Emerson FloBoss 107 User manual

Remote Automation Solutions
Part Number D301232X012
Form Number A6206
June 2017
FloBoss™107 Flow Manager
Instruction Manual

FloBoss 107 Instruction Manual
ii Revised June-2017
Revision Tracking Sheet
June 2017
This manual may be revised periodically to incorporate new or updated information. The revision date
of each page appears at the bottom of the page opposite the page number. A change in revision date
to any page also changes the date of the manual that appears on the front cover. Listed below is the
revision date of each page (if applicable):
Page
Revision
All Pages
June-2017
All Pages
December-2015
All Pages
May-2013
All Pages
September-2009
Initial issue
February-2007

FloBoss 107 Instruction Manual
Revised June-2017 Contents iii
Contents
Chapter 1 –General Information 1-1
1.1 Scope of Manual ............................................................................................................................1-2
1.2 FloBoss 107 Overview ...................................................................................................................1-2
1.3 Hardware........................................................................................................................................1-5
1.3.1 Processor and Memory....................................................................................................1-6
1.3.2 Backplane ........................................................................................................................1-6
1.3.3 Expansion Rack...............................................................................................................1-6
1.3.4 Central Processing Unit (CPU) ........................................................................................1-6
1.3.5 Battery and Super-capacitor............................................................................................1-8
1.3.6 Built-in Inputs and Outputs...............................................................................................1-8
1.3.7 Built-in Communications..................................................................................................1-8
1.3.8 Built-in Resistance Thermal Device (RTD)................................................................... 1-10
1.3.9 Built-in Loop Output Power........................................................................................... 1-10
1.3.10 Optional Inputs and Outputs......................................................................................... 1-10
1.3.11 Optional Communication Modules –COM3 ................................................................. 1-11
1.3.12 Optional Multi-Variable Sensor (MVS).......................................................................... 1-12
1.3.13 Optional Integral Sensors ............................................................................................. 1-12
1.3.14 Optional License Key.................................................................................................... 1-12
1.3.15 Optional Enclosures...................................................................................................... 1-12
1.3.16 Optional LCD Touchpad ............................................................................................... 1-13
1.4 Firmware ..................................................................................................................................... 1-14
1.4.1 History Points................................................................................................................ 1-15
1.4.2 Alarm Log...................................................................................................................... 1-16
1.4.3 Event Log...................................................................................................................... 1-17
1.4.4 Security......................................................................................................................... 1-17
1.4.5 I/O Database................................................................................................................. 1-18
1.4.6 Function Sequence Tables (FST)................................................................................. 1-18
1.4.7 PID Control.................................................................................................................... 1-18
1.4.8 Spontaneous-Report-By-Exception (SRBX) Alarming.................................................. 1-19
1.4.9 Softpoints...................................................................................................................... 1-19
1.4.10 Opcodes........................................................................................................................ 1-19
1.4.11 Pass Through Communications.................................................................................... 1-19
1.4.12 ROC and Modbus Protocols......................................................................................... 1-19
1.4.13 User C Programs .......................................................................................................... 1-20
1.5 ROCLINK™800 Configuration Software..................................................................................... 1-20
1.6 Product Electronics ..................................................................................................................... 1-22
1.6.1 Real-Time Clock ........................................................................................................... 1-22
1.6.2 Diagnostic Monitoring ................................................................................................... 1-22
1.6.3 Automatic Self Tests..................................................................................................... 1-22
1.6.4 Low Power Mode .......................................................................................................... 1-23
1.7 Flow Measurements.................................................................................................................... 1-23
1.8 Security Gateway........................................................................................................................ 1-24
1.9 Additional Technical Information................................................................................................. 1-25
Chapter 2 –Installation and Use 2-1
2.1 Installation Requirements...............................................................................................................2-1
2.1.1 Environmental Requirements...........................................................................................2-1
2.1.2 Site Requirements ...........................................................................................................2-2
2.1.3 Compliance with Hazardous Area Standards..................................................................2-4
2.1.4Power Installation Requirements.....................................................................................2-4
2.1.5 Grounding Installation Requirements ..............................................................................2-5

