Embedian SMARC-iMX8MM User manual

Embedian, Inc.
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SMARC-iMX8MM Computer on Module User’s Manual v.1.2
SMARCComputeronModule
NXPi.MX8MMiniCortexA53andCortexM4
24bitsdual‐channelLVDSLCD
4xCOMPorts
1xSDHC
1xUSBOTG2.0,4xUSBHost2.0
1x10/100/1000MGigabitEthernet
2xCANBus,2xSPIs,4xI2Cs
1xPCIe2.0,1xMIPI_CSI
SMARC‐iMX8MM
Solo,SoloLite,Dual,DualLite,QuadandQuadLiteCores
(SMARC2.0SpecificationCompliant)

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SMARC-iMX8MM Computer on Module User’s Manual v.1.2

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SMARC-iMX8MM Computer on Module User’s Manual v.1.2
RevisionHistory
RevisionDateChangesfromPreviousRevision
1.02020
/
02
/
10InitialRelease
1.22021/05/18 Fix Typos in this Document

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SMARC-iMX8MM Computer on Module User’s Manual v.1.2
USERINFORMATION
AboutThisManual
ThisdocumentprovidesinformationaboutproductsfromEMBEDIAN,INC.
Nowarrantyofsuitability,purpose,orfitnessisimplied.Whileevery
attempthasbeenmadetoensurethattheinformationinthisdocument
isaccurate,theinformationcontainedwithinissupplied“as‐is”andis
subjecttochangewithoutnotice.
Forthecircuits,descriptionsandtablesindicated,EMBEDIANassumesno
responsibilityasfaraspatentsorotherrightsofthirdpartiesare
concerned.
CopyrightNotice
Copyright©2020EMBEDIAN,INC..
Allrightsreserved.Nopartofthismanualmaybereproduced,
transmitted,transcribed,storedinaretrievalsystem,ortranslatedinto
anylanguageorcomputerlanguage,inanyformorbyanymeans
(electronic,mechanical,photocopying,recording,orotherwise),without
theexpresswrittenpermissionofEMBEDIAN.
Trademarks
Thefollowingliststhetrademarksofcomponentsusedinthisboard.
ARMisaregisteredtrademarkofARMLimited.
AndroidisaregisteredtrademarkofGoogle
LinuxisaregisteredtrademarkofLinusTorvalds.
WinCEisaregisteredtrademarkofMicrosoft
QualcommisaregisteredtrademarkofQualcomm
Allotherproductsandtrademarksmentionedinthismanualare
trademarksoftheirrespectiveowners.
Standards
EMBEDIANisISO9001:2008andISO14001‐certifiedmanufacturer.
SMARCisanSGETstandardforARMcomputeronmodule.
Warranty
ThisEMBEDIANproductiswarrantedagainstdefectsinmaterialand
workmanshipforthewarrantyperiodfromthedateofshipment.During
thewarrantyperiod,EMBEDIANwillatitsdiscretion,decidetorepairor
replacedefectiveproducts.

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SMARC-iMX8MM Computer on Module User’s Manual v. 1.2
Withinthewarrantyperiod,therepairofproductsisfreeofchargeas
longaswarrantyconditionsareobserved.
Thewarrantydoesnotapplytodefectsresultingfromimproperor
inadequatemaintenanceorhandlingbythebuyer,unauthorized
modificationormisuse,operationoutsideoftheproduct’senvironmental
specificationsorimproperinstallationormaintenance.
EMBEDIANwillnotberesponsibleforanydefectsordamagestoother
productsnotsuppliedbyEMBEDIANthatarecausedbyafaulty
EMBEDIANproduct.
TechnicalSupport
TechniciansandengineersfromEMBEDIANand/oritssubsidiariesand
officialdistributorsareavailablefortechnicalsupport.Wearecommitted
tomakingourproducteasytouseandwillhelpyouuseourproductsin
yoursystems.
BeforecontactingEMBEDIANtechnicalsupport,pleaseconsultourWeb
siteforthelatestproductdocumentation,utilities,anddrivers.Ifthe
informationdoesnothelpsolvetheproblem,contactusbye‐mailor
telephone.

