Fujitsu M2301B User manual

M2301 B/M2302B
Microdisk Drives
CE Manual
FUJITSU

REVISION RECORD
REVISION DATE DESCRIPTION
A 16·24-80) First
Edition
B 12·10-81) Manual updated
on pages 3·14,3·15,3·16 and 3·17 and editorial changes.
SPECIFICATION NO.: 803P-4605·0003A
REVISION LETTERS 1,0,0, U AND X ARE NOT USED Date;
Month, Day, Year
© Copyright 1980
by Fujitsu Limited.
Printed in Japan
B03p·4605·QOO3A .... B
Address comments concerning this manual to:
FUJITSU LIMITED
Computer Systems Marketing,
North America and OEM,
6·1 Marunouchi 2-chome, Chiyoda·ku,
Tokyo 100, Japan
TEL 03·216·3211
TLX J22833
Cable
"FUJITSULIMITED TOKYO"
or
FUJITSU AMERICA INC.
2945 Oakmead Village Court, Santa Clara, California
95051, U.S.A.
TEL [phone]
TLX 171182
TWX 910·338-0047

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Note 1. A revision of each page is indicated by the Revision Letter with the specification number of
this manual in the bottom of the page.
Note 2. A bar by the paga number in this page indicates pagination rather than content has changed.
B03P·4605·0003A .•.• B
Sheet 1 of 1
iii

Preface
This manual is for customer engineers who handle M2301 B/M2302B MICRO-DISK
DRIVES.
It describes how to operate, handle and maintain the equipment.
This manual consists
of the following ten sections.
Section 1:
Section 2:
Section 3:
Section 4:
Section 5:
Section 6:
Section
1:
Section 8:
Section 9:
Section 10:
B03P-4605-0003A .... B
General Description
Operation
Installation
and Checkout
Theory
of Operation
Troubleshooting
Maintenance
Spare Parts
IC Detail
Parts List
Schematics
Fujitsu Ltd.
v

Table of Contents
1. GENERAL DESCRIPTION .................................... .
1.1 GENERAL ............................................•......
1,1.1 General .................................................... .
1.1.2 Features ................................................ ' ... .
1.2 SPECIFICATIONS. " ..........................•............•.
1.2.1 Environmental Condition of Installation Site ........................ .
1.2.2 Power Source Specifications .................................... .
1.2.3 Performance ........................•........................
1.2.4 Reliability ................................................•..
1.3 EXTERNAL APPEARANCE .................................... .
2. OPERATION
.................................•..•..•........
2.1 GENERAL .•............................... , ............ , ... .
2.2
POWER ON/OFF SEQUENCE .................................. .
3.
INSTALLATION AND CHECKOUT ...............•..............
3.1 GENERAL .......................................... , ...... ,
3.2 UNPACKING .........................•.....................•
3;3 VISUAL INSPECTION ............................•............
3.4 MOUNTING .............•.. ~ ............................... .
3.4.1 Installation in Locker ...............................•..........
3.4.2 Securing for Transportation " .................................. .
3.4.3 Service Area ........................................•.........
3.5 CABLE ..................................................... .
3.5.1 Cable and Connector Specification ............................... .
3.5.2 Cable Connection .........•...................................
3.6 SWITCH ARRANGEMENT ..................... " .......•........
3.6.1 Drive Select (Device Number Selection) ........................... .
3.6.2 Seek Complete ............................................... .
3.6.3 Sector/Byte Clock ........................................... .
3.6.4 Sector During the Generation of Index ............................ .
3.6.5 Write/Read Data, Write/PLO Clock ...........•............... , .. .
3.6.6 Assigning the Number of Sectors ................................ .
3.6.7 Delay SKC ................•..................................
3.6.8 Controlling by the Basic Drive Select Signal ........................ .
3.6.9 Timing Margin Measurement Switch .............................. .
3.6.10 Input Negative Voltage Selection ................................ .
3.6.11 Timing Specification Selection .................................. .
3.6.12 Media Error ................................................... .
4. THEORY OF OPERATION
..•...............................•...
4.1 GENERAL ....•............. , ..... , ......................... .
4.2 OPERATION OF MECHANICAL PORTION ....................... .
4.2.1 Disk Enclosure ................................................. .
4.2.2 Spindle .............................. ' ............ ; ....•.....
4.2.3 Carriage Assembly .......................................... , .. .
4.2.4 Air Circulation in DE ..............•...........................
4.3 MAGNETIC HEADS AND RECORDING MEDIA .................... .
4.3.1 Magnetic Heads .. ' ................•.......................•....
4.3.2 Recording Media (Magnetic Disk) .•.....••........................
4.3.3 Head and Surface Configuration •.........•.......................
B03P-4605·0003A .. ~. B,
Page
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4.3.4
4.4
4.4.1
4.4.2
4.4.3
4.5
4.5.1
4.5.2
4.5.3
4.5.4
4.5.5
4.5.6
4.5.1
4.6
4.6.1
4.6.2
4.6.3
4.6.4
4.6.5
4.6.6
4.6.1
4.6.8
4.6.9
5.
6.
6.1
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.1
6.2.8
6.2.9
1.
8.
8.1
8.2
8.2.1
8.2.2
8.2.3
8.3
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
viii
Clock Track Format ' ................•..•..........•.....•••.•...
FORMAT ...............................••.......••...•......
General .................................. , ...••... , ..•.•..... ,
Track Format
...................•.•....•..........•....•••....
Detail of The Format ....................•.•........•...........
INTERFACE ..............................................•..
General .....................•.........••....•.... ' .... , .....•..
Type and Name of Signal line .................................... .
Signal Lines
.......................•...•...•..•.... ~ ......•...
Timing Specification ..............••..........•....•.. ' ....•....
Format Timing Specification ..........................•..........
Driver/Receiver ..................•.........................•..
Pin Assignment in Connector .....................•....•........•.
ELECTRIC CIRCUIT OPERATION ... : .......................... .
Block Diagram
.............•................•..........•...•..
Start/Stop Circuit .....................................••...•..
DC Spindle Motor Driving Circuit •............................•...
DC Spindle Motor Controller ......... ; .•..•...•........•.........
Unit Select Operation ................•................••.......
SEEK Control ............................................... .
Stepper Driving Circuit
......•.....................••.•.........
Index and Sector Generation Circuit .................•.......•.....
Read/Write Circuit ................................•............
TROUBLESHOOTING ................................•........
MAINTENANCE ..................•..........••.......•.......
GENERAL ............ , ......................•..••.•......•...
CHECK OF THE CONTROL CIRCUIT ................•............
General ................................••.. , •... , ., •....•.•...
Confirming the Switch Settings .....•.....•... ~ .....•..........•..
Check of Standard Frequency Oscillator ......•........•.•..•.......
Check of Clock Signal .....................• , .•....•....•...•..•.
Inspection of PLO Circuit .....................••...•.••.........
Check of Index and Sector ......................• , ..•.•..........
Inspection of VFO Circuit ......................•.....•..••....•.
Observation of the Read Waveform ............. ' .................. .
Check
of the Settling Waveform after Seeking •.•......•••........•...
SPARE PARTS .......................••••..•....•.•..•.......
IC DETAIL ............................... ' ... ' ........•.......
OUTLINE .................................................. .
LOGIC CONVENTION AND SYMBOLOGY
........................ .
TTL Logic ................................•.......•......•...
EC Logic .............. ',' ...•..................... ' ........... .
Logic Symbology
...................................•..........
IC CROSS REFERENCE GUIDE ..•.............................•
IC INTERCHANGEABILITY .......................•.•.•....•...
TTL IC Interchangeability .................•......•.....•........
ECL ....................................... " ...............•.
LINEAR IC ................• ' •• ' ...•.....•......•.•.•.. '. ' .••.....
CMOS .................................•.........•........•.
FUJITSU ANALOG MASTER SLICE IC ............ ' ..........•......
Page
4-6
4-8
4-8
4-8
4-8
4-9
4-9
4-10
4-11
4-14
4-16
4-11
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4·21
4·21
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4-42
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6-1
6-1
6-1
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6-1
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8-'
8-1
8~1
8-1 '
8-3
8-3
8-4
8-6
8-6 '
8-1
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8-7
8-7
B03P·4605-0003A .... B