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iv Contents Revised June-2017
2.1.6 I/O Wiring Requirements..................................................................................................2-6
2.2 Installing the FloBoss 107 and Expansion Rack............................................................................2-7
2.2.1 Required Tools.................................................................................................................2-7
2.2.2 Installing the FloBoss 107 without an Expansion Rack...................................................2-7
2.2.3 Installing the FloBoss with an Expansion Rack...............................................................2-8
2.2.4 Removing an Expansion Rack.......................................................................................2-10
2.2.5 Removing and Installing Module Slot Covers................................................................2-11
2.2.6 Removing and Installing Wire Channel Covers.............................................................2-11
2.3 Memory Backup Battery...............................................................................................................2-12
2.3.1 Removing and Installing the Battery..............................................................................2-12
2.4 Central Processor Unit (CPU)......................................................................................................2-13
2.4.1 Removing the CPU Module ...........................................................................................2-15
2.4.2 Installing the CPU Module .............................................................................................2-16
2.4.3 Resetting the CPU.........................................................................................................2-16
2.5 License Keys................................................................................................................................2-16
2.6 Startup and Operation..................................................................................................................2-17
2.6.1 Startup ...........................................................................................................................2-17
2.6.2 Operation .......................................................................................................................2-17
Chapter 3 –Power Connections 3-1
3.1 Power Input Descriptions...............................................................................................................3-1
3.2 Determining Power Consumption ..................................................................................................3-3
3.2.1 Summary..........................................................................................................................3-6
3.3 Wiring Connections........................................................................................................................3-6
3.4 Wiring Power to the CPU Module ..................................................................................................3-7
Chapter 4 –Inputs and Outputs 4-1
4.1 I/O Description ...............................................................................................................................4-1
4.2Installing a Module.........................................................................................................................4-5
4.3 Removing a Module.......................................................................................................................4-6
4.4 Wiring a Module.............................................................................................................................4-7
4.5 Selecting the Type of I/O................................................................................................................4-7
4.6 Analog Inputs (AI) ..........................................................................................................................4-9
4.6.1 Wiring the Analog Inputs..................................................................................................4-9
4.7 8-Point Analog Input/Digital Input (AI/DI) Module........................................................................4-11
4.7.1 Wiring the 8-Point AI/DI .................................................................................................4-11
4.8 Analog Outputs (AO)....................................................................................................................4-13
4.8.1 Wiring the Analog Outputs.............................................................................................4-13
4.9 Discrete Inputs (DI) ......................................................................................................................4-14
4.9.1 Wiring the Discrete Inputs..............................................................................................4-15
4.10 Discrete Outputs (DO)..................................................................................................................4-15
4.10.1 Wiring the Discrete Outputs...........................................................................................4-16
4.11 Discrete Outputs Relay (DOR) Module........................................................................................4-17
4.11.1 Wiring the Discrete Output Relays.................................................................................4-18
4.12 Pulse Inputs (PI)...........................................................................................................................4-19
4.12.1 Wiring the Pulse Inputs..................................................................................................4-19
4.13 Application (APP 485) Module.....................................................................................................4-20
4.13.1 Wiring the Application Module .......................................................................................4-20
4.14 Resistance Temperature Detector (RTD) Input...........................................................................4-22
4.14.1 Wiring the RTD Input .....................................................................................................4-22
4.15 6-Point AO/DO Module ................................................................................................................4-23
4.15.1 Wiring the 6-Point AO/DO Module.................................................................................4-24
4.16 HART®Module.............................................................................................................................4-24
4.16.1 Wiring the HART Module...............................................................................................4-25
4.17 Resistance Temperature Detector (RTD) Module .......................................................................4-26
4.17.1 Wiring the RTD Module..................................................................................................4-26