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SMARC-iMX8MM Computer on Module User’s Manual v. 1.2
TableofContents
CHAPTER1INTRODUCTION .......................................................................................................................10
1.1FEATURESANDFUNCTIONALITY..........................................................................................................12
1.2MODULEVARIANT ...............................................................................................................................13
1.3BLOCKDIAGRAM ..................................................................................................................................14
1.4SOFTWARESUPPORT/HARDWAREABSTRACTION ............................................................................15
1.5DOCUMENTANDSTANDARDREFERENCES .........................................................................................16
CHAPTER2SPECIFICATIONS.......................................................................................................................21
2.1SMARC‐IMX8MMGENERALFUNCTIONS ............................................................................................21
2.2SMARC‐IMX8MMDEBUG ....................................................................................................................91
2.3MECHANICALSPECIFICATIONS.............................................................................................................91
2.4ELECTRICALSPECIFICATIONS..............................................................................................................107
2.5ENVIRONMENTALSPECIFICATIONS.................................................................................................... 110
CHAPTER3CONNECTORPINOUT ............................................................................................................ 112
3.1SMARC‐IMX8MMCONNECTORPINMAPPING.................................................................................. 112
CHAPTER4POWERCONTROLSIGNALSBETWEENSMARC‐IMX8MMMODULEANDCARRIER ............146
4.1SMARC‐IMX8MMMODULEPOWER..................................................................................................146
4.2POWERSIGNALS.................................................................................................................................151
4.3POWERFLOWANDCONTROLSIGNALSBLOCKDIAGRAM................................................................156
4.4POWERSTATES ...................................................................................................................................158
4.5POWERSEQUENCES...........................................................................................................................160
4.6TERMINATIONS ..................................................................................................................................164
4.7BOOTDEVICESELECTION...................................................................................................................169

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UsingthisManual
ThisguideprovidesinformationabouttheEmbedianSMARC‐iMX8MMforNXP
i.MX8MMiniembeddedSMARCcoremodulefamily.
Conventionsusedinthisguide
Thistabledescribesthetypographicconventionsusedinthisguide:
ThisConventionIsusedfor
ItalictypeEmphasis,newterms,variables,and
documenttitles.
monospacedtypeFilenames,pathnames,andcode
examples.
EmbedianInformation
DocumentUpdates
PleasealwayschecktheproductspecificsectionontheEmbediansupport
websiteatwww.embedian.com/forthemostcurrentrevisionofthis
document.
ContactInformation
FormoreinformationaboutyourEmbedianproducts,orforcustomer
serviceandtechnicalsupport,contactEmbediandirectly.
TocontactEmbedianbyUse
MailEmbedian,Inc.
9F‐4.432KeelungRd.Sec.1,
Taipei11051,Taiwan
WorldWideWebhttp://www.embedian.com/
Telep hone+886227223291

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SMARC-iMX8MM Computer on Module User’s Manual v. 1.2
AdditionalResources
PleasealsorefertothemostrecentNXPi.MX8MMiniprocessorreference
manualandrelateddocumentationforadditionalinformation.

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SMARC-iMX8MM Computer on Module User’s Manual v. 1.2
Introduction
ThisChaptergivesbackgroundinformationontheSMARC‐iMX8MM
Sectioninclude:
FeaturesandFunctionality
ModuleVariant
DifferencesbetweenModuleVariants
Blockdiagram
SoftwareSupport/HardwareAbstraction
ModuleVariant
DocumentandStandardReferences

