operating session into RAM (Random Access Memory) when it powers-off. The operating ses-
sion will resume exactly where you left off the next time you power-on the system.
Power Failure Recovery
When power returns after an AC power failure, you may choose to either power-on the system
manually or let the system power-on automatically.
USB
USB 3.1 Gen2 is capable of running at a maximum transmission speed of up to 10 Gbit/s (1.2
GB/s) and is faster than USB 3.1 Gen1 (5 Gbit/s, or 625 MB/s), USB 2.0 (480 Mbit/s, or 60
MB/s) and USB 1.1 (12Mb/s). USB 3.1 reduces the time required for data transmission, reduc-
es power consumption, and is backward compatible with USB 2.0. It is a marked improvement
in device transfer speeds between your computer and a wide range of simultaneously acces-
sible external Plug and Play peripherals.

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
9
DDR4_2 SODIMM
DDR4_1 SODIMM
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
Chapter 2 - Hardware Installation
- Board Layout
- System Memory
Important:
Electrostatic discharge (ESD) can damage your board, pro-
cessor, disk drives, add-in boards, and other components.
Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide
some ESD protection by wearing an antistatic wrist strap
and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact
with the system chassis throughout any procedures requir-
ing ESD protection.
Important:
When the Standby Power LED lit red, it indicates that
there is power on the system board. Power-off the PC
then unplug the power cord prior to installing any devices.
Failure to do so will cause severe damage to the mother-
board and components.
Note:
A M.2 E Key 2230 socket with standoff is available at the bottom side of this board.
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
M.2 2230
E Key
Bottom Side
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
1
4
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
BatteryBattery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
M.2 2230
E Key
Bottom Side

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
10
Installing the SODIMM Module
Before installing the memory module, please make sure that the following safety cautions are
well-attended.
1. Make sure the PC and all other peripheral devices connected to it has been powered
down.
2. Disconnect all power cords and cables.
3. Locate the SO-DIMM socket on the system board
4. Make sure the notch on memory card is aligned to the key on the socket.
Notch
Retention Notch
Key
Socket Top View
DDR4 SO-DIMM
Retention Clip
45°
Step 1
Step 2
Step 3
Features
• Two 260-pin SODIMM up to 32GB
• Dual Channel DDR4 2133/2400/2666MHz
• ECC memory supported by CS170-C246
The system board supports the following memory interface.
Single Channel (SC)
Data will be accessed in chunks of 64 bits from the memory channels.
Dual Channel (DC)
Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides
better system performance because it doubles the data transfer rate.
Single Channel DIMMs are on the same channel. DIMMs in a channel can be identi-
cal or completely different. However, we highly recommend using
identical DIMMs. Not all slots need to be populated.
Dual Channel DIMMs of the same memory configuration are on different channels.
System Memory
System Memory

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Chapter 2 - Hardware Installation
11
Please follow the steps below to install the memory card into the socket.
Insert the memory card into the
slot while making sure 1) the
notch and the key are aligned,
and 2) the non-connector end
rises approximately 45 degrees
horizontally. Press the card firmly
into the socket while applying and
maintaining even pressure on both
ends.
Press the end of the card far from
the socket down while making
sure the retention notch and the
clip align as indicated by the dot-
ted line in the illustration. If the
retention notch and the clip do not
align, please remove the card and
re-insert it. Press the card all the
way down.
The clips snap automatically and
abruptly to the retention notches
of the card sounding a distinctive
click, and lock the card in place.
Inspect that the clip sits in the
notch. If not, please pull the clips
outward, release and remove the
card, and mount it again.
Notch
Retention Notch
Key
Socket Top View
DDR4 SO-DIMM
Retention Clip
45°
Step 1
Step 2
Step 3
- CPU
The system board is equipped with a surface mount LGA 1151 socket. This socket is exclu-
sively designed for installing a LGA 1151 packaged Intel CPU.
Protective
cap
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
Important:
1. Before you proceed, make sure (1) the LGA 1151 socket comes with a protec-
tive cap, (2) the cap is not damaged and (3) the socket’s contact pins are not
bent. If the cap is missing or the cap and/or contact pins are damaged, contact
your dealer immediately.
2. Make sure to keep the protective cap. RMA requests will be accepted and pro-
cessed only if the LGA 1151 socket comes with the protective cap.
- System Memory

