Embedded Artists LPC3152 User manual

LPC3152 Developer’s Kit - User’s Guide
Copyright 2012 © Embedded Artists AB
EA2-USG-0902 Rev H
LPC3152 Developer’s Kit
User’s Guide
Get Up-and-Running Quickly and
Start Developing Your Applications On Day 1!

LPC3152 Developers Kit - User’s Guide
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Copyright 2012 © Embedded Artists AB
Embedded Artists AB
Davidshallsgatan 16
SE-211 45 Malmö
Sweden
[e-mail]
http://www.EmbeddedArtists.com
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Embedded Artists AB.
Disclaimer
Embedded Artists AB makes no representation or warranties with respect to the contents hereof and
specifically disclaim any implied warranties or merchantability or fitness for any particular purpose.
Information in this publication is subject to change without notice and does not represent a
commitment on the part of Embedded Artists AB.
Feedback
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comments to [e-mail].
Trademarks
InfraBed and ESIC are trademarks of Embedded Artists AB. All other brand and product names
mentioned herein are trademarks, services marks, registered trademarks, or registered service marks
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Copyright 2012 © Embedded Artists AB
Table of Contents
1Document Revision History 5
2Introduction 6
2.1 Features 6
2.2 ESD and Handling Precaution 7
2.3 CE Assessment 8
2.4 Other Products from Embedded Artists 8
2.4.1 Design and Production Services 8
2.4.2 OEM / Education / QuickStart Boards and Kits 8
3LPC3152 OEM Board Design 9
3.1 Schematic Page 2: Powering 9
3.2 Schematic Page 3: LPC3152 CPU 11
3.3 Schematic Page 4: Analog and Audio Interfaces 12
3.4 Schematic Page 5: External Memories 12
3.5 Schematic Page 6: Expansion Connector 13
3.6 Usage of CPU Pins 14
3.7 LPC3152 OEM Board Mechanical Dimensions and Connector 16
3.8 Things to note about the LPC3152 OEM Board 16
3.8.1 NAND FLASH Bad Block 16
3.8.2 Brand of Memory Chips 17
4LPC31xx Base Board Design 18
4.1 Usage of CPU Pins 18
4.2 Known Limitation of LPC31xx Base Board 20
4.2.1 MMC/SD Memory Card Detect Signal (J13) 20
4.2.2 H_L_CC Jumper 21
4.2.3 NAND Booting 21
4.2.4 USB Host applications –power supply 21
4.2.5 USB Host applications –over current sense 21
4.3 Jumpers 22
4.3.1 Default Jumper Positions 23
4.3.2 Illegal Jumper Combinations 23
4.4 Connectors 24
4.5 Important Components 25
4.6 NAND Boot Problem Fix 26
5Getting Started 28
5.1 Initial Setup and Powering 28
5.2 FTDI USB Driver 28
5.2.1 USB Driver Behavior 31
5.3 Booting 31
5.3.1 Jumper Settings 32

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5.3.2 Creating a Boot Image 33
5.3.3 Booting via UART 35
5.3.4 Booting via SPI NOR flash 36
5.3.5 Booting via USB DFU class 36
5.3.6 LED on GPIO2 38
5.3.7 Booting via NAND Flash 38
6Further Information 39

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1 Document Revision History
Revision
Date
Description
A
2009-05-25
Original version
B
2009-09-09
Added ‘known issues’ section 4.2.2 and 4.2.3 (information about
H_L_CC jumper and information about NAND boot and
LCD/Ethernet problem).
Added section 5.3.6.
C
2009-11-27
Changed title of manual to ‘Developer’s Kit” manual.
Replaced earlier section 5.3.6 with new section about NAND boot
and LCD/Ethernet problem (section 4.6 ).
D
2010-07-05
Added information in section 4.2 about things to note about the
LPC31xx Base Board (SD card detect logic, USB Host powering).
E
2010-11-15
Updated information about NAND boot problem.
F
2011-08-24
Added information about VBUS over-current sense for USB Host
applications (section 4.2.5 ).
G
2011-12-19
Added note about CE marking.
Removed schematics from document.
H
2012-05-10
Updated section 5.3.4 about SPI NOR boot. Added section 5.3.7
about booting from NAND flash.