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4.18 IEC 62591 Module....................................................................................................................... 4-27
4.18.1 Wiring the IEC 62591 Module....................................................................................... 4-28
4.19 Additional Technical Information................................................................................................. 4-28
Chapter 5 –Communications 5-1
5.1 Communications Overview ............................................................................................................5-1
5.2 Installing/Removing a Communication Module..............................................................................5-5
5.3 Wiring the Local Operator Interface (LOI) Port ..............................................................................5-5
5.3.1 Using the LOI...................................................................................................................5-6
5.4 Wiring EIA-485 (RS-485) Communications ...................................................................................5-6
5.5 Wiring EIA-232 (RS-232) Communications ...................................................................................5-7
5.6 Liquid Crystal Display (LCD) Touchpad.........................................................................................5-8
5.7 Enhanced Communication Module (ECM).....................................................................................5-9
5.7.1 Activating the USB Port ................................................................................................ 5-10
5.8 Dial-Up Modem Module .............................................................................................................. 5-15
5.9 Network Radio Module (NRM) .................................................................................................... 5-16
5.9.1 Installing the NRM......................................................................................................... 5-17
5.10 Additional Technical Information................................................................................................. 5-17
Chapter 6 –Sensors and Transducers 6-1
6.1 Multi-Variable Sensor (MVS) Module Overview.............................................................................6-1
6.1.1 Installing/Removing an MVS Module...............................................................................6-4
6.1.2 Configuring a Multi-drop MVS Module Setup ..................................................................6-4
6.1.3 Lightning Protection .........................................................................................................6-6
6.2 Dual Variable Sensor (DVS) Overview ..........................................................................................6-7
6.2.1 Installing/Removing a DVS..............................................................................................6-8
6.2.2 Physically Connecting a DVS ..........................................................................................6-9
6.2.3 Configuring a DVS ........................................................................................................ 6-10
6.3 Pressure Module (PIM) Overview............................................................................................... 6-10
6.3.1 Installing/Removing a Pressure Module ....................................................................... 6-11
6.3.2 Configuring a Pressure Module .................................................................................... 6-13
6.4 Additional Technical Information................................................................................................. 6-14
Chapter 7 –Troubleshooting 7-1
7.1 General Guidelines.........................................................................................................................7-1
7.2 Graphical User Interface (GUI) ......................................................................................................7-2
7.3 Checklists.......................................................................................................................................7-4
7.3.1 LEDs ................................................................................................................................7-4
7.3.2 Serial Communications....................................................................................................7-4
7.3.3 Inputs/Outputs..................................................................................................................7-5
7.3.4 Preserving Configuration and Log Data...........................................................................7-6
7.3.5 ROCLINK 800 Configuration Software ............................................................................7-6
7.3.6 Powering Up.....................................................................................................................7-7
7.3.7 Multi-Variable Sensor (MVS) ...........................................................................................7-7
7.3.8 Resistance Temperature Detector (RTD)........................................................................7-7
7.3.9 IEC 62591 Module ...........................................................................................................7-8
7.3.10 Network Radio Module (NRM).........................................................................................7-8
7.4 Procedures.....................................................................................................................................7-8
7.4.1 Resetting the FB107 ........................................................................................................7-9
7.4.2 Restarting and Reconfiguring the FB107.........................................................................7-9
7.4.3 Troubleshooting Analog Inputs..................................................................................... 7-10
7.4.4 Troubleshooting Analog Outputs .................................................................................. 7-11
7.4.5 Troubleshooting Discrete Inputs................................................................................... 7-12
7.4.6 Troubleshooting Discrete Outputs ................................................................................ 7-12

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7.4.7 Troubleshooting Pulse Inputs ........................................................................................7-13
7.4.8 Troubleshooting RTD Inputs..........................................................................................7-13
7.4.9 Troubleshooting the Multi-Variable Sensor (MVS) ........................................................7-15
7.4.10 Troubleshooting the Enhanced Comm Module (ECM)..................................................7-16
7.4.11 Troubleshooting the Dual Variable Sensor (DVS).........................................................7-16
7.4.12 Troubleshooting the Pressure Module (PIM).................................................................7-17
7.4.13 Troubleshooting AI/DI ....................................................................................................7-18
7.4.14 Troubleshooting the Discrete Output Relay (DOR) .......................................................7-18
Appendix A –Glossary A-1
Index I-1