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Chapter 2 - Hardware Installation
12
Installing the CPU
1. Make sure the PC and all other peripheral devices connected to it have been powered
down.
2. Disconnect all power cords and cables.
3. Locate the LGA 1151 CPU
socket on the system board.
4. Unlock the socket by pressing
the load lever down, moving
it sideways until to escape the
retention tab. Lift the load lever
up when it’s released.
Retention tab
Load lever
Important:
The CPU socket must not come in contact with anything other than the CPU. Avoid
unnecessary exposure. Remove the protective cap only when you are about to in-
stall the CPU.
CPU
6. Remove the protective cap from
the CPU socket. The cap is used
to protect the CPU socket against
dust and harmful particles. Re-
move the protective cap only
when you are about to install the
CPU.
5. Lift the load lever and the load
plate all the way up as shown in
the photo.
Load lever
Load
plate
Protective cap
7-1.Insert the CPU into
the socket. The gold
triangular mark on the
CPU must align with
the chamfer corner of
the CPU socket shown
in the photo.
Golden triangular
mark

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
13
7-2.Two keys on the sock-
et and notches on
the CPU also facilitate
alignment.
7-3.The CPU’s notch will
fit into the socket’s
alignment key when
it’s seated in the cor-
rect orientation.
Alignment key
Alignment key
CPU
8. Close the load plate
then push the load le-
ver down.
While closing the load
plate, make sure the
front edge of the load
plate slides under the
retention knob.
9. Press down the load
lever and hook it un-
der the retention tab.
Retention knob
Load lever
Important:
The CPU will fit in only one orientation and can easily be seated without exerting
any force.

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
14
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
Installing the Fan and Heat Sink
The CPU must be kept cool by using a CPU fan with heat sink. Without sufficient air circula-
tion across the CPU and heat sink, the CPU will overheat damaging both the CPU and system
board.
1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of
the CPU. The thermal paste is usually supplied when you purchase the fan / heat sink
assembly. Do not spread the paste all over the surface. When you later place the heat
sink on top of the CPU, the compound will disperse evenly.
Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal
paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel
the strip that covers the paste before you place the fan / heat sink on top of the CPU.
2. Place the heat sink on
top of the CPU. The 4
spring screws around
the heat sink, which
are used to secure
the heat sink onto the
system board, must
match the 4 mount-
ing holes around the
socket.
3. Orient the heat sink
so that the CPU fan’s
cable is nearest the
CPU fan connector.
Mounting
holes
CPU fan
connector
CPU
4. Screw tight two of
the spring screws at
opposite corners into
the mounting holes.
And then proceed with
the other two spring
screws.
Heat sink
“Locked” position of
push-pin
5. Connect the CPU fan’s
cable to the CPU fan
connector on the sys-
tem board.
“Unlocked” position
of push-pin
Note:
A boxed Intel®processor already includes the CPU fan and heat sink assembly. If
your CPU was purchased separately, make sure to only use Intel®-certified fan and
heat sink.

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
15
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
- Jumper Settings
Clear CMOS Data JP1
If any anomaly of the followings is encountered —
a) CMOS data is corrupted;
b) you forgot the supervisor or user password;
c) failure to start the system due to BIOS mis-configuration
— it is suggested that the system be reconfigured with default values stored in the ROM BIOS.
To load the default values stored in the ROM BIOS, please follow the steps below.
1. Power-off the system and unplug the power cord.
2. Put a jumper cap on JP1’s pin 2 and pin 3. Wait for a few seconds and set JP1 back to
its default setting, i.e. jumper cap on pin 1 and pin 2.
3. Plug the power cord and power-on the system.
Normal (default) 1-2 On
Clear CMOS Data 2-3 On
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
COM1/2 Power Selection JP4/5
RS232 Standard (Default) 1-3 / 2-4 On
RS232 with Power 3-5 / 4-6 On
JP4
JP5
JP4 (for COM 1) and JP5 (for COM 2) are designed to configure Serial COM ports to pure
RS232 or RS232 with power.

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
16
LVDS Panel Power JP8
JP8 is used to select the power supplied with the LVDS LCD panel.
LVDS Backlight Power JP7
JP7 is used to select the power level of backlight control: +3.3V (default) or +5V.
Important:
Before powering-on the system, make sure that the power settings of JP8 match
the LCD panel’s specification. Selecting the incorrect voltage will seriously dam-
age the LCD panel.
Jumper Settings
Jumper Settings
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
3.3V (default) 1-2 On
5V 2-3 On
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
12V 1-2 On
5V 3-4 On
3.3V (default) 5-6 On
Important:
Before powering-on the system, make sure that the power settings of JP7 match
the power specification of backlight control. Selecting the incorrect voltage will
seriously damage the backlight.

