Congatec Qseven conga-QA6 015033 User manual

Copyright © 2010 congatec AG QTOPm14 1/80
Qseven®conga-QA6
Intel®Atom™ processor E6xx/E6xxT series with an Intel®Platform Controller Hub EG20T
User’s Guide
Revision 1.4

Copyright © 2010 congatec AG QTOPm14 2/80
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2010.12.22 GDA • Preliminary release
0.2 2010.12.28 GDA • Updated information about HDMI support in section 4.13 “HDMI* and table 15 “HDMI Signal Descriptions.”
0.3 2011.01.10 GDA • Corrected the information in the pinout table and PCI Express Signal Descriptions table for pins 161-164 and 179-182.
0.4 2011.02.01 GDA • Updated section 9 “BIOS Setup Description.”
0.5 2011.12.20 GDA • Updated USB port configuration to reflect hardware revisions A.0 and later. Added additional information to section 5
“Additional Features”.
• Updated section 9 “BIOS Setup Description.”
1.0 2012.06.14 GDA • Official release.
• Added information about the use of conga-QA6 heatspreaders to sections 1.7 “Environment Specifications” and 3.0
“Heatspreader.”
• Added note to section 4.4 “Serial ATA (SATA)” about AHCI support only.
• Added section 6.5 “Important Information”.
• Updated section 9 “BIOS Setup Description.”
1.1 2012.07.13 GDA • Updated section 9 “BIOS Setup Description.”
1.2 2012.11.06 GDA • Changed maximum torque rating for heatspreader screws in section 3.1 “Heatspreader Dimensions” and added a caution
statement. Added comment about LPC_CLK signal to “LPC Signal Descriptions” table.
• Updated the PU/PD column of the USB_ID signal in table 9 “USB Signal Description”.
1.3 2013.07.10 AEM • Added section 1 “Introduction”. Moved COM Express™ Concept and Options Information to section 1 “Introduction”.
• Corrected the PCIE_WAKE# Pull-up (PU) value from 1k 3.3VSB to 10k 3.3VSB in table 5 “PCIE Signal Description”.
• Deleted the RTC alarm option and the option to use USB Mouse/Keyboard Event as Wake event in section 7.3 “ACPI
Suspend Modes and Resume Events” because these options are not supported in the BIOS.
• Updated section 9 “BIOS Setup Description”.
1.4 2017.02.17 BEU • Corrected WVGA resolution to 800x480.
• Updated template and variants.

Copyright © 2010 congatec AG QTOPm14 3/80
Preface
This user’s guide provides information about the components, features, connector and BIOS Setup menus available on the conga-QA6. It is
one of three documents that should be referred to when designing a Qseven®application. The other reference documents that should be used
include the following:
Qseven®Design Guide
Qseven®Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2010 congatec AG QTOPm14 4/80
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2010, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2010 congatec AG QTOPm14 5/80
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
C
E
R
T
I
F
I
C
A
T
I
O
N
I
S
O
9
0
0
1
TM

