Digital Equipment BA214 Guide

BA214 Enclosure Maintenance
Order Number EK-190AA-MG-001
digital
equipment
corporation
maynard, massachusetts
I

October
1988
The
information
in
this
document
is
suhject
to
change
without
notlce
and
should
not
be
construed
as
a
commitment
by
Digital
Equipment
Corporation.
Digital
Equipment
Corporation
assumes
no
responsibility
for
any
errors
that
may
appear
in
this
document.
The
software.
if
any.
described
in
this
document
is
furnished
under
a
license
and
mav
be
used
.
..
.
or
copied
only
in
accordance
with
the
terms
of
such
license.
1\0
responsibility
is
assumed
for
the
use
or
reliability
of
software
or
equipment
that
is
not
supplied
by
Digital
Equipment
Corporation
or
its
affiliated
companies.
r
Digital
Equipment
Corporation.
1988. All
rights
reserved.
Printed
in
U.S.A.
The
READERS
COl\1:\IEI\TS
form
on
the
last
page
of
this
document
requests
the
user's
critical
evaluation
to
assist
in
preparing
future
documentation.
The
following
are
trademarks
of
Digital
Equipment
Corporation:
DEC
DECmate
DECnet
DECCS
DECwriter
DEL:-\I
DEQ~A
DESTA
DIBOL
:\IASSBCS
}licroPDP-ll
}licroVA
..
:\
:\IicroVl\1S
PDP
PUS
Professional
Q
..
bus
Rainbow
RSTS
RSX
RT
Thin
Wire
l'LTRIX
l':-\IBCS
\AX
VAXBI
VAXEL:-\
VAXcluster
VAXstation
V:\IS
VT
Work
Processor
FCC NOTICE:
The
equipment
described
in
this
manual
generates.
uses.
and
may
emit
radio
frequency
eneq,"y.
The
equipment
has
been
type
tested
and
found
to
comply
with
the
limits
for a
Class
A
computing
device
pursuant
to
Subpart
.J
of
Part
li'i
of
FCC
Rules.
which
are
designed
to
provide
re1!sonable
protection
against
such
radlO
frequency
interference
when
operated
in
a
commercial
environment.
Operation
of
this
equipment
in a rCf'idential
area
may
cause
interference.
in
which
case
the
user
at
his
own
expense
may
be
required
to
take
measures
to
correct
the
interference.
I

-Contents
Preface
Chapter 1 BA214 Enclosure Description
1.1
1.2
1.2.1
1.2.2
1.3
1.4
1.5
1.6
1.7
1.7.1
1.
7.2
Introduction
.....................................
.
Card
Cage
and
Module
Handles
......................
.
Filler
Panel
for Covers
and
Flush
Handles
...........
.
Support
Panel
for
Dual-Height
Modules
.............
.
Backplane
......................................
.
System
Controls
and
Indicators
......................
.
Power
Supply
....................................
.
Fan
...........................................
.
Configuration
Guidelines
...........................
.
Module
Order
and
Configuration
...................
.
Configuration
Worksheet
• • • • • • • • • • • • • • • • • • • • • • • • • •
Chapter 2 Installation
2.1
2.2
2.3
2.3.1
2.3.2
2.4
2.5
Rack
Mount
or
Wall
Mount
Installation
................
.
Connecting
the
Console
Terminal
to
the
System
.........
.
Connecting
Additional
Devices.
. . . . . . . . . . . . . . . . . . . . . . .
Connecting
Terminals
and
Printers
.................
.
Connecting
Modems
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Setting
System
Controls
............................
.
Connecting
the
Power
Cord
.........................
.
• •
Vll
1-1
1-3
1-5
1-6
1-6
1-7
1-8
1-10
1-10
1-10
1-11
2-1
2-1
2-3
2-4
2-7
2-10
2-11
•••
III
I