FloBoss 107 Instruction Manual
Revised June-2017 General Information 1-1
Chapter 1 –General Information
In This Chapter
1.1 Scope of Manual................................................................................. 1-2
1.2 FloBoss 107 Overview .......................................................................1-2
1.3 Hardware............................................................................................ 1-5
1.3.1 Processor and Memory......................................................... 1-6
1.3.2 Backplane.............................................................................. 1-6
1.3.3 Expansion Rack .................................................................... 1-6
1.3.4 Central Processing Unit (CPU) ............................................. 1-6
1.3.5 Battery and Super-capacitor.................................................. 1-8
1.3.6 Built-in Inputs and Outputs....................................................1-8
1.3.7 Built-in Communications........................................................1-8
1.3.8 Built-in Resistance Thermal Device (RTD) .........................1-10
1.3.9 Built-in Loop Output Power .................................................1-10
1.3.10 Optional Inputs and Outputs................................................1-10
1.3.11 Optional Communication Modules –COM3........................1-11
1.3.12 Optional Multi-Variable Sensor (MVS) ................................1-12
1.3.13 Optional Integral Sensors....................................................1-12
1.3.14 Optional License Key ..........................................................1-12
1.3.15 Optional Enclosures ............................................................1-12
1.3.16 Optional LCD Touchpad......................................................1-13
1.4 Firmware...........................................................................................1-14
1.4.1 History Points ......................................................................1-15
1.4.2 Alarm Log............................................................................1-16
1.4.3 Event Log ............................................................................ 1-17
1.4.4 Security................................................................................1-17
1.4.5 I/O Database .......................................................................1-18
1.4.6 Function Sequence Tables (FST) ....................................... 1-18
1.4.7 PID Control..........................................................................1-18
1.4.8 Spontaneous-Report-By-Exception (SRBX) Alarming........1-19
1.4.9 Softpoints.............................................................................1-19
1.4.10 Opcodes..............................................................................1-19
1.4.11 Pass Through Communications.......................................... 1-19
1.4.12 ROC and Modbus Protocols................................................1-19
1.4.13 User C Programs.................................................................1-20
1.5 ROCLINK™800 Configuration Software ..........................................1-20
1.6 Product Electronics .......................................................................... 1-22
1.6.1 Real-Time Clock..................................................................1-22
1.6.2 Diagnostic Monitoring..........................................................1-22
1.6.3 Automatic Self Tests ...........................................................1-22
1.6.4 Low Power Mode.................................................................1-23
1.7 Flow Measurements.........................................................................1-23
1.8 Security Gateway ............................................................................. 1-24
1.9 Additional Technical Information ...................................................... 1-25
This manual describes the FloBoss™107 Flow Manager (“FB107”), part
of the family of FloBoss flow computers manufactured by Remote
Automation Solutions, a division of Emerson Process Management. For
information about the software you use to configure the FB107, refer to
the ROCLINK™800 Configuration Software User Manual (for FloBoss
107) (part D301249X012).

FloBoss 107 Instruction Manual
1-2 General Information Revised June-2017
This chapter provides an overview of the FB107 and its components.
1.1 Scope of Manual
This manual contains the following chapters:
Chapter 1
General Information
Provides an overview of the hardware and firmware
for the FB107 base unit and the expansion rack.
Chapter 2
Installation and Use
Provides information on installation, tools, wiring,
and other essential elements of the FB107.
Chapter 3
Power Connections
Provides information on determining power
requirements for the FB107.
Chapter 4
Inputs and Outputs
Provides information for the input/output (I/O)
modules, CPU I/O assembly, and the RTD input.
Chapter 5
Communications
Provides information for the built-in communication
ports and the optional communication modules.
Chapter 6
Sensors and
Transducers
Provides information on the optional Multi-Variable
Sensor (MVS), Dual Variable Sensor (DVS), and
Pulse Input modules.
Chapter 7
Troubleshooting
Provides information on diagnosing and correcting
problems.
Glossary
Provides definitions of acronyms and terms.
Index
Provides an alphabetic listing of items and topics
contained in this manual.
1.2 FloBoss 107 Overview
A 32-bit microprocessor-based electronic flow computer, the FB107
electronically measures, monitors, and manages flow. This economical
flow computer reliably and accurately performs flow calculations,
temperature measurements, and data archival.
Note: You configure the functionality of the FB107 and monitor its
operation using a personal computer (PC) running ROCLINK 800
(“ROCLINK 800”) software.
The FB107 can measure up to four meter runs through a variety of
devices, such as an orifice plate, turbine meter, or other pulse-generating
devices. Meter inputs may also use analog transmitters. For multiple
differential pressure-run applications, you can add an optional Multiple-
Variable Sensor (MVS) module to provide an interface to remote MVS
transmitters.
The FB107 performs minute, hourly, daily, and minimum / maximum
historical data archival for standard history and a configurable time
interval archival for extended history. As the electronic solution to
replace traditional paper charting, the FB107 records the corrected flow
for differential or pulse counts and stores the data.
The FB107 computes flow for both volume and energy. It provides on-
site functionality and supports remote monitoring, measurement, data
archival, communications, and control. It stores the results of the flow