Copyright © 2010 congatec AG QTOPm14 6/80
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected].
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
Gbe Gigabit Ethernet
eMMC Embedded Multi-media Controller
MLC Multi-level Cell
SLC Single-level Cell
HDA High Definition Audio
cBC congatec Board Controller
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2010 congatec AG QTOPm14 7/80
Contents
1 Introduction ............................................................................. 10
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 15
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 17
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 Heatspreader and Aluminum Standoff Dimensions................. 21
4.2 Heatspreader and Aluminum Standoff Exploded View ........... 22
5 Connector Subsystems ............................................................ 23
5.1 PCI Express™........................................................................... 24
5.2 ExpressCard™ ......................................................................... 24
5.3 Gigabit Ethernet ...................................................................... 24
5.4 Serial ATA™ (SATA).................................................................. 24
5.5 USB 2.0 .................................................................................... 25
5.6 SDIO/MMC .............................................................................. 25
5.7 High Definition Audio (HDA) ................................................... 25
5.8 LCD.......................................................................................... 25
5.9 SDVO ....................................................................................... 26
5.10 DisplayPort............................................................................... 27
5.11 HDMI........................................................................................ 27
5.12 LPC........................................................................................... 27
5.13 SPI............................................................................................ 27
5.14 CAN Bus .................................................................................. 28
5.15 Power Control .......................................................................... 28
5.16 Power Management................................................................. 29
5.17 I²C Bus ..................................................................................... 29
5.18 Watchdog ................................................................................ 30
5.19 Fan Control .............................................................................. 30
6 Additional Features.................................................................. 31
6.1 congatec Board Controller (cGB)............................................. 31
6.2 Board Information.................................................................... 31
6.3 Watchdog ................................................................................ 31
6.4 I2C Bus...................................................................................... 31
6.5 Power Loss Control.................................................................. 31
6.6 Embedded BIOS...................................................................... 32
6.6.1 CMOS Backup in Non Volatile Memory................................... 32
6.6.2 OEM CMOS Default Settings and OEM BIOS Logo ............... 32
6.6.3 OEM BIOS Code...................................................................... 32
6.6.4 congatec Battery Management Interface ................................ 32
6.6.5 API Support (CGOS/EAPI) ....................................................... 33
6.7 Suspend to Ram....................................................................... 33
6.8 Onboard Solid State Disk ........................................................ 33
7 conga Tech Notes .................................................................... 35
7.1 Intel®Processor Features ......................................................... 35
7.1.1 Thermal Monitor and Catastrophic Thermal Protection .......... 35
7.1.2 Processor Performance Control ............................................... 36
7.1.3 Intel®Virtualization Technology ............................................... 36
7.2 Thermal Management ............................................................. 37
7.3 ACPI Suspend Modes and Resume Events.............................. 38
7.4 USB Port Connections.............................................................. 39
7.5 Important Information.............................................................. 40
8 Signal Descriptions and Pinout Tables..................................... 41
8.1 Bootstrap Signals..................................................................... 57
9 System Resources .................................................................... 58
9.1 Interrupt Request (IRQ) Lines................................................... 58
9.2 PCI Configuration Space.......................................................... 60
9.3 PCI Interrupt Routing............................................................... 61

Copyright © 2010 congatec AG QTOPm14 8/80
10 BIOS Setup Description........................................................... 62
10.1 Entering the BIOS Setup Program........................................... 62
10.1.1 Boot Selection Popup.............................................................. 62
10.2 Setup Menu and Navigation.................................................... 62
10.3 Main Setup Screen................................................................... 63
10.4 Platform Information submenu ................................................ 64
10.5 Advanced Setup ...................................................................... 64
10.5.1 Graphics Configuration Submenu ........................................... 65
10.5.2 Watchdog Configuration Submenu ......................................... 66
10.5.3 PCI Subsystem Settings Submenu........................................... 67
10.5.4 PCI Express Ports 1-4 Configuration Submenu........................ 68
10.5.5 PIRQ Routing Submenu ........................................................... 68
10.5.6 PCI to PCI Bridge Submenu..................................................... 69
10.5.7 ACPI Configuration Submenu.................................................. 69
10.5.8 CPU Configuration Submenu................................................... 71
10.5.9 Chipset Configuration Submenu ............................................. 72
10.5.9.1 Network Settings Submenu ..................................................... 72
10.5.10 AHCI SATA Configuration........................................................ 73
10.5.11 SDIO Configuration Submenu ................................................. 73
10.5.12 USB Configuration Submenu................................................... 73
10.5.13 Super I/O Configuration Submenu .......................................... 74
10.5.13.1 Serial Port 0/1 Configuration Submenu................................... 74
10.5.14 Serial Port Console Redirection ............................................... 75
10.5.14.1 Console Redirection Settings................................................... 76
10.6 etup.......................................................................................... 76
10.6.1 Boot Settings Configuration Submenu.................................... 77
10.7 Security Setup.......................................................................... 78
10.7.1 Security Settings ...................................................................... 78
10.8 Save & Exit............................................................................... 78
10.8.1 Save & Exit Menu..................................................................... 78
11 Additional BIOS Features ........................................................ 79
11.1 Updating the BIOS................................................................... 79
11.2 BIOS Security Features ............................................................ 79
12 Industry Specifications ............................................................. 80