I
Chapter
3
FRU
Removal
and
Replacement
3.1
Introduction.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
..
3-1
3.2 Modules
with
BA200-Series
Bulkhead
Handles
....
_. . . .
..
3-2
3.3 Modules
with
Blank
Covers . . . . . . . . . . . . . . . . . . . . . . . . .
3-5
3.4
Power
Supply.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
..
3-6
3.5 AC Filter,
On/Off
Switch,
and
Fan.
. . . . . . . . . . . . . . . . . . . .
3-8
3.6
Backplane.........
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
..
3-9
Appendix
A
Related
Documentation
Index
Figures
1-1
1-2
1-3
1-4
1-5
1-6
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
3-1
3-2
3-3
3-4
3-5
3-6
•
IV
BA214
Enclosure
• • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •
BA200-Series
Handles
and
Covers
....................
.
BA214
Backplane
.................................
.
BA214
Power
Supply
..............................
.
BA214
Power
Supply
Timing
Diagram
.................
.
BA214
Configuration
Worksheet
.....................
.
Connecting
the
Console
Terminal
to
the
System
(Example)
..
H3104
Cable
Concentrator
..........................
.
Connecting
Devices to a CXA16 Module
................
.
Connecting
Devices
to
the
Cable
Concentrator
...........
.
Connecting
a Modem
to
a CXY08 Module
.,
............
.
Connecting
a Modem
to
a DZQ11 Module
..............
.
1-2
1-4
1-6
1-8
1-9
1-13
2-2
2-4
2-5
2-6
2-8
2-9
Making
a
Network
Connection.
. . . . . . . . . . . . . . . . . . . . .
..
2-10
Connecting
the
Power
Cord . . . . . . . . . . . . . . . . . . . . . . . .
..
2-11
Unlocking
the
Release
Levers
........................
3-3
Attaching
the
Filler
Panel
(Example).
. . . . . . . . . . . . . . . .
..
3-4
Removing
the
Safety
Plate.
. . . . . . . . . . . . . . . . . . . . . . . .
..
3-6
Removing
the
Power
Supply
.........................
3-7
Removing
the
AC
Filter
and
On/Off
Switch
Assembly.
. . .
..
3-8
Removing
the
Backplane
. . . . . . . . . . . . . . . . . . . . . . . . . .
..
3-10
-
-

Tables
1-1
BA214
Handles
and
Covers . . . . . . . . . . . . . . . . . . . . . . . . . .
1-5
1-2
Power
and
Bus
Load
Data
. . . . . . . . . . . . . . . . . . . . . . . . .
..
1-11
2-1
Terminal
Setup
Parameters
. . . . . . . . . . . . . . . . . . . . . . . .
..
2-3
2-2
BA214 I/O
Cables.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
..
2-3
3-1
BA214
FR
Us.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
..
3-1
v
I

I

Preface
This
guide
provides
maintenance,
installation,
and
reference
information
for
the
BA214
enclosure.
This
enclosure
is
intended
for
MicroPDP-ll
and
MicroVAX
systems.
Intended Audience
This
document
is
intended
only
for DIGITAL
Field
Service
personnel
and
qualified
self-maintenance
customers.
Organization
This
guide
has
three
chapters
and
one
appendix.
Chapter
1
provides
an
overview
of
the
BA214
enclosure,
describing
the
card
cage
and
module
handles,
controls
and
indicators,
backplane,
power
distribution,
and
configuration
guidelines.
Chapter
2
provides
installation
guidelines
and
procedures
for
the
BA214
enclosure
in
either
the
rack
or
wall
mount
configuration.
Chapter
3
describes
how
to
remove
and
replace
field
replaceable
units
(FRU
s).
The
beginning
of
the
chapter
contains
a
list
of
these
FRUs.
Appendix
A
provides
a list
of
related
documentation.
Warnings, Cautions, and Notes
Warnings,
cautions,
and
notes
appear
throughout
this
guide.
They
have
the
following
meanings:
WARl\I~G
Provides
information
to
prevent
personal
injury.
CAUTIOl\
Provides
information
to
prevent
damage
to
equipment
or
software.
~OTE
Provides
general
information
about
the
current
topic.
• •
VII
I