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Copyright 2012 © Embedded Artists AB
2 Introduction
Thank you for buying Embedded Artists’ LPC3152 Developer’s Kit based on NXP’s ARM926EJ-S
LPC3152 microcontroller.
This document is a User’s Guide that describes the LPC3152 OEM Board and the LPC31xx Base
Board hardware design. It is the User’s Manual for both the LPC3152 Developer’s Kit as well as for just
the LPC3152 OEM Board.
2.1 Features
Embedded Artists’LPC3152 Developer’s Kit with NXP’s ARM926EJ-S LPC3152 microcontroller lets
you get up-and-running quickly. The small sized OEM board offers many unique features that ease
your learning curve and speed up your program development. The board has also been designed for
OEM applications with volume discount available. The features of the LPC3152 OEM board are:
NXP's ARM926EJ-S LPC3152 microcontroller in BGA package, with 192 KByte internal RAM
External data memory: 64 MB SDRAM (16-bit databus width)
External FLASH memories: 256 MB (2Gbit) NAND FLASH and 4 MB (32Mbit) SPI-NOR
FLASH
12.0000 MHz crystal for maximum execution speed and standard serial bit rates, including
CAN and USB requirements
256 Kbit I2C E2PROM for storing non-volatile parameters
Buffered 16-bit data bus for external expansion
200 pos expansion connector (SODIMM-200 format, 0.6mm pitch)
All LPC3152 pins available (except dedicated pins for on-board memories and internal
powering)
Li-ion battery or +5V powering
Onboard reset generation
Compact SODIMM size: 66 x 48 mm
Six layer PCB design for best noise immunity
There is an accompanying LPC31xx Base Board that can be used for initial prototyping work. The
features of the board are:
Connectors
200 pos, 0.6mm pitch SODIMM connector for LPC3152 OEM Board
RJ45 Ethernet connector
Expansion connector to 3.2 inch QVGA TFT color LCD with touch panel
Three expansion connectors with all SODIMM signals
MMC/SD interface and connector
USB OTG or Host connectors
Four 3.5mm audio connectors
Internal codec; mic in, 2x line in, headphone out
External codec; mic in, line in, line out, headphone out

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JTAG connector
2.1mm power input
Connector for external Li-ion battery
Power
Power supply, either via USB or external 9-15V DC
(LPC3152 OEM Board is powered by Li-ion battery or +5V)
Current monitors on input voltages
Other
100/10Mbps Ethernet interface base on DM9000A chip (available on base board from
v2.0)
UDA1380 I2S codec with mic in, line in, line out, and headphone out
5-key joystick (via I2C)
3-axis accelerometer
8 LEDs (via I2C)
Trimming potentiometer analog input
USB-to-serial bridge on UART (FT232R)
RS232 alternative interface on UART
XBee™ RF-module alternative interface on UART
(note that XBee module is not included in bundle)
Reset push-button and LED
205x135 mm in size
2.2 ESD and Handling Precaution
Please note that the LPC3152 OEM Board and LPC31xx Base Board come without any case/box and
all components are exposed for finger touches –and therefore extra attention must be paid to ESD
(Electro-Static Discharge) precaution.
Make it a habit to always first touch the metal surface of one of the USB or SC/MMC connectors
for a few seconds with both hands before touching any other parts of the boards. That way, you
will have the same electrical potential as the board and therefore minimize the risk for ESD.
Never touch directly on the LPC3152 OEM Board and in general as little as possible on the LPC31xx
Base Board. The keys on the LPC31xx Base Board have grounded shields to minimize the effect of
ESD.
Note that Embedded Artists does not replace boards that have been damaged by ESD.
In case you have also connected the QVGA Display Module to the LPC31xx Base Board, do not
exercise excessive pressure on the LCD glass area. That will damage the display. Also, do not apply
pressure on the two flex cables connecting the LCD. These are relatively sensitive and can be
damaged if too much pressure is applied to them.
Note that Embedded Artists do not replace QVGA Display Modules where the LCD has been
improperly handled.