Copyright © 2010 congatec AG QTOPm14 9/80
List of Tables
Table 1 conga-QA6 Commercial Variants............................................. 11
Table 2 conga-QA6 Industrial Variants ................................................. 11
Table 3 Feature Summary..................................................................... 13
Table 4 Power Limits............................................................................. 15
Table 5 Measurement Description........................................................ 16
Table 6 Power Consumption Values ..................................................... 17
Table 7 CMOS Battery Power Consumption ........................................ 17
Table 8 Display Resolutions.................................................................. 26
Table 9 Wake Events resuming system from S3 ................................... 38
Table 10 Signal Tables Terminology Descriptions .................................. 41
Table 11 Edge Finger Pinout.................................................................. 42
Table 12 PCI Express Signal Descriptions .............................................. 45
Table 13 ExpressCard Signal Descriptions ............................................. 45
Table 14 Ethernet Signal Descriptions.................................................... 46
Table 15 SATA Signal Descriptions......................................................... 47
Table 16 USB Signal Descriptions........................................................... 47
Table 17 SDIO Signal Descriptions......................................................... 48
Table 18 HDA/AC’97 Signal Descriptions .............................................. 49
Table 19 LVDS Signal Descriptions......................................................... 49
Table 20 SDVO Signal Descriptions ....................................................... 50
Table 21 DisplayPort Signal Descriptions............................................... 51
Table 22 HDMI Signal Descriptions........................................................ 51
Table 23 LPC Signal Descriptions........................................................... 52
Table 24 SPI Interface Signal Descriptions ............................................. 52
Table 25 CAN Bus Signal Descriptions................................................... 52
Table 26 Power and GND Signal Descriptions....................................... 53
Table 27 Power Control Signal Descriptions .......................................... 53
Table 28 Power Management Signal Descriptions................................. 53
Table 29 Miscellaneous Signal Descriptions........................................... 54
Table 30 Manufacturing Signal Descriptions .......................................... 55
Table 31 Thermal Management Signal Descriptions.............................. 56
Table 32 Fan Control Signal Descriptions .............................................. 56
Table 33 Bootstrap Signal Descriptions.................................................. 57
Table 34 IRQ Lines in PIC mode............................................................. 58
Table 35 IRQ Lines in APIC mode .......................................................... 59
Table 36 PCI Configuration Space Map ................................................. 60
Table 37 PCI Interrupt Routing Map....................................................... 61
Table 38 Industry Specifications ............................................................. 80

Copyright © 2010 congatec AG QTOPm14 10/80
1 Introduction
Qseven®Concept
The Qseven®concept is an off-the-shelf, multi vendor, Single-Board-Computer that integrates all the core components of a common PC and is
mounted onto an application specific carrier board. Qseven®modules have a standardized form factor of 70mm x 70mm and a specified pinout
based on the high speed MXM system connector. The pinout remains the same regardless of the vendor. The Qseven®module provides the
functional requirements for an embedded application. These functions include, but are not limited to, graphics, sound, mass storage, network
interface and multiple USB ports.
A single ruggedized MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven®module. This
MXM connector is a well known and proven high speed signal interface connector that is commonly used for high speed PCI Express graphics
cards in notebooks.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the
interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense
and optimized package, which results in a more reliable product while simplifying system integration.
The Qseven®evaluation carrier board provides carrier board designers with a reference design platform and the opportunity to test all the
Qseven®I/O interfaces available and then choose what are suitable for their application. Qseven®applications are scalable, which means once
a carrier board has been created there is the ability to diversify the product range through the use of different performance class Qseven®
modules. Simply unplug one module and replace it with another, no need to redesign the carrier board.
This document describes the features available on the Qseven®evaluation carrier board. Additionally, the schematics for the Qseven®evaluation
carrier board can be found on the congatec website.