I
-
" -

-----
Chapter 1
BA214 Enclosure Description
1.1
Introduction
The
BA214
enclosure
is
a
member
of
the
BA200-series
of
enclosures,
and
is
available
in
rack
mount
and
wall
mount
configurations.
The
BA214
enclosure
has
six
backplane
slots, one
power
supply,
and
one fan.
The
enclosure does
not
support
mass
storage
devices;
system
diagnostics
must
be
either
loaded from
the
Ethernet
or
contained
on
the
CPU
module.
Figure
1-1
shows
the
BA214
enclosure
with
its
major
field
replaceable
units
(FRUs).
BA214 Enclosure Description
1-1
I

I I
Figure
1-1:
BA214 Enclosure
•
I
POWER
SUPPLY
I
MOOULE
--;-;-;-----:-;---:-~
I
i
I
/.,
. I
I
, I
,
)
')
~1
I I
I I
11
'
1
1
1l
i
~1ll<,
BACKPLANE
/'
/"
l
f
iJ~~~llll
ACFILTER,ONfOFF
" SWITCH,
AND
l I I
~----
SAFETY
PLATE
-"'LO-()(x)375
1-2
BA214
Enclosure
Maintenance -

1.2 Card Cage and Module Handles
There
are
two
main
differences
between
modules
used
in
a BA200-series
enclosure
and
those
used
in
other
system
enclosures:
•
Option
modules
with
external
I/O connectors
have
bulkhead
handles.
These
handles
replace
the
insert
panels
and
internal
cabling found
in
the
BA23
and
BA123 enclosures.
This
design
is
easier
to
maintain
because
it
eliminates
system
errors
caused
by
faulty
internal
cabling.
• Non-I/O
modules
(such
as
memory
modules)
have
blank
bulkhead
covers.
The
module
handles
and
covers form
an
electrical
seal
that
complies
with
regulations
for
electromagnetic
interference
(EM!) for (1)
keeping
radio
frequency
interference
generated
by
the
system
in
the
enclosure,
and
(2)
keeping
external
radio
frequencies from
entering
the
enclosure.
The
module
handles
and
blank
covers also
help
guarantee
proper
airflow.
There
are
four
basic
types
of
handles
and
covers
used
for BA200-series
compatible
modules
(Figure
1-2):
Single-width
flush
handle
Single-width
recessed
handle
Single-width
blank
covers
Dual-width
blank
covers
Each
handle
or
cover
has
two
captive
quarter-turn
Phillips
screws
to
hold
the
module
in
the
card
cage
(Figure
1-2>. Module
handles
also
have
release
levers
to
help
install
or remove
the
module
from
the
card
cage.
BA214 Enclosure Description
1-3
I

Figure 1-2: BA200-Series Handles
and
Covers
SI
NG
LE~WI
DTH
BLANK
COVER
DUALWIDTH
BLANK
COVER
SINGLE~WIDTH
FLUSH
HANDLE
1-4
BA214 Enclosure Maintenance
SI
NGLE-WI
DTH
RECESSED
HANDLE
•
FI
LLE
R
PLATE
MLO-OOO116
I