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2.3 CE Assessment
The LPC3152 Developers Kit (consisting of the LPC3152 OEM Board and LPC31xx Base Board) is CE
marked. See separate CE Declaration of Conformity document.
The LPC3152 Developers Kit is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate measures.
EMC emission test has been performed on the LPC3152 Developers Kit. Standard interfaces like
Ethernet, USB, serial have been in use. General expansion connectors where internal signals are
made available (for example processor pins) have been left unconnected. Connecting other devices to
the product via the general expansion connectors may alter EMC emission. It is the user’s
responsibility to make sure EMC emission limits are not exceeded when connecting other devices to
the general expansion connectors of the LPC3152 Developers Kit.
Due to the nature of the LPC3152 Developers Kit –an evaluation board not for integration into an end-
product –fast transient immunity tests and conducted radio-frequency immunity tests have not been
executed. Externally connected cables are assumed to be less than 3 meters. The general expansion
connectors where internal signals are made available do not have any other ESD protection than from
the chip themselves. Observe ESD precaution.
Note that the LPC3152 OEM board is classified as a component and is hence not CE marked
separately. It can perform different functions in different integrations and it does not have a direct
function. It is therefore not in the scope of the CE Directive. An end product, where an OEM Board is
integration into, is however very likely to need CE marking.
2.4 Other Products from Embedded Artists
Embedded Artists have a broad range of LPC1xxx/LPC2xxx/LPC3xxx/LPC4xxx based boards that are
very low cost and developed for prototyping / development as well as for OEM applications.
Modifications for OEM applications can be done easily, even for modest production volumes. Contact
Embedded Artists for further information about design and production services.
2.4.1 Design and Production Services
Embedded Artists provide design services for custom designs, either completely new or modification to
existing boards. Specific peripherals and I/O can be added easily to different designs, for example,
communication interfaces, specific analog or digital I/O, and power supplies. Embedded Artists has a
broad, and long, experience in designing industrial electronics in general and with NXP’s
LPC1xxx/LPC2xxx/LPC3xxx microcontroller family in specific. Our competence also includes wireless
and wired communication for embedded systems. For example IEEE802.11b/g (WLAN), Bluetooth™,
ZigBee™, ISM RF, Ethernet, CAN, RS485, and Fieldbuses.
2.4.2 OEM / Education / QuickStart Boards and Kits
Visit Embedded Artists’ home page, www.EmbeddedArtists.com, for information about other OEM /
Education / QuickStart boards / kits or contact your local distributor.

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3 LPC3152 OEM Board Design
This chapter contains detailed information about the electrical and mechanical design of the LPC3152
OEM Board. Note that it is version 1.1 of the board that is presented. Differences from version 1.0 are
small and can be found in the schematic (see schematic page 1). The schematic can be downloaded
in pdf format from the support page, and is recommended to have printed out while reading this
chapter.
The following subsections describe in more detail each part of the design.
3.1 Schematic Page 2: Powering
Page 2 of the schematic contains the power supplies of the LPC3152 OEM Board. The LPC3152
contains internal voltage converters that create the three main voltages; 1.2V for internal digital part,
1.8V for external powering of memories and 3.2V for external interfaces like JTAG and GPIO:s. It also
contains Li-Ion battery charging functionality and USB OTG +5V generation.
3.1.1.1 Powering
The input voltage to the LPC3152 OEM Board is given by the requirements of the LPC3152 internal
power converters. There are multiple options how to power the LPC3152:
Li-Ion battery 2.7V –4.2V
USB, which is nominally 5V.
VIN, which is an external source nominally 5V, just like USB.
Normally powering comes from a Li-Ion battery, but USB powering is also supported. USB powering is
under software control. Signal PWR_CTRL controls Q1 power switch to enable powering from a USB
source.
An external +5V power source can power the board via VIN.
3.1.1.2 Internal Voltage Converters
The LPC3152 contains internal voltage converters, both switched and linear, designed to operate on
battery power. See the LPC3152 user’s manual for details. The generated voltages can be monitored
via test points. The current consumption can also be measured if needed. Just replace the R1-R3 zero
ohm resistors with low ohm current measuring resistors (typically less than 0.1 ohm).
The voltage converters can be controlled via software. Normally control is not needed but in certain
cases it can be needed.
A high input on signal PSU_PLAY will start the voltage converters. A high input on signal PSU_STOP
will place the chip in power off state.
Note that it is the user’s responsibility not to program the internal LPC3152 converters so that
the external memory chips (1.8V powering) are damaged by too high voltage (which is
possible).
3.1.1.3 Li-Ion Battery Charging
Note that this description is just an overview of the Li-Ion battery charger functionality. Read the
LPC3152 User’s Manual for details.
The charger is suitable for charging Li-Ion batteries from the USB supply. Main functions implemented
in the charger are as follows:
Trickle charging, with 10% of the nominal current.
Fast charging or constant current charging with the nominal current adjusted by an external
resistance value.