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Chapter1Introduction
TheSMARC‐iMX8MMoffershigh‐performanceprocessingforalow‐power
System‐on‐Module.Itperfectlyfitsvariousembeddedproducts,thegrowing
marketofconnectedandportabledevicesandsegmentforconnected
streamingaudio/videodevices,scanning/imagingdevicesandvariousdevices
requiringhigh‐performancebutlow‐powerprocessors.
TheproductisbasedontheNXPi.MX8MMiniSolo/SoloLite/Dual/Dual
Lite/QuadLite/Quadfamilyofmulti‐purposeprocessors,featuringanARM®
Cortex™‐A53upto1.8GHzwithanadditional400MHzARMCortex‐M4core.
Thisheterogeneousmulticoreprocessingarchitectureenablesthedeviceto
runanopenoperatingsystemlikeLinuxontheCortex‐A53coreandanRTOS
likeFreeRTOS™ontheCortex‐M4corefortimeandsecuritycriticaltasks.
Themoduleconnectorhas314edgefingersthatmatewithalowprofile314
pin0.5mmpitchrightangleconnector(thisconnectorissometimesidentified
asan321pinconnector,but7pinsarelosttothekey).
FeaturingNXP’si.MX8MMiniSystem‐on‐Chip,Embedian’sSMARC‐iMX8MM
offerssingle‐ ordual‐channel18‐bit/24‐bitLVDSLCD,GigabitEthernet,SDHC,
USB2.0,UARTs,CANbus,PCIeandmanyperipheralinterfacesinacost
effective,lowpower,miniaturepackage.Embedian’sSMARC‐iMX8MMthin
androbustdesignmakesitanidealbuildingblockforreliablesystemdesign
withawiderangeofproductsintargetmarketsrequiringhigh‐performance
processingwithlowpowerconsumption,compactsizeandacost‐effective
solution.
Themoduleistheidealchoiceforabroadrangeoftargetmarketsincluding
BuildingControl‐FireandSecuritypanel,ElevatorControl,HVAC
control
IndustrialVehicle‐Avionicscockpitdisplay,in‐flightinfotainment,train
andheavyequipmentHMI
Healthcare–patientmonitor
PersonalUAVs
SmartCities
SmartHome
Voicecontrolandvoiceassistants
GeneralControlSystem
Andmore
Completeandcost‐efficientEmbedianevaluationkitsforYoctobuild,Debian

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SMARC-iMX8MM Computer on Module User’s Manual v. 1.2
9,Ubuntu18.04andAndroidPie9.0allowimmediateandprofessional
embeddedproductdevelopmentwithdramaticallyreduceddesignriskand
time‐to‐market.

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1.1FeaturesandFunctionality
TheSMARC‐iMX8MMmoduleisbasedonthei.MX8MMiniprocessorwith
solo,sololite,dual,duallite,quad,andquadlitecorefromNXP.Thisprocessor
offersahighnumberofinterfaces.Themodulehasthefollowingfeatures:
SMARC2.0compliantinan82mmx50mmformfactor.
Processor:NXPi.MX8MMiniARMCortex‐A53upto1.8GHzand
Cortex‐M4upto400MHz
Memory:Onboard16GBeMMCFlash
Onboard2GBor4GBLPDDR4
Networking:1x10/100/1000MbpsEthernet
Display:
SinglechannelLVDSLCD24‐bitordualchannelLVDS
Expansion: 1xSDHC/SDIO,5xUSB2.0(oneOTG),1xPCIex1Gen2.0
USB:4xUSB2.0Host,1xUSB2.0OTG
Asingle4KBEEPROMisprovidedonI2C1thatholdstheboard
information.Thisinformationincludesboardname,serialnumber,and
revisioninformation.
AdditionalInterface:
4xUARTs
2xSPI(oneeSPI)
5xI2C
2xI2S
2xCANBus
2xPWM
1x4‐LaneMIPICSI(CameraInterface)
12xGPIOs
WDT
SWSupport:Linux,YoctoBuild,Ubuntu18.04,Debian9,AndroidPie
9.0
PowerConsumption(Typcal)
~2W
Thermal:
CommercialTemperature:0oC~80oC
IndustrialTemperature:‐40o~85oC
PowerSupply
3Vto5.25V