Some
modules
have
special configurations,
such
as
the
dual-width
cover
with
110
connector
for
CPUs.
Table
1-1
describes
common
module
cover
variations.
Table
1-1:
BA214 Handles and Covers
Part
Single·
width
blank
cover
Single-width
recessed
handle
Single·width
flush
handle
Dual-width
with
1'0
Dual-width
with
I/O
Dual-width
with
I/O
cover
cover
cover
Part
Number
Description
70-23981-01
Covers one
backplane
slot
in
the
following cases:
-
H3600-SA
H3601-SA
H3602-SA
Covers a
standard
Q22·bus
module
that
does
not
have
ex·
ternal
1'0
connectors
(for
example,
a
memory
mod-
ule
).
Covers
an
unused
slot (slots 2
through
6).
If
you
install
this
type
of
cover
next
to
a
module
with
are·
cessed
handle,
you
must
add
a
metal
filler
panel
to
main·
tain
compliance
for EM!.
See
Section 1.2.1.
Csed
on
modules
designed
for a
BA200·series
enclo-
sure.
The
handle
is
riveted
to
the
module.
This
style
is
the
preferred
handle
for all BA214
modules
with
exter-
nal
I/O connectors.
The
CXA16
and
CXY08
communi-
cation
modules
use
this
type
of
handle.
Used
when
a
recessed
handle
would
interfere
with
the
module
circuitry
or
I/O connector.
The
flush
han-
dle is
also
riveted
to
the
module.
The
KDJl1-
S (a
MicroPDP-ll
processor)
and
DEQNA-S
Ether-
net
controller
have
flush
handles.
For
the
KA630
and
KA650
CPU
modules.
The
cover
is
not
attached
to
the
CPU.
For
the
KDJll-BF
CPU
module.
The
cover is
not
at-
tached
to
the
CPU.
For
the
KA640
CPU
module.
The
cover is
not
at-
tached
to
the
CPU.
1.2.1
Filler Panel for Covers and Flush Handles
When
you
install
a module
with
a
blank
cover
or
flush
handle
next
to a
recessed-handle
module, you
must
install
a filler
panel
(Figure
1-2)
between
the
modules
to
meet
regulations
for EMI.
Without
the
filler
panel,
circuitry
on
the
recessed-handle
module
is exposed.
The
filler
panel
has
four
sets
of
finger stock
that
provide
an
effective
chassis
ground
between
the
handles.
Flush
handles,
recessed
handles,
and
covers
have
screw
holes
at
the
top
and
bottom
for
the
installation
of
this
filler panel.
BA214 Enclosure Description
1-5
I

1.2.2 Support Panel for Dual-Height Modules
A
plastic
panel
provides
extra
support
for
dual-height
modules
in
the
BA200-series
card
cage.
Dual-height
modules
are
always
installed
in
the
AB rows
of
a slot.
The
panel
plugs
into
the
CD rows below
the
module
to provide
additional
support.
The
panel
has
a fitted groove
along
the
top
edge
to
support
the
dual-height
module above it.
1.3 Backplane
The
BA214 enclosure
has
a six-slot,
quad-height
backplane
(Figure
1-3).
All six
backplane
slots
are
Q/CD slots.
That
is,
the
AB rows
of
all six
slots
contain
the
Q22-bus,
and
the
CD rows
of
all slots
contain
the
CD
interconnect.
Figure
1-3:
BA214 Backplane
POWER
SUPPLY
CONNECTOR
___
TO
FANS------
-:-.
1-6
BA214 Enclosure Maintenance
Q22-BUS
, I
" i
.,
,
. ,
· '
• I
· I
. !
I ' . .
•
MLO-OOO376
I
-'

The
backplane
is
bounded
and
cannot
be
expanded.
It
supports
32
equivalent
ac loads
and
20 dc loads from all
the
modules
installed
in
the
backplane.
An
ae
load
is
the
amount
of
capacitance
a module
presents
to
a
bus
signal
line.
One
ac load
equals
9.35
picofarads
(pD. A de
load
is
the
amount
of
dc
leakage
a
module
presents
to
a
bus
signal
line.
One
dc load is
approximately
105
microamperes
(pAl.
The
backplane
presents
5.6 ac loads
to
the
Q22-bus.
The
backplane
(Figure
1-3)
has
one 56-pin edge
board
connector
mounted
on
the
left
side to connect to
the
power
supply,
and
one 4-pin power
connector, also on
the
left
side, for a cable to
the
dc fan below
the
card
cage.
1.4 System Controls
and
Indicators
The
baud
rate
select
switch
and
power-up mode
switch
are
on
the
dual-
width
CPU
110
cover.
These
controls
vary
depending
on
the
CPU. Refer
to
the
applicable
CPU
maintenance
documentation
for a
description
of
the
controls on
the
CPU
110
panel.
The
power
supply
has
the
following dc
power
indicators,
which
light
when
the
dc voltages
are
within
regulation:
• DC
OK
LED, located on
the
control
panel
•
Green
LED,
located
on
the
front
of
the
power
supply
BA214 Enclosure Description
1-7
I