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Constant voltage charging, to charge the battery on maximum capacity. Normally the current
reduces in time from 100% to 10%.
When charging batteries, safety as well as charge capacity and lifetime are important factors. The
charge process has to be monitored and controlled carefully for maximum battery charge and to
protect the battery from damage. There are several safety functions implemented:
Current limiting in constant voltage charging
Current limiting by chip temperature
Current blocking by battery temperature sensing (via an NTC resistor)
Battery current setting
The nominal charge current is set with a resistor between pin CHARGE_CC_REF and ground. The
selected resistor on the LPC3152 OEM Board (R8, 1 kohm) gives a nominal charge current of 100 mA.
A resistance value of 400 ohm gives a nominal charge current of 250 mA. This is the maximum current
setting. The circuit involving R5 and R8 allows setting the resistance to 400 ohm by pulling the signal
HIGH_LOW_CC low. This signal is controlled from the PCA9532 I2C port expander. Pulling the signal
low will place R5 in parallel with R8, resulting in a resistance of 404 ohm. Note that the signal
HIGH_LOW_CC should only be low or high-impedance. It should never be driven high.
Battery voltage sensing
The battery voltage is accurately sensed via the CHARGE_BAT_SENSE pin (signal called
VBAT_SENSE in the schematic). The sense point should be as close as possible to the battery, in
order to remove the effect of voltage drops.
VNTC sensing for guarding the battery temperature
An NTC resistor can be used to monitor the battery temperature. A cold temperature limit is set to
about 25% of VBUS voltage and a high temperature limit is set to about 6%. There is a small
hysteresis implemented also. The table below lists the temperature thresholds resulting when R4 = 56
kohm and R7 = 82 kohm. A 10k NTC from Vishay Dale is place in parallel over R7. The NTC should be
placed on the battery and connected to signal CHARGE_VNTC and GND.
Low off
Low on
High on
High off
NTC curve1
4° C
7° C
49° C
51° C
NTC curve2
1° C
5° C
52° C
56° C
3.1.1.4 Real-time Clock
The LPC3152 contains an internal real-time clock (RTC) block that can be used to provide actual time
and alarm function. The 32.768 kHz crystal gives the base frequency for the RTC. The output
RTC_INT can be used to wake up the chip at regular points of time. This output is normally connected
to the PSU_PLAY input.
3.1.1.5 OTP VPP Voltage
The VPP power to the LPC3152 can be controlled by the OTP signal. The on-chip OTP (One-Time
Programmable) fuses on the LPC3152 can be programmed. 3.3V must be applied to VPP during
programming, or else 1.2V should be applied. Note that programming the fuses should be done with
great care. R69 is not mounted in order to remove the risk of programming by mistakes. R69 can
easily be ‘mounted’ by placing a solder bump between the two pads, i.e., R69 is a zero ohm resistor.
Note that a jumper (J14, pin 13/14) on the LPC31xx Base Board must also be inserted in order to
control the OTP signal from the PCA9532 I2C port expander.

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3.2 Schematic Page 3: LPC3152 CPU
Page 3 of the schematic contains the core part of the design, which of course is the LPC3152
microcontroller. It is an ARM926EJ-S cpu core with a lot of different peripheral units and on-chip
memory (192 KByte SRAM).
3.2.1.1 12MHz Crystal and PLLs
The microcontroller crystal frequency is 12.0000 MHz. This frequency is the recommended from NXP.
There is dual on-chip PLLs on the LPC3152 in order to generate different needed frequencies for the
chip. Note that the clocking structure is very different from the LPC2xxx family. It is a more
complex structure but also much more versatile and flexible. There is no shortcut but to read
the LPC3152 User’s Manual in detail and understand the options and settings.
3.2.1.2 Booting
The LPC3152 starts executing from an on-chip ROM, containing the bootloader. Note that the
LPC3152 does not contain any on-chip FLASH memory. Program code must be loaded from an
external source into the on-chip SRAM.
There are multiple boot options, as indicated in the schematic. The default is set to UART mode
booting. Normally the default boot option can be controlled/changed from the LPC31xx Base Board,
but the default resistors can also be changed for special orders of the board. The LPC3152 OEM
Board contains both SPI NOR flash and NAND flash in order to support stand alone booting.
Section 4.6 contains important information if NAND boot is used.
3.2.1.3 JTAG interface
The JTAG interface is a standard ARM-compatible JTAG interface. There is a special feature on the
LPC3152 that can bypass the ARM core scan chain (i.e. the debug access), by pulling JTAGSEL low.
In that case, the JTAG interface is used for boundary scan access.
3.2.1.4 SPI NOR FLASH
There is a 32Mbit (4 MByte) NOR flash connected to the SPI bus. There is an option to mount one of
two different manufacturers; either S25FL032 from Spansion or AT45DB321 from Atmel. Embedded
Artists can choose to mount any one of these chips on the board and it depends in component
availability at the time of production. Both are compatible for the relevant commands. In case special
commands are used, it is possible to read out chip id and determine type.
3.2.1.5 Reset Generation
The reset generation is handled by a standard voltage supervisor chip, CAT811R from Catalyst
Semiconductor. The reset signal will be held active (i.e., low) until the supply voltages, +3.3V, is within
margins (above 2.63V). The reset duration is typically 200 mS (consult the CAT811R datasheet for
exact details). The output reset signal is push/pull output that is converted to an open-collector / open-
drain output via the 74LVC1G125 buffer. An external reset source can pull the reset signal low (with an
open-collector/open-drain output).
3.2.1.6 I2C E2PROM
There is a 256 kbit E2PROM accessible via the I2C interface. The LPC3152 has two on-chip I2C
communication channels. Channel #0 is available externally and is used for communicating with the
E2PROM. More peripheral units are easily connected to the two-wire I2C bus, just as long as the
addresses do not collide. The address of the 256kbit E2PROM is 0xA0, which is also indicated in the
schematic.
There are 1.5 kohm pull-up resistors (pull-ups are always needed on I2C busses) included on the board
on I2C channel #0.