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
17
LVDS Inverter Power JP10
JP10 is used to select the power level of LVDS Inverter: +5V (default) or +12V.
Jumper Settings
DDR4_1 SODIMM
DDR4_2 SODIMM
Intel
C246/Q370/H310
M.2 2280
M Key
65
21
JP4
12
56
JP5
JP7
11
33
JP10
6
5
2
1
JP8
JP1
13
CPU Fan
LVDS
SATA1
(R2)
SATA0
ATX Power
LVDS
Inverter Power
1
1
39
2
8
1
1
1
Front Panel
81
DIO
14
DIO
Power
1 3
System
Fan
1
LPCLPC
2
8
SMI
10
2
USB7/8
(USB 2.0)
USB7/8
(USB 2.0)
+12V Power
1
2
9
Front Audio
LAN1LAN2
USB 3/4
(USB 3.1 Gen1)
USB 1/2
(USB 3.1 Gen2
/USB 3.1 Gen1)
DP1
USB 7/9
(USB 3.1 Gen1
/USB 2.0)
LAN1
COM1
COM2
VGA
DP2
Audio
2
1
Chassis
Intrusion
Chassis
Intrusion
Chassis
Intrusion
2
5
SM BUS
Battery
Battery
Buzzer
PCIe Gen3
x16
Realtek
ALC887
+12V 1-2 On
5V (default) 2-3 On

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
18
- Rear Panel I/O Ports
- Rear Panel I/O Ports
Mic-in
Line-out
Line-in
LAN 2LAN 1VGACOM 1
USB 3.1 Gen 1
DP++ COM 2 DP++ USB 3.1
Gen 2 USB 3.1
Gen 1
Mic-in
Line-out
Line-in
LAN 2LAN 1VGACOM 1
USB 2.0
DP++ COM 2 DP++ USB 3.1
Gen 1 USB 3.1 Gen 1
Q370/C246
H310
RJ45 LAN Ports
The two LAN ports allow the system board to connect to a local area network by means of a
network hub.
Features
LAN1 :
• Q370/C246: Intel®i219LM PHY(10/100/1000Mbps)
• H310: Intel®i219V PHY(10/100/1000Mbps)
LAN2 :
• Intel®i210AT PCIe(10/100/1000Mbps)
LAN 2LAN 1

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
19
Rear Panel I/O Ports
Rear Panel I/O Ports
The USB device allows data exchange between your computer and a wide range of simultane-
ously accessible external Plug and Play peripherals.
The motherboard is equipped with 6 onboard USB Type A ports (USB 1/2 & 3-4 & 7/9) at the
panel I/O ports with different speeds vary from the chipset.
USB Ports
USB 3.1 Gen 1
(7/9) USB 3.1 Gen 2
(1/2)
USB 3.1 Gen 1
(3/4)
Graphics Interfaces
DP++ Port
The DisplayPort is a digital display interface used to connect a display device such as a com-
puter monitor. It is used to transmit audio and video simultaneously. The interface, which is
developed by VESA, delivers higher performance features than any other digital interface.
VGA
The VGA port is used for connecting a VGA monitor. Connect the monitor’s 15-pin D-shell cable
connector to the VGA port. After you plug the monitor’s cable connector into the VGA port,
gently tighten the cable screws to hold the connector in place.
VGA
DP++ DP++

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CS170-Q370/C246/H310
Chapter 2 - Hardware Installation
20
Rear Panel I/O Ports
COM (Serial) Ports
The serial mode of COM 1 and COM 2 is fixed at RS232.
The serial ports are asynchronous communication ports with 16C550A-compatible UARTs that
can be used with modems, serial printers, remote display terminals, and other serial devices.
COM 1
COM 2
Audio
Rear Audio
The system board is equipped with 2 audio jacks (Line-out and Mic-in). Line-in jack is available
upon request. A jack is a one-hole connecting interface for inserting a plug.
• Line-in Jack (Light Blue) (optional)
This jack is used to connect any audio devices such as Hi-fi set, CD player, tape player,
AM/FM radio tuner, synthesizer, etc.
• Line-out Jack (Lime)
This jack is used to connect a headphone or external speakers.
• Mic-in Jack (Pink)
This jack is used to connect an external microphone
Mic-in(Pink)
Line-out(Lime)
Line-in(Blue)