1.5 Power Supply
The
BA214
enclosure
contains
one
power
supply
(Figure
1-4).
The
power
supply
plugs
directly
into
the
backplane
via
a
56-pin
connector.
The
power
supply
delivers
the
following
maximum
current:
7.0
amps
at
+12 Vdc
33.0
amps
at
+5 Vdc
The
maximum
current
at
+12 Vdc
and
+5 Vdc
must
not
consume
more
than
230
watts
of
power.
Figure
1-4:
BA214 Power Supply
1-8
BA214 Enclosure Maintenance
SYSTEM
RESET
BUTTON
..--!
_CIRCUIT
BREAKER
~lO-OOO
128
I
-
Or
_

-
An
ac
line
filter
provides
ac
input
power
to
the
power
supply.
The
filter
is
under
the
power
supply
and
card
cage (see
Figure
1-1).
The
power
supply
has
a 12-hole (six
of
which
contain
connectors) ac
input
power
connector
at
its
base.
The
power
supply
enters
and
completes
a
shutdown
sequence
(Figure
1-5)
whenever
the
BPOK
H
signal
is
negated.
When
BPOK
H
is
asserted
high
on
the
Q22-bus,
the
power
system
is
in
a
state
to allow
normal
system
operation.
The
following conditions
negate
BPOK
H:
•
Temperature
sensor
triggered,
possibly
caused
by
fan
failure
•
An
overcurrent
condition
•
Input
voltage
greater
than
132 Vrms or
less
than
88
Vrms
Figure
1-5:
BA214 Power Supply Timing Diagram
VALID
AC
DC POWER
ALL
VOLTAGES
----
BOCOK
H
BPOK H
<-1
->
<-2-> <-3->
<--4
'>
<-5-> <- 6->
~
7
->
<- 8
~
TAC
TOC
TOCOK
TPOK
TACF
TPOKF
TOCOKF
TOCF
TOCOK
1.
3 seconds
max
imum
5.
20 msec ride-through
time
2.
3 milliseconds (msec)
minimum
6.
4 msec
minimum
hold
up
3. 70 msec
minimum
7.
5
msec
minimum
4. 3 msec
minimum
8. 3 msec
minimum
MLO-OOO129
BA214 Enclosure Description
1-9
I

--------------------------------------------------------------------~I
1.6 Fan
The
BA214
enclosure
has
one 11.3-cm (4.5-inJ dc
fan
attached
to
the
ac
line
filter.
The
fan
draws
air
into
the
top
of
the
enclosure,
through
the
card
cage,
and
out
the
bottom
of
the
enclosure.
A
temperature
sensor
in
the
power
supply
adjusts
fan
speed
by
varying
the
fan's
input
voltage
based
on
the
room
temperature.
The
sensor
adjusts
input
voltage to provide sufficient
cooling,
at
minimum
speed, for all
combinations
of
load.
The
maximum
output
is
-12
volts
at
45°C (113°F).
The
minimum
is
-6
volts
at
28°C (82°F).
1.7 Configuration Guidelines
Before
you
change
a
configuration
in
the
BA214
enclosure,
you
must
consider
the
following factors:
Module
order
in
the
backplane
Module
configuration
When
you
add
a device to a
system,
you
must
know
the
capacity
of
the
system
enclosure
in
these
areas:
Number
of
backplane
slots
Power
limitation
1.7.1 Module Order and Configuration
Module
order
in
the
backplane
is
system
specific,
depending
on
the
CPU.
Refer
to
the
applicable
CPU
maintenance
documentation
for
the
preferred
module
order
of
the
specific
system.
For
information
on
how
to configure
modules,
refer
to Microsystems Options,
which
includes
a complete
listing
of
all
supported
options
along
with
the
following
information
for
each
module
and
device:
Ordering
information
Operating
system
support
Diagnostic
support
Option
description
CSR
addresses
and
interrupt
vectors
LEDs
Loopback
connectors
Self-tests
FRUs
(if
applicable)
Related
documentation
1-10
BA214 Enclosure Maintenance --