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I2C channel #1 is internal for communicating with the analog part of the chip. It is not available
externally.
3.2.1.7 USB Interface
There is a high-speed USB 2.0 (OTG, Host, Device) interface with on-chip PHY on the LPC3152. Note
that special care must be taken for layout of the USB signals. This also applies for the external
connector, connected to the expansion interface of the LPC3152 OEM Board.
3.3 Schematic Page 4: Analog and Audio Interfaces
Page 4 of the schematic contains the analog and audio interfaces.
3.3.1.1 Audio Interface
The LPC3152 contains an on-chip audio codec with a microphone input, two line inputs and
headphone outputs. Power supplies to the analog functions are carefully filtered in order to minimize
power supply noise.
3.3.1.2 Analog Inputs
The LPC3152 contains a 10-bit ADC (Analog to Digital Converter). The positive reference voltage is
ADC_VREFP. It is a filtered version of the 3.2V voltage. The voltage ADC_VREFP is available on the
expansion connector. There is also an associated analog ground reference available on the expansion
connector (connected to pin ADC10B_GNDA on the LPC3152).
3.4 Schematic Page 5: External Memories
Page 5 of the schematic contains the external memory interface and the external memories. There are
two memory components connected to the external 16-bit memory bus interface. Note that the LCD
interface and external memory bus interface are multiplexed over the same pins. It is the memory bus
interface that is used in the LPC3152 OEM Board. The LCD interface cannot be used and shall not be
enabled in the cpu.
Also note that three different types of memories share the same bus interface:
Dynamic memories (SDRAM)
Using signals RAS/CAS/DQM0/DQM1/ CLOCKOUT/CKE, etc.
Static memories or general peripherals
Using signals OE/WE/BLOUT0/BLOUT1, etc.
NAND Flash memories
Using signals CLE/ALE, etc.
Many of the signals are multiplexed on the same pins. The memory interface operates at 1.8V level,
which minimizes power consumption.
3.4.1.1 Memory Layout
The external memory controller on the LPC3152 defines a number of memory regions, as listed below:
External SDRAM bank 0 (0x3000 0000 –0x33FF FFFF)
16-bit databus width and 64MByte in size.
External SRAM bank 0 (0x2000 0000 –0x2000 FFFF / 0x2001 FFFF)
128 kByte in size for 16-bit databus width and 64 kByte in size for 8-bit databus.
External SRAM bank 1 (0x2002 0000 –0x2002 FFFF / 0x2003 FFFF)
128 kByte in size for 16-bit databus width and 64 kByte in size for 8-bit databus.
NAND band 0-3 (accessible via NAND flash controller, not directly via memory address)