FloBoss 107 Instruction Manual
Revised June-2017 General Information 1-3
calculations in memory, which can then be and can be communicated to
an external device either on demand or periodically.
The FB107 design allows you to configure specific applications,
including those requiring logic and sequencing control using a Function
Sequence Table (FST).
A
Local (LOI) Communication Port
B
Slot 0 = CPU Module
C
CPU I/O Assembly
D
Input Power Connector
E
Memory Backup Battery Connector
F
Slot 3 = I/O or MVS module
G
Slot 2 = I/O, MVS module, or COM module (COM2)
H
Slot 1 = I/O, MVS, or COM module (COM3)
I
Wire Channel Cover
J
Display Connector
K
Integral Sensor Connector
Figure 1-1. FloBoss 107 Base Unit
F
A
G
C
B s
D
E
J
I
H
K

FloBoss 107 Instruction Manual
1-4 General Information Revised June-2017
A
Slot 4 = I/O or MVS module
B
Slot 5 = I/O or MVS module
C
Connects to FloBoss 107 base unit
D
Slot 7 = I/O or MVS module
E
Slot 6 = I/O or MVS module
F
Wire Channel Cover
Figure 1-2. FloBoss 107 Expansion Rack
D
A
F
E
B
C

FloBoss 107 Instruction Manual
Revised June-2017 General Information 1-5
Figure 1-3. FloBoss 107 with Expansion Rack
The FB107 provides the following components and features:
32-bit processor board, inter-connect board, and backplane board.
Central processing unit (CPU).
Field-upgradeable 2 MB flash ROM (read only memory).
2 MB battery backed-up RAM (random access memory) storage.
Two-, three-, or four-wire 100-ohm resistance thermal device (RTD)
input.
Battery and super-capacitor backed memory retention to provide short
and longer-term data, configuration, and operational integrity when
the FB107 is not in service or is in storage.
Three built-in communication ports.
Input power and output loop power.
Extensive applications firmware.
1.3 Hardware
The FB107 is available with four basic configurations:
Non-isolated CPU without I/O.
Non-isolated CPU with six points of I/O.
Isolated CPU without I/O.
Isolated CPU with six points of I/O.
Note: Isolation occurs between the CPU and the field logic.
W
6
8
7
4

FloBoss 107 Instruction Manual
1-6 General Information Revised June-2017
The FB107 base unit has four slots. Slot 0 is reserved for the CPU
module, which provides three communication ports, an RTD, power
input, loop power output, system variables, and optional 6 points of I/O.
Slots 1 and 2 can each contain one communication module. Slots 1, 2,
and 3 can contain input/outputs (I/O), MVS, and application modules.
1.3.1 Processor and Memory
The FB107 derives processing power from a 32-bit CMOS
microprocessor. The microprocessor features a single 32-bit internal data
bus and a single 16-bit external data bus. The microprocessor has low-
power operating modes, including inactivity and low battery condition.
The FB107 has high-speed direct memory access.
The FB107 has 2 MB of static random access memory (SRAM) for
storing database, historical, configuration, alarms, and events data.
1.3.2 Backplane
The backplane board routes signals to and from the CPU to the I/O
modules, application modules, expansion rack, the Multi-Variable Sensor,
and communication modules.
1.3.3 Expansion Rack
The four-slot optional expansion rack (see Figure 1-3) enables the FB107
to expand its I/O capabilities to meet your needs. The expansion rack
supports optional I/O, MVS, and application modules.
1.3.4 Central Processing Unit (CPU)
The base unit on the FB107 has four slots. Slot 0 is for the CPU module.
The CPU provides connections to the field wiring including surge and
static discharge protection for the field wiring. Electronics include the
RTD circuits and the final I/O drivers/receivers.
The CPU components include:
RTD input.
Input power.
Loop power output.
Reset (RST) switch.
System variables.
Diagnostic monitoring.
Real-time clock.
Automatic self-tests.
Power saving modes.
Local operator interface (LOI) EIA-232 (RS-232).
EIA-485 (RS-485) communications (COM1).