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1.8VmoduleIOsupport(SMARC2.0compliant)
1.2ModuleVariant
TheSMARC‐iMX8MMmoduleisavailablewithvariousoptionsbasedon
processorsinthisfamilyfromNXP,LPDDR4memoryconfiguration,and
operatingtemperatureranges.
1. “6”(quadcore,CPUrunningupto4x1.8GHz)
“5”(quadlitecore,CPUrunningupto4x1.8GHz,NoVPU)
“4”(dualcore,CPUrunningupto2x1.8GHz)
“3”(duallitecore,CPUrunningupto2x1.8GHz,NoVPU)
“2”(solocore,CPUrunningupto1x1.8GHz)
“1”(solocore,CPUrunningupto1x1.8GHz,NoVPU)
2. “2G”(2GBLPDDR4memory)
“4G”(4GBLPDDR4memory,onlyquad/quadlitecoresupports4GB
LPDDR4)
3. “I”Industrialtemperature(‐40oC~85oCfor2GBLPDDR4and‐30oC~85oC
for4GBLPDDR4),CPUrunningupto1.6GHz
LeaveitBlankifcommercialtemperature
4. “C”(Conformalcoating)–Leaveitblankifnoneedsofconformalcoating.
Forexample,SMARC‐iMX8MM‐6‐2Gstandsforquadcorei.MX8MMprocessor
runningupto1.8GHzwith2GBLPDDR4memoryinnormaloperating
temperature.

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1.3BlockDiagram
Thefollowingdiagramillustratesthesystemorganizationofthe
SMARC‐iMX8MM.Arrowsindicatedirectionofcontrolandnotnecessarily
signalflow.
Figure1:SMARC‐iMX8MMBlockDiagram
Detailsforthisdiagramwillbeexplainedinthefollowingchapters.

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1.4SoftwareSupport/HardwareAbstraction
TheEmbedianSMARC‐iMX8MMModuleissupportedbyEmbedianBSPs
(BoardSupportPackage).ThefirstSMARC‐iMX8MMBSPtargetsLinux(Ubuntu
18.04LTS,Debian9,YoctoBuild)andAndroidPie9.0support.BSPsforother
operatingsystemsareplanned.CheckwithyourEmbediancontactforthe
latestBSPs.
ThismanualgoesintoalotofdetailonI/Oparticulars–informationis
providedonexactlyhowthevariousSMARCedgefingerstieintotheNXP
i.MX8MMiniSoCandtootherModulehardware.Thisisprovidedfor
referenceandcontext.AlmostalloftheI/Oparticularsarecoveredand
abstractedintheBSPanditshouldgenerallynotbenecessaryforuserstodeal
withI/Oattheregisterlevel.

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1.5DocumentandStandardReferences
1.5.1.ExternalIndustryStandardDocuments
eMMC(EmbeddedMulti‐MediaCard)theeMMCelectricalstandardis
definedbyJEDECJESD84‐B45andthemechanicalstandardby
JESD84‐C44(www.jedec.org).
TheI2CSpecification,Version2.1,January2000,PhilipsSemiconductor
(nowNXP)(www.nxp.com).
I2SBusSpecification,Feb.1986andRevisedJune5,1996,Philips
Semiconductor(nowNXP)(www.nxp.com).
JTAG(JointTestActionGroupdefinedbyIEEE1149.1‐2001‐IEEE
StandardTestAccessPortandBoundaryScanArchitecture
(www.ieee.org).
MXM3GraphicsModuleMobilePCIExpressModule
ElectromechanicalSpecification,Version3.0,Revision1.1,©2009
NVIDIACorporation(www.mxm‐sig.org).
PICMG®EEEPEmbeddedEEPROMSpecification,Rev.1.0,August2010
(www.picmg.org).
SDSpecificationsPart1PhysicalLayerSimplifiedSpecification,Version
3.01,May18,2010,©2010SDGroupandSDCardAssociation(Secure
Digital)(www.sdcard.org).
SPIBus–“SerialPeripheralInterface”‐de‐factoserialinterface
standarddefinedbyMotorola.Agooddescriptionmaybefoundon
Wikipedia
(http://en.wikipedia.org/wiki/Serial_Peripheral_Interface_Bus).
USBSpecifications(www.usb.org).
PCIExpressSpecifications(www.pci‐sig.org)
SPDIF(akaS/PDIF)(“SonyPhilipsDigitalInterface)‐IEC60958‐3
eSPI(“EnhancedSerialPeripheralInterface”)TheeSPIInterfaceBase
SpecificationisdefinedbyIntel
https://downloadcenter.intel.com/de/download/22112)
GBEMDI(“GigabitEthernetMediumDependentInterface”)definedby
IEEE802.3.The1000Base‐Toperationovercoppertwistedpaircabling
definedbyIEEE802.3ab(www.ieee.org).
RS‐232(EIA“RecommendedStandard232”)thisstandardfor
asynchronousserialportdataexchangedatesfrom1962.Theoriginal
standardishardtofind.Manygooddescriptionsofthestandardcanbe