I
1.7.2 Configuration Worksheet
Use
the
configuration
worksheet
(Figure
1-6)
to
be
sure
a configuration
does
not
exceed
system
limits
for
expansion
space, power,
and
bus
loads.
If
you
use
standard
DIGITAL modules, you will
not
exceed
the
limits
for
bus
loads.
When
you
change
a configuration,
use
the
worksheet
as
follows:
1.
On
the
worksheet,
list
all
the
devices
already
installed
in
the
system.
2.
List
all
the
devices you
plan
to
install
in
the
system.
3. Fill
in
the
information
for
each
device,
using
the
data
listed
in
Table
1-2.
4. Add
up
the
columns.
Make
sure
the
totals
are
within
the
limits
for
the
power supply.
NOTE: Check the appropriate
CPU
maintenance
documentation
to
determine which options are supported for the specific system.
Table 1-2: Power
and
Bus
Load
Data
Option
Module
AAVll-SA
A1009-PA
ADVll-SA
A1008-PA
AXVll-SA
A026-PA
KWVll-SA
:\14002-PA
CXA16-M
~13118-YA
CXB16-M
:\13118-YB
CXY08-M
~13119-YA
DELQA-SA
M7516-PA
DEQKA-SA
M7504
DFA01
~13121-PA
DPVll-SA
~18020-PA
DRQ3B-SA
M7658-PA
DRVIJ-SA
~18049-PA
DRVIW-SA
M7651-PA
DZQll-SA
M3106-PA
IBQ01-SA
M3125-PA
Current
(Amps)
Power
Bus
Loads
+5V
+12 V
Watts
AC
DC
1.8 0.0
9.0
2.1 0.5
3.2
0.0
16.0 2.3 0.5
2.0
0.0
10.0 1.2 0.3
2.2 0.130 11.16 1.0 0.3
1.6
0.20
10.4
3.0
0.5
2.0
0.0
10.0
3.0
0.5
1.8
0.30
12.6 3.2 0.5
2.7 0.5 19.5 2.2 0.5
3.5
0.50
23.5 2.2 0.5
1.97
0.40
14.7 3.0 1.0
1.2
0.30
9.6
1.0 1.0
4.5 0.0 22.5 2.0 1.0
1.8 0.0
9.0
2.0 1.0
1.8
0.0
9.0
2.0
1.0
1.0 0.36 9.3 1.4
0.5
5.0 0.0 25.0 4.6 1.0
BA214 Enclosure Description 1-11

Table
1-2
(Cont.): Power
and
Bus
Load
Data
CUI'rent
(Amps)
Power
Bus
Loads
Option
Module
+5V
+12 V Watts AC DC
IEQ11-SA
M8634-PA
3.5 0.0 17.5 2.0 1.0
KA620-AA M7478 6.2 0.14 32.7 2.7 1.0
KA630-AA M7606 6.2 0.14 32.7 2.7 1.0
KA650-AA
M7620-A
6.0 0.14 31.7 2.7 1.0
KDJ11-BC
M8190 5.5 0.1 28.7 2.3
1.1
KDJ11-BF
M8190 5.5 0.2 29.9 2.6 1.0
KMV1A-SA
:vI
7500-PA
2.6 0.2 15.4 3.0 1.0
KWV11-SA
M4002-PA
2.2 0.13 11.16 1.0 0.3
LPVll-SA
M8086-PA
1.6 0.0 8.0 1.8 0.5
M9060-YA 5.3 0.0 26.5 0.0 0.0
MS630-AA
M7607 1.0 0.0 5.0 0.0 0.0
MS630-BA
M7608 1.8 0.0 9.0 0.0 0.0
MS630-BB
M7608 1.8 0.0 9.0
MS630-CA
M7609
3.1
0.0
15.5 0.0 0.0
MS650-AA
M7621-A
2.7 0.0 13.5 0.0 0.0
MSVll-J"D
M8637-D
3.74 0.0 18.7 2.7 0.5
MSV11-J"E
M8637-E
4.1 0.0 20.5 2.7 0.5
MSVll-PK
M8067-K
3.45 17.25 2.0 1.0
MSVll-PL
M8067-L
3.6 -17.5 2.0 1.0
MSVll-QA
M7551-AA
2.4 0.0 12.0 2.0 1.0
VCB02 M7169 5.8 o
~-
.
{a
38.0 3.5 1.0
VCB02 M7168 3.4 0.0 17.0 0.0 0.0
1-12
BA214
Enclosure
Maintenance
I
--
•
---
...
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