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Revised June-2017 General Information 1-7
EIA-232 (RS-232) communications (COM2).
Boot Flash –System initialization and diagnostics.
SRAM (static random access memory) with battery backup –Data
logs and configuration.
Flash ROM (Read-only memory) –Firmware image.
32-bit microprocessor and the real-time operating system (RTOS)
provide both hardware and software memory protection.
Optional CPU I/O assembly and terminations (see Figure 1-4).
Figure 1-4. CPU

FloBoss 107 Instruction Manual
1-8 General Information Revised June-2017
1.3.5 Battery and Super-capacitor
A super capacitor (“super-cap”) and a coin type battery work together to
provide backup power for the static RAM and the real-time clock. This
helps to ensure retention of short and longer-term data, configuration, and
operational integrity when the FB107 is not in service or is in storage.
For information on replacing the battery, refer to Section 2.5.1, Removing
and Installing the Battery.
Note: The super-cap is not field-replaceable.
1.3.6 Built-in Inputs and Outputs
The built-in inputs and outputs (I/O) on the CPU consist of a 3- or 4-wire
100-ohm resistance thermal detector (RTD) input interface and five
diagnostic analog inputs (AI) that monitor the:
Logical voltage.
Battery voltage from the backplane voltage input connector.
Charge in voltage originating from the CPU power input.
System milliamps originating from the power input from the CPU.
Board temperature originating at the CPU.
1.3.7 Built-in Communications
The FB107 supports up to four communication ports. The base CPU has
three built-in communication ports:
Local Operator Interface (RS-232C) –LOI for asynchronous serial
communication (Local Port).
EIA-485 (RS-485) –COM1 for asynchronous serial communication.
EIA-232 (RS-232) –COM2 for serial communication.
Local Operator
Interface Port
The Local Operator Interface (LOI) port provides for a direct, local
link between the FB107 and a personal computer (PC) through an
optional Local Operator Interface Cable using EIA-232 (RS-232C)
communications.
The LOI local port allows you to access the FB107 for configuration and
transfer of stored data. The LOI port is capable of initiating a message in
support of Spontaneous-Report-by-Exception (SRBX) alarming.
The LOI is software-configurable with baud rates from 300 to 115.2 K
and it uses a DB9 connection.
Note: You can purchase an LOI cable from your sales representative.
The LOI supports ROC or Modbus slave protocol communications. The
LOI also supports the log-on security feature of the FB107, if you enable
the security on LOI using ROCLINK 800.

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Revised June-2017 General Information 1-9
Default values for the LOI port are: 19,200 baud rate, 8 data bits, 1 stop
bit, no parity, group 1, and address 2.
EIA-485 (RS-485) Serial
Communications
COM1
COM1 provides EIA-485 (RS-485) serial communication protocols
with baud rates from 300 to 115.2 K. COM1 provides standard
differential data transmissions over distances of up to 1220 meters
(4000 feet), if wired in daisy chain pattern and properly terminated.
Note: Using a star installation pattern reduces data transmission to 602
m (2000 ft).
The EIA-485 (RS-485) drivers are designed for true multi-point
applications with multiple devices on a single bus.
Note: COM1 is labeled 485 on the CPU.
Use COM1 to monitor or modify the FB107 from a remote site, using a
host or ROCLINK 800. COM1 also supports the log-on security feature
of the FB107 if you enable the security on COM1 using ROCLINK 800.
COM1 sends and receives messages using the ROC or Modbus slave and
host protocol. COM1 is capable of initiating a message in support of
Spontaneous-Report-by-Exception (SRBX) alarming.
Default values for the EIA-485 (RS-485) communications are: 19,200
baud rate, 8 data bits, 1 stop bit, no parity, 10 millisecond key-on delay,
and 10 millisecond key-off delay. The maximum baud rate is 115.2 Kbps.
EIA-232 (RS-232) Serial
Communications
COM2
COM2 allows for EIA-232 (RS-232) asynchronous serial
communication protocols with baud rates from 300 to 115.2 K, host
serial interface. COM2 provides standard single-ended data
transmission over distances of up to 15 meter (50 feet).
Use COM2 to monitor or alter the FB107 from a remote site, using
ROCLINK 800. COM2 also supports the log-on security feature of the
FB107 if you enable the security on COM2 using ROCLINK 800.
COM2 sends and receives messages using the ROC or Modbus slave or
host protocol. COM2 is capable of initiating a message in support of
Spontaneous-Report-by-Exception (SRBX) alarming.
Default values for the EIA-232 (RS-232) communications module are:
19,200 baud rate, 8 data bits, 1 stop bit, no parity, 10 millisecond key-on
delay, and 10 millisecond key-off delay. The maximum baud rate is 115.2
Kbps.
Note: When you install a communication module in slot 2, the
firmware redirects communications port (COM2) on the CPU to
the type of module installed in slot 2. Configure COM2 based on
the type of communication module installed in slot 2.