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The LPC3152 OEM Board uses the external SDRAM bank 0 as well as NAND bank 0. It is mainly the
two external SRAM banks that are available for the off-board external memory interface of the
LPC3152 OEM Board. Chip select signals N_STCS0 and N_STCS1 are free for external use via the
buffered memory interface. Both the address and the data busses are buffered.
3.4.1.2 SDRAM
A 512 MBit (64 MByte) Mobile SDRAM is used, MT48H32M16LF from Micron. The chip is powered by
1.8V and is organized as 32Mbit x16, i.e. it has 16-bit databus width. The chip occupies the only
available memory bank for dynamic RAM at address range 0x3000 0000 –0x33FF FFFF.
3.4.1.3 NAND Flash
A 2 Gbit (256) NAND flash is used, MT29F2G08ABDHC from Micron. The chip is powered by 1.8V and
has 8-bit databus width. The NAND flash builds on a single-level cell (SLC) technology and has a page
size of 2112 bytes (2,048 + 64 bytes). The chip is connected to NAND bank 0. Note that the chip is not
directly accessible via the memory bus. Instead, all accesses must be done via the on-chip NAND
flash controller of the LPC3152.
Embedded Artists can choose to mount a different brand of NAND flash dependent on component
availability at the time of production. The application program should always read out the NAND flash
chip id and determine type and features.
3.4.1.4 Buffers to External Interface
The LPC3152 memory interface is available on the expansion connector. The data bus width is 16-bits
on the external interface. The relevant signals are buffered. The buffers are disabled by default unless
enabled by external signals.
By pulling signal N_ABUF_EN low, the two buffers for address and control signals are enabled and act
as outputs (from the LPC3152 OEM Board).
The data bus buffer is controlled by the signal N_DBUF_EN. By pulling this signal low, the data bus
buffer is enabled. The buffered version of the LPC3152 signal OE controls the direction of the data bus
buffer. During read operations the buffer acts as an input and during write operations it acts as an
output.
Note that N_DBUF_EN must not be pulled low constantly. In that case the buffer will collide with the
board’s internal data bus. N_DBUF_EN must only be pulled low when an external memory/IO device is
accessed. If only one of the static chip selects is used externally, just connect that signal to
N_DBUF_EN. If more than one chip select signal is used, (logically) AND all chip select signal together
before driving the N_DBUF_EN signal, in this case, just AND the two signals B_N_STCS0 and
B_N_STCS1.
There is an additional important note when booting from NAND flash, read section 4.6 for details about
the N_DBUF_EN signal.
If the external memory interface is not used, leave ABUS_EN and DBUS_EN unconnected.
The buffers are dual voltage buffers and act as level translators between the internal 1.8V signal levels
and the external levels. Connect the external bus voltage to VDD_EXT. See the datasheet of
74AVCA164245 for exact details about voltage range. Normally 3.3V powering is used.
3.5 Schematic Page 6: Expansion Connector
The LPC3152 OEM Board integrates the core part of a typical LPC3152 board design with a
reasonable large amount of external memories. All relevant signals of LPC3152 are available on the
200 pos, 0.6mm pitch expansion connector (SODIMM-200 format). See the next section for a detailed
list of available pins.

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3.6 Usage of CPU Pins
Almost all pins of the LPC3152 are directly available on the expansion connectors. Only in a few cases
pins are used for dedicated functionality like (dynamic) memory control signals, chip select signals and
power supply. Such pins are not available on the expansion connector. The table below lists all pins
and their possible restrictions.
Pin
Available on expansion connector
USB_VBUS
USB_DM
USB_DP
USB_ID
Yes
I2C_SDA0
I2C_SCL0
Yes, but I2C E2PROM connected to these pins.
SPI_CS_OUT0
No, signal used for chip select of SPI NOR flash (U7 or
U10).
SPI_SCK
SPI_MISO
SPI_MOSI
SPI_CS_IN
Yes, but note that SPI NOR flash is connected to SPI_SCK,
SPI_MISO, SPI_MOSI.
UART_RXD
UART_TXD
UART_CTS/SPI_CS_OUT1
UART_RTS/SPI_CS_OUT2
Yes
I2SRX_DATA0
I2SRX_WS0
I2SRX_BCK0
I2STX_DATA0
I2STX_WS0
I2STX_BCK0
I2STX_CLK0
Yes
GPIO0
GPIO1
GPIO2
Yes, but pull-ups/pull-downs are used to set default boot
mode to booting from the UART.
GPIO3-GPIO10
Yes
PWM_DATA
Yes
ADC10B_GPA0-ADC10B_GPA2
Yes
ADC_MIC
ADC_TINL
ADC_TINR
ADC_VINL
ADC_VINR
HP_OUTR
HP_OUTL
Yes

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CLOCK_OUT
Yes
EBI_D0-EBI_D15
Yes, but only available via the data bus buffer
MLCD_A0/ALE
MLCD_A1/CLK
MLCD_DB2/EBI_A2
MLCD_DB3/EBI_A3
MLCD_DB4/EBI_A4
MLCD_DB5/EBI_A5
MLCD_DB6/EBI_A6
MLCD_DB7/EBI_A7
MLCD_DB8/EBI_A8
MLCD_DB9/EBI_A9
MLCD_DB10/EBI_A10
MLCD_DB11/EBI_A11
MLCD_DB12/EBI_A12
MLCD_DB13/EBI_A13
MLCD_DB14/EBI_A14
MLCD_DB15/EBI_A15
Yes, but only available via the address bus buffer
EBI_DQM0/NOE
EBI_NWE
EBI_NCAS/BLOUT0
EBI_NRAS/BLOUT1
MLCD_CSB/EBI_NSTCS0
MLCD_DB1/EBI_NSTCS1
Yes, but only available via the buffer
NAND_NCS0
MNAND_RYBN0/MCI_DATA4
No, used for internal NAND flash memory.
NAND_NCS1
NAND_NCS2
NAND_NCS3
MNAND_RYBN1/MCI_DATA5
MNAND_RYBN2/MCI_DATA6
MNAND_RYBN3/MCI_DATA7
Yes
MLCD_DB0/EBI_CLKOUT
MLCD_RS/EBI_NDYCS
MLCD_RW_WR/EBI_DQM1
MLCD_E_RD/EBI_CKE
No, used for internal SDRAM.
ADC_VREFP
ADC_VREFN
Yes. Note that VDDA is connected to +3.2V power supply
FFAST_IN
FFAST_OUT
No, directly connected to on-board crystals
FSLOW_IN
FSLOW_OUT
No, directly connected to on-board crystals
RTC_INT
RTC_CLK
PSU_PLAY
PSU_STOP
CHARGE_VNTC
Yes