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foundon‐line,e.g.atWikipedia,andintextbooks.
CSI‐2(CameraSerialInterfaceversion2)TheCSI‐2standardisowned
andmaintainedbytheMIPIAlliance(“MobileIndustryProcessor
InterfaceAlliance”)(www.mipi.org).
CSI‐3(CameraSerialInterfaceversion3)TheCSI‐3standardisowned
andmaintainedbytheMIPIAlliance(
“
MobileIndustryProcessor
Alliance
”
)(www.mipi.org)
CAN(“ControllerAreaNetwork”)BusStandard–ISO11898
DisplayPortandEmbeddedDisplayPortThesestandardsareowned
andmaintainedbyVESA(“VideoElectronicsStandardsAssociation”)
(www.vesa.org)
1.5.2.SGETDocuments
SMARC_Hardware_Specification_V200,version2.0,June2nd,2016.
SMARC_Hardware_Specification_V1p1,version1.1,May29,2014.
1.5.3.EmbedianDocuments
Thefollowingdocumentsarelistedforreference.TheModuleschematicis
notusuallyavailableoutsideofEmbedian,withoutspecialpermission.The
otherschematicswillbeavailable.ContactyourEmbedianrepresentative
formoreinformation.TheSMARCEvaluationCarrierBoardSchematicis
particularlyusefulasanexampleoftheimplementationofvarious
interfacesonaCarrierboard.
SMARCEvaluationCarrierBoardSchematic,PDFandOrCADformat
SMARCEvaluationCarrierBoardUser’sManual
SMARC‐iMX8MMUser’sManual
PinMuxfileforSMARC‐iMX8MM
SMARC‐iMX8MMSchematicChecklist

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1.5.4. NXP Documents
IMX8MMRM,i.MX8MMiniApplicationsProcessorReferenceManual,
Aug27th,2019(rev.2)
IMX8MMIEC,i.MX8MMiniApplicationsProcessorDatasheetfor
IndustrialProducts,April25,2019(rev.0.2)
IMX8MMCEC,i.MX8MMiniApplicationsProcessorDatasheetfor
ConsumerProducts,April24,2019(rev.0.2)
IMX8MMHDG,i.MX8MMiniHardwareDeveloper’sGuide,Aug.13.
2019(rev.1)
AN12410,i.MX8MMiniPowerConsumptionMeasurement,April14,
2019(rev.0)

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1.5.5.NXPDevelopmentTools
IOMUX_TOOLv5forARM®i.MX8MMiniMicroprocessors
1.5.6.NXPSoftwareDocuments
Linux4.14.98_2.0.0_ga
AndroidP9.0.0_2.0.0_gaDocumentation
1.5.7.EmbedianSoftwareDocuments
EmbedianLinuxBSPforSMARC‐iMX8MMModule
EmbedianAndroidBSPforSMARC‐iMX8MMModule
EmbedianLinuxBSPUser’sGuide
EmbedianAndroidBSPUser’sGuide
1.5.8.NXPDesignNetwork
SABRE
Wandboard
Nucleus
QNX

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SMARC-iMX8MM Computer on Module User’s Manual v. 1.2
Specifications
ThisChapterprovidesSMARC‐iMX8MMspecifications.
Sectioninclude:
SMARC‐iMX8MMGeneralFunctions
SMARC‐iMX8MMDebug
MechanicalSpecifications
ElectricalSpecification
EnvironmentSpecification
Table of contents
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