Copyright © 2010 congatec AG QTOPm14 11/80
conga-QA6 Options Information
The conga-QA6 is currently available in several different variants. This user’s guide describes the available features these different variants offer.
Below you will find an order table showing the base configuration modules that are currently offered by congatec AG. For more information
about the additional conga-QA6 variants offered by congatec, contact your local congatec sales representative or visit the congatec website
at www.congatec.com.
Table 1 conga-QA6 Commercial Variants
Part-No. 015033 015030 015031 015032
Processor Intel®Atom™ E680 1.6 GHz Intel®Atom™ E660 1.3 GHz Intel®Atom™ E640 1.0 GHz Intel®Atom™ E620 0.6 GHz
L2 Cache 512kB 512kB 512kB 512kB
Onboard Memory up to 2GB 1GB DDR2 (800 MT/s) 1GB DDR2 (800 MT/s) 1GB DDR2 (667 MT/s) 1GB DDR2 (667 MT/s)
External PCI Express Lane(s) 3 3 3 3
Gigabit Ethernet Yes Yes Yes Yes
Onboard Solid-State Drive (SSD) No No No No
CAN Bus Yes Yes Yes Yes
CPU TDP 3.9 W 3.6 W 3.6 W 2.7 W
Part-No. 015042 015046 015047
Processor Intel®Atom™ E680 1.6GHz Intel®Atom™ E680 1.6GHz Intel®Atom™ E640 1.0GHz
L2 Cache 512kB 512kB 512kB
Onboard Memory up to 2GB 2GB DDR2 (800 MT/s) 1GB DDR2 (533 MT/s) 1GB DDR2 (533 MT/s)
External PCI Express Lane(s) 3 3 3
Gigabit Ethernet Yes Yes Yes
Onboard Solid-State Drive (SSD) No 8GB MLC 4GB MLC
CAN Bus Yes Yes Yes
CPU TDP 4.5 W 4.5 W 3.6 W
Table 2 conga-QA6 Industrial Variants
Part-No. 015038 015035 015036 015039
Processor Intel®Atom™ E680T 1.6 GHz Intel®Atom™ E660T 1.3 GHz Intel®Atom™ E640T 1.0 GHz Intel®Atom™ E640T 1.0GHz
L2 Cache 512kB 512kB 512kB 512kB
Onboard Memory 1GB DDR2 (800 MT/s) 1GB DDR2 (800 MT/s) 1GB DDR2 (667 MT/s) 1GB DDR2 (800 MT/s)
External PCI Express Lane(s) 3 3 3 3
Gigabit Ethernet Yes Yes Yes Yes
Onboard Solid-State Drive (SSD) No No No 2GB SLC
CAN Bus Yes Yes Yes Yes
CPU TDP 3.9 W 3.6 W 3.6 W 3.6 W

Copyright © 2010 congatec AG QTOPm14 12/80
Part-No. 015041 015037
Processor Intel®Atom™ E680T 1.6GHz Intel®Atom™ E620T 600 MHz
L2 Cache 512kB 512kB
Onboard Memory 2GB DDR2 (800 MT/s) 1GB DDR2 (667 MT/s)
External PCI Express Lane(s) 3 3
Gigabit Ethernet Yes Yes
Onboard Solid-State Drive (SSD) No No
CAN Bus Yes Yes
CPU TDP 4.5 W 2.7 W