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CHARGE_BAT_SENSE
JTAG signals
Yes
VPP
Can be indirectly controlled by OTP signal
RESET_IN
Yes
The LPC31xx Base Board illustrates how to typically connect external interfaces (like USB, external
memory devices, etc) to the LPC3152 OEM Board. Study this schematic for details.
3.7 LPC3152 OEM Board Mechanical Dimensions and Connector
Figure 1 below contains a drawing of the board that includes mechanical measures. See SODIMM-200
standard for exact measures. 1.8V keying is used (SODIMM-200 boards are either 1.8V or 2.5V
keyed).
Figure 1 –LPC3152 OEM Board Mechanical Dimensions
The SODIMM-200 format is a standard and there are many connectors that are suitable from many
different manufactures. The many sources also keep the connector cost very low. Note that the
connector should be 1.8V keyed.
One suitable connector is 0-1473005-4 from Tyco/AMP. Basically any SODIMM, DDR2, 200pos, 1.8V,
right-angled connector will do.
3.8 Things to note about the LPC3152 OEM Board
3.8.1 NAND FLASH Bad Block
The NAND Flash is the MT29F2G08ABDHC from Micron and contains 2 GBit capacity. The chip may
include invalid blocks when shipped from factory. A maximum of 40 invalid blocks may exist initially,
i.e., 2008-2048 valid blocks. Additional invalid blocks may develop while being used. Invalid blocks are
defined as blocks that contain one or more bad bits. Do not erase or program factory-marked bad
66 mm
48 mm
1.8V keying of SODIMM board

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blocks. More information about appropriate management of invalid blocks can be found in technical
notes and datasheet from Micron.
3.8.2 Brand of Memory Chips
Note that there is no guarantee for a certain brand or version of memory chips; SPI-NOR flash, parallel
NAND flash and SDRAM. The lifetime of memory chips is limited and availability can also be limited
from time to time. Embedded Artists make every effort to mount the original design chip on the board.
In case that is impossible a compatible chip will instead be mounted without any prior notice. There
can be small programming differences between mounted brands. The application program shall always
read the chip id of flash devices to make certain which chip is actually mounted on the board.
The support page contains datasheets to the different memory devices and information about mounted
devices on different board versions.

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4 LPC31xx Base Board Design
This chapter contains detailed information about the electrical and mechanical design of the LPC31xx
Base Board, version 2.0. The difference between v1.1 and v2.0 is that a 100/10Mbps Ethernet
interface was added in v2.0. This new functionality is found on page 8 of the schematic. The
differences between version 1.0 and v1.1 are very small and can be seen on revision comments on the
first page of the schematic. The schematic can be downloaded in pdf format from the support page,
and is recommended to have printed out while reading this chapter.
The LPC31xx Base Board contains a number of interfaces and connectors to the LPC3152 OEM
Board. The design can be viewed as a reference schematic for custom designs around the LPC3152
OEM Board.
Note that the LPC31xx Base Board supports different members of the LPC31xx family. All
functionalities on the board do not directly apply for the LPC3152 OEM Board, for example the I2S
codec (since the LPC3152 has an internal codec).
Note that the codec on the LPC31xx Base Board cannot be accessed by the LPC3152. The used I2C
and I2S channels are not available on the LPC3152 chip.
4.1 Usage of CPU Pins
Almost all pins of the LPC3152 are directly available on the expansion connectors. Only in a few cases
pins are used for dedicated functionality like (dynamic) memory control signals and chip select signals.
Such pins are not available on the expansion connector. The table below lists all pins and their
possible restrictions.
Pin
Usage on LPC31xx Base Board
USB_VBUS
USB_DM
USB_DP
USB_ID
Connected to USB connectors; mini-AB and A.
I2C_SDA0
I2C_SCL0
Connected to PCA9532 port expander.
SPI_SCK
SPI_MISO
SPI_MOSI
Can be connected to QVGA display for touch screen
controller SPI interface.
SPI_CS_IN
No usage.
UART_RXD
UART_TXD
Can be connected to the USB-to-serial bridge, RS232
interface or XBee module.
UART_CTS/SPI_CS_OUT1
Can be connected to QVGA display for touch screen
controller SPI interface (chip select).
Can be connected to RS232 interface or XBee module.
UART_RTS/SPI_CS_OUT2
Can be connected to RS232 interface or XBee module.
I2SRX_DATA0
Can be used to detect presence of +5V.
I2SRX_WS0
Can be used to detect USB power switch over-current
status