FloBoss 107 Instruction Manual
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1.3.8 Built-in Resistance Thermal Device (RTD)
The FB107 supports a direct input from a resistance thermal device (RTD)
sensor to measure flowing temperature. An RTD temperature probe
typically mounts in a thermowell on the meter run. The RTD has a
measurement range of 40 to 400°C (40 to 752°F). The RTD is located
on the CPU.
1.3.9 Built-in Loop Output Power
Using ROCLINK 800, you can configure the I/O on the CPU module to
set the loop output power to 10 volts dc or 24 volts dc:
The 24-volt setting of the loop output power is used to power
devices that require 24 volts dc to ground, allowing the external
device to send the FB107 a 4 to 20 mA signal based on pressure,
temperature, level, and such.
The 10-volt setting of the loop output power is intended for low
power transmitters. The loop current is designed to deliver 80 mA
to power two field devices that connect back to the two analog
inputs.
Note: The CPU I/O assembly uses the CPU’s loop power output and
ground connections.
The I/O module only supports 24 volts dc loop output power. When 10
volts is selected, the loop output power will be 10V+ depending on input
power supply
1.3.10 Optional Inputs and Outputs
The input/output (I/O) options for the FB107 provide terminals for
expanded monitoring and control applications. Use I/O to drive a sampler
or odorizer, open a valve, or monitor an additional analog input.
You can order the expanded 6-point I/O as an:
I/O assembly that mounts directly on the CPU module (optional I/O
assembly).
I/O modules that mount in the I/O slots.
Both configurations provide terminations for six points of I/O and both
provide the same selections for I/O. You can configure five of the six
points of I/O using ROCLINK 800 software.
The six points of I/O consists of:
Two analog inputs (AI) or discrete inputs (DI).
One analog output (AO) or discrete output (DO).
One discrete output (DO).
Two pulse inputs (PI) or discrete inputs (DI).

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Adding an expansion rack to the FB107 base unit increases I/O by four
slots for a total of six slots of I/O. The FB107 supports up to six I/O
modules and one CPU I/O assembly.
Other available I/O modules include the 8-point AI/DI, the 6-point
AO/DO, the Discrete Output Relay (DOR) module, the HART module,
the Pulse Input (PI) module, the MVS I/O module, and the Resistance
Temperature Detector (RTD) module (see Chapter 4, Inputs and
Outputs). The Multi-Variable Sensor (MVS), Dual Variable Sensor
(DVS), and Pressure module (PM) are factory-installed options (see
Chapter 5, Sensors and Transducers).
You can install I/O modules in slots 1 through 3 on the FB107 base unit
and in slots 4 through 6 on the expansion rack. If you install a
communications module in slot 1, you can install an I/O module in slot 7.
You can use current analog inputs of 4 to 20 mA when you select the
250-ohm resistor in the AI configuration using ROCLINK 800.
Note: See Chapter 4, Inputs and Outputs, for more information on
FB107 I/O modules.
1.3.11 Optional Communication Modules –COM3
Optional communication modules provide the ability to send and receive
data through COM3. The COM3 port is capable of initiating a message in
support of Spontaneous-Report-by-Exception (SRBX) alarming.
You can install communication modules in slots 1 or 2 on the base unit.
Installing a communications module in slot 1 on the base unit activates
the COM3 communications port. Installing a communications module in
slot 2 redirects the CPU’s communications port (COM2) to the type of
module installed in slot 2.
The FB107 accommodates following types of communication modules:
EIA-485 (RS-485) serial communication protocols with baud rates
from 300 to 115.2 Kbps to provide standard differential data
transmissions over distances of up to 1220 meter (4000 feet).
EIA-232 (RS-232) serial communication protocols with baud rates
from 300 to 115.2 Kbps, host serial interface to provide standard
single-ended data transmission over distances of up to 15 meter (50
feet).
Enhanced Communication module (ECM) provides an Ethernet and a
USB 2.0 port.
Dial-Up Modem module provides communication over a Public-
Switched Telephone Network (PSTN) up to 2400 bps bits per second
(bps).