Copyright © 2010 congatec AG QTOPm14 13/80
2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on Qseven®form factor specification revision 1.20
Processor Intel®Atom™ E680 1.6 GHz with 512kB L2 cache
Intel®Atom™ E660 1.3 GHz with 512kB L2 cache
Intel®Atom™ E640 1.0 GHz with 512kB L2 cache
Intel®Atom™ E620 600 MHz with 512kB L2 cache
Intel®Atom™ E680T 1.6 GHz with 512kB L2 cache (industrial grade processor)
Intel®Atom™ E660T 1.3 GHz with 512kB L2 cache (industrial grade processor)
Intel®Atom™ E640T 1.0 GHz with 512kB L2 cache (industrial grade processor)
Intel®Atom™ E620T 600 MHz with 512kB L2 cache (industrial grade processor)
Memory Onboard DDR 2 up to 2GB
Chipset Intel®Platform Controller Hub (PCH) EG20T
Audio HDA (High Definition Audio)/digital audio interface with support for multiple codecs
Ethernet Gigabit Ethernet, Micrel KSZ9021RN (commercial temp) or KSZ9021RNI (industrial temp) and Phy
Graphics Options Integrated 3D graphics engine. Dual independent display support.
• Flat panel Interface (integrated) 80 MHz LVDS Transmitter
Supports 1x18 and 1x24 bit TFT configurations.
Automatic Panel Detection via EPI (Embedded Panel Interface based on VESA
EDID™ 1.3) Resolutions 640x480 up to 1280x768.
• AUX Output 1 x Intel compliant SDVO port (serial DVO). Resolutions up to
1280x1024 @ 85 Hz. Supports external DVI, TV and LVDS transmitters
• Video Decode Acceleration:
MPEG2
MPEG4
H.264
WMV9/VC1
Peripheral
Interfaces
• 2x Serial ATA® Gen 2 (SATA port 1 not available if SSD option is used)
• 1x SDIO
• 3 PCI Express Lanes (revision 1.1 (2.5Gbps) compliant)
• 8x USB 2.0 host ports
• SPI Bus
• CAN Bus
• LPC Bus
• I²C Bus, Fast Mode (400 kHz) multimaster
Onboard Storage Optionally equipped with a Solid State Drive (SSD) up to 32 GByte in capacity
BIOS AMI Aptio®UEFI 2.x firmware, 4MByte serial SPI with congatec Embedded BIOS features
Power Mgmt. ACPI 3.0 compliant with battery support. Also supports Suspend to RAM (S3).
Note
Some of the features mentioned in the above Feature Summary are optional and require customized articles. Check the part number of your
module and compare it to the option information list on page 12 to determine what options are available on your particular module. For more
information, contact congatec support.

Copyright © 2010 congatec AG QTOPm14 14/80
2.2 Supported Operating Systems
The conga-QA6 supports the following operating systems.
• Microsoft®Windows®7
• Microsoft®Windows®Embedded Standard 7
• Microsoft®Windows®Embedded Compact 7
• Microsoft®Windows®CE 6.0
• Microsoft®Windows®XP
• Microsoft®Windows®XP Embedded
• Linux
Note
DOS is not officially supported by the Intel®Queensbay platform (E6xx series processors and EG20T Platform Controller Hub (PCH)). As a
result of this it’s possible that some legacy DOS based applications will not function properly when used in conjunction with the conga-QA6.
This limitation is due to the EG20T PCH architecture, which is not designed for legacy applications.
2.3 Mechanical Dimensions
• 70.0 mm x 70.0 mm @ (2 ¾” x 2 ¾”)
• The Qseven™ module, including the heatspreader plate, PCB thickness and bottom components, is up to approximately 12mm thick.
Heatspeader
Qseven Module PCB
Carrier Board PCB
Dimension is dependent
on connector height used
Dimension is dependent
on connector height used
All measurements are in millimeters
All dimensions without tolerance ±0.2mm
Rear View of Qseven Module
2.00
1.20 ±0.1
6.00 8.00

Copyright © 2010 congatec AG QTOPm14 15/80
2.4 Supply Voltage Standard Power
• 5V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Table 4 Power Limits
Characteristics Min. Typ. Max. Units Comment
5V Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple - - ± 50 mVPP 0-20MHz
Current
5V_SB Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple ± 50 mVPP
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum5.25V
4.75V
5V
5.05V
4.95V