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I2SRX_BCK0
I2STX_WS0
I2STX_CLK0
No usage.
I2STX_DATA0
Can be used to control powering of MMC/SD memory card
interface.
I2STX_BCK0
Can be used to detect MMC/SD memory card presence.
GPIO0
GPIO1
GPIO2
Can be connected to jumpers for controlling boot mode.
GPIO3
No usage.
GPIO4
Can be used as QVGA display touch screen controller
interrupt pin.
GPIO5
Can be used as MCI_CLK (MMC/SD interface)
GPIO6
Can be used as MCI_CMD (MMC/SD interface)
GPIO7
Can be used as MCI_DAT0 (MMC/SD interface)
GPIO8
Can be used as MCI_DAT1 (MMC/SD interface)
GPIO9
Can be used as MCI_DAT2 (MMC/SD interface)
GPIO10
Can be used as MCI_DAT3 (MMC/SD interface)
PWM_DATA
Can be used to control backlight intensity on QVGA display
ADC10B_GPA0
X-output from accelerometer.
ADC10B_GPA1
Y-output from accelerometer.
ADC10B_GPA2
Either z-output from accelerometer or trim pot.
CLOCK_OUT
No usage.
EBI_D0-EBI_D15
Connect to QVGA display module connector and DM9000
Ethernet interface.
MLCD_A0/ALE
MLCD_A1/CLK
MLCD_DB2/EBI_A2
MLCD_DB3/EBI_A3
MLCD_DB4/EBI_A4
MLCD_DB5/EBI_A5
MLCD_DB6/EBI_A6
MLCD_DB7/EBI_A7
MLCD_DB8/EBI_A8
MLCD_DB9/EBI_A9
MLCD_DB10/EBI_A10
MLCD_DB11/EBI_A11
MLCD_DB12/EBI_A12
MLCD_DB13/EBI_A13
MLCD_DB14/EBI_A14
No usage.
MLCD_DB15/EBI_A15
Connect to QVGA display module connector and DM9000
Ethernet interface.

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EBI_DQM0/NOE
EBI_NWE
Connect to QVGA display module connector and DM9000
Ethernet interface.
MLCD_CSB/EBI_NSTCS0
Connect to QVGA display module connector.
MLCD_DB1/EBI_NSTCS1
Connect to DM9000 Ethernet interface.
EBI_NCAS/BLOUT0
EBI_NRAS/BLOUT1
No usage.
NAND_NCS1
NAND_NCS2
NAND_NCS3
MNAND_RYBN1/MCI_DATA5
MNAND_RYBN2/MCI_DATA6
MNAND_RYBN3/MCI_DATA7
No usage.
ADC_MIC
ADC_TINL
ADC_TINR
ADC_VINL
ADC_VINR
HP_OUTR
HP_OUTL
Connect to 3.5mm audio connectors
RTC_INT
RTC_CLK
PSU_PLAY
PSU_STOP
CHARGE_VNTC
CHARGE_BAT_SENSE
RTC_INT can be connected to PSU_PLAY via jumper.
PSU_PLAY can be connected to push-button.
CHARGE_BAT_SENSE available on battery connector.
ADC_REFP
ADC_REFN
Used as references to generate analog signal from trip pot.
JTAG signals
Connected to standard ARM 2x10 pos JTAG connector.
RESET_IN
Connected to Reset push-button and LED.
4.2 Known Limitation of LPC31xx Base Board
4.2.1 MMC/SD Memory Card Detect Signal (J13)
J13 is not assembled on LPC31xx Base Boards version 1.1. Instead a 3K resistor is soldered between
the pins. The reason is that the signal I2STX_BCK0 acts as an output during booting in most boot
modes. Since the MMC/SD connector will drive the signal to GND if a memory card is inserted the
signal will be shorted to ground resulting in excessive current flowing. The 3K resistor limits the current
to a reasonable level. Figure 2 below illustrates the rework needed.
Note that a few boards of version 1.1 have been shipped without the 3K resistor. In this case, a
jumper shall never be inserted in J13, or a 3K resistor shall be soldered between the pins.
Note that the problem is fixed on v2.0 of the LPC31xx Base Board.
Also note that the pull-up on the SD card detect pin is after the power switch. Due to this there is a
need to enable power to the SD/MMC slot to even detect the card insertion.
Note that this problem is fixed on v2.2 of the LPC31xx Base Board.