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COM3 can communicate with other devices using ROC or Modbus host
and slave protocols. The firmware can automatically detect ROC or
Modbus slave protocols.
Note: See Chapter 5, Communications, for more information on FB107
communication modules.
1.3.12 Optional Multi-Variable Sensor (MVS)
The optional Multi-Variable Sensor (MVS) module provides differential
pressure, static pressure, and temperature inputs to the FB107 for
differential pressure flow calculation.
You can install only one MVS module in the FB107. You can install the
MVS module in slots 1 through 3 on the base unit or in slots 4 through 7
on the expansion rack, regardless of the position of any other type of
module.
The MVS module provides current-limited power and EIA-485 (RS-485)
communications to external remote MVS transmitters. The FB107
supports six remote transmitters with up to four meter runs. See Chapter
6, Sensors and Transducers, for more information.
1.3.13 Optional Integral Sensors
The FB107 supports a Dual Variable Sensor (DVS) or a Pressure module
(PM), either of which attaches to the bottom of an FB107 enclosure and
connect to the DVS port on the FB107’s base unit. See Chapter 6,
Sensors and Transducers, for more information.
1.3.14 Optional License Key
The optional application license key provides extended functionality,
such as the use of various user programs. The FB107 supports up to six
different user programs. For example, you need to install a license key
with the proper license in the FB107 to run User C programs.
1.3.15 Optional Enclosures
You can place your FB107 in weather-tight enclosures. Enclosures
protect the FB107 electronics from physical damage and harsh
environments. You can choose between a polycarbonate (see Figure 1-5),
or a steel (see Figure 1-6) enclosure.
Note: If you have a PIM attached to a polycarbonate enclosure or a
DVS attached to a steel enclosure, adjust the height dimensions
accordingly.
For further information, refer to product data sheet FloBoss 107E
Enclosure Options (FB107:ENC).

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Figure 1-5. Polycarbonate enclosure with a DVS module
Figure 1-6. Steel enclosure with a PIM module
1.3.16 Optional LCD Touchpad
The optional LCD Touchpad provides an external user interface to the
process and operational information contained in the FB107. Use the

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transreflective touch-sensitive screen to view and change parameters and
review historical and real-time data in the FB107. For further
information, refer to product data sheet FloBoss 107 LCD Touchpad
(FB107:LCD).
1.4 Firmware
The firmware makes extensive use of configuration parameters, which
you manage using ROCLINK 800 software. The firmware contained in
flash ROM on the processor board determines the FB107’s functionality.
The firmware provides a complete operating system for the FB107, and is
field-upgradeable using a serial connection such as the LOI port.
Firmware includes:
Input and output database.
Historical database.
Event and alarm log database, holding up to 240 alarms and 240
events.
Applications, such as PID, AGA, and FST.
Real-time clock.
Determining task execution.
1992 AGA-3 flow calculations (with user-selectable AGA8
compressibility Detail, Gross 1, or Gross 2).
1996 AGA-7 flow calculations (with user-selectable AGA8
compressibility).
ISO5167-2003 flow calculations.
ROC or Modbus host or slave (ASCII or RTU).
Establishing and managing communications.
Communications based on the ROC protocol or Modbus slave and
host (ASCII or RTU) protocol for use with EFM applications.
Alarm call-in to host for Spontaneous-Report-By-Exception (SRBX).
Standard and Extended History.
Self-test capability.
User level security.
The FB107 provides the functions required for a variety of field
automation applications. Designed for expandability, the FB107
monitors, measures, and controls equipment in a remote environment.
You can use the FB107 for:
Applications requiring flow computation.
Logic and sequencing control using a user-defined Function Sequence
Table (FST).
Closed-loop (PID) control capabilities (requires optional I/O module
or CPU I/O assembly).
Custom User C application support.