Copyright © 2010 congatec AG QTOPm14 16/80
2.5 Power Consumption
The power consumption values were measured with the following setup:
• conga-QA6
• modified congatec carrier board
• conga-QA6 cooling solution
• Microsoft Windows 7 (32 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool
Table 5 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle. The CPU was stressed to its maximum frequency.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum value”.
This state shows the peak value during runtime Consider this value when designing the system’s power supply to ensure that sufcient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2010 congatec AG QTOPm14 17/80
Table 6 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-QA6 variants offered. The values
are recorded at various operating mode.
Part
No.
Memory
Size
BIOS Rev. OS
(32 bit)
CPU Current (Amp.)
Variant Cores Freq/Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3
015033 1GB QTOPR002 Windows 7 Intel®Atom™ E680 1 1.6 GHz 1.04 1.81 1.92 0.12
015030 1GB QTOPR002 Windows 7 Intel®Atom™ E660 1 1.3 GHz 1.06 1.54 1.76 0.14
015031 1GB QTOPR002 Windows 7 Intel®Atom™ E640 1 1.0 GHz 1.12 1.51 1.70 0.14
015032 1GB QTOPR002 Windows 7 Intel®Atom™ E620 1 0.6 GHz 0.96 1.09 1.24 0.12
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 7 CMOS Battery Power Consumption
RTC @ Voltage Current
20oC 3V DC 2.26 µA
Note
There is a limitation with the Intel®Platform Controller Hub EG20T and the RTC. The RTC leakage current is extremely high. This means the
RTC battery within a system featuring this chipset will be depleted after as little as 8 months.
congatec solves this RTC current leakage problem by using the onboard board controller found on the conga-QA6. When the conga-QA6 is
powered off, the EG20T RTC is disconnected and the onboard board controller’s RTC is used. When the conga-QA6 is restarted, the BIOS
overwrites the EG20T system clock with the correct one provided by the congatec board controller.

Copyright © 2010 congatec AG QTOPm14 18/80
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-MA5.
2.7 Environmental Specifications
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface. Humidity specifications are for non-condensing conditions.
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -45° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2010 congatec AG QTOPm14 19/80
3 Block Diagram
Intel® Platform
Controller Hub
EG20T
Intel® Atom™
processor
E6xx/E6xxT Series
RTC
1x Channel LCD I/F 8x USB Host
HDA I/F
BC SPI
GPIOs
LPC Bus
I2C
Fan
Control
Power Management and Control Signals
Gbit Ethernet
SM Bus SPI
1x SDIO/MMC
CAN Bus
PCIe Port 0
3 PCIe Lanes (Ports 1,2,3)
Memory Bus
(533MHz or 800MHz)
Onboard DDR2
Maximum 2GB
Micrel®
Gbit Ethernet
Phy KSZ9021RN(I)
SSD NandDrive
(optional)
Uses SATA 1
Board Controller
STM32F100R8T6b
Watchdog
BIOS
(Flash)
1x SDVO I/F
Gbe MAC
2x SATA(Port 0, 1)
SATA1
Hardware Monitoring
and
Fan Control Circuitry
1x SATA0
OR

Copyright © 2010 congatec AG QTOPm14 20/80
4 Cooling Solutions
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module and
its aluminum plate is 2mm thick.
The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also be thermally coupled to other heat
generating components with the use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution. The application
specific thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions
may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
Caution
congatec Qseven® heaspreaders have been specifically designed for use within commercial temperature ranges (0° to 60°C) only. When
using industrial temperature variants of the conga-QA6 in industrial temperature ranges (-40° to 85°C), use of the conga-QA6 heatspreaders
is not recommended by congatec and furthermore its use is at the risk of the end user. It is the responsibility of the end user to design an
optimized thermal solution that meets the needs of their application within the industrial environmental conditions it is required to operate in.
Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded
heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to
stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.
Only heatspreaders that feature micro pins that secure the thermal stacks should be used for applications that require the heatspreader to be
mounted vertically. It cannot be guaranteed that the thermal stacks will not move if a heatspreader that does not have the micro pin feature
is used in vertically mounted applications.
Additionally, the gap pad material used on all heatspreaders contains silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.