Page
9. PARTS LIST ................................................. 9-1
9.1 ASSEMBLY DRAWINGS ....................................... 9-1
9.2. LIST ....................................................... 9-1
9.2.1 Index No. .............. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 9-1
9.2.2 Composition & Quantity ......................................... 9-1
9.2.3 Specification .................................................. 9-1
9.2.4 Description .................................................. 9-1
10. SCHEMATICS ............................................... 10-1
B03P-4605-0003A ..•. B
ix

Illustrations.
FIGURE Page
1.1 External Appearance ........................................... 1-8
3.1 Exterior View and Construction of Carton .......................... 3-2
3.2 Installation in Locker
........................................... 3-3
3.3 Shows Lock State
............................................. 3-4
3.4 Securing the
Unit ..........•................................... 3-4
3.5 The
Side to do Maintenance Access on the Unit ...................... 3-5
3.6 Connection
of One Unit ......................................... 3-7
3.7 Connection
of 2 to 4 Units ...................................... 3-7
3.8 Device Selecting Switch
......................................... 3-9
3.9 SEEK COMPLETE Switch
............. , . . . .. . . . . . . . . . . . . . . . . . .. 3-9
3.10 SECTOR/BYTE CLOCK
............... ;........................ 3-10
3.11 SECTOR during the Generation
of INDEX .......................... 3-10
3.12 W/R
DATA and W/P CLOCK ..................................... 3-11
3.13 Method of Assigning the Number of Sectors ......................... 3-13
3.14
DELAYSKC ................................................. 3-13
3.15 Drive Selection Control
......................................... 3-14
3.16 Time Margin Measurement Switch
......................•.......... 3-14
4.1 Appearance of the Unit ......................................... 4-1
4.2 Spindle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4-2
4.3 Carriage Assembly
............................................. 4-3
4.4
Air Circulation Inside the DE ..................................... 4-4
4.5 ReadlWrite
Head ..................................... " ........ , 4-5
4.6 Structure
of Head Slider ....................................... , 4-5
4.7 Clock
Signal Waveform/Index Pattern Waveform ...................... 4-7
4.8 Block Diagram
................................................ 4-19
4.9 Start/Stop Circuit Block Diagram
................................. 4-20
4.10
DC Spindle Motor Driving Circuit Block Diagram ..................... 4-22
4.11
DC Spindle Motor Driving Circuit Timing Chart .. . . . . . . . . . . . . . . . . . . . .. 4-23
4.12
DC Spindle Motor Control Block Diagram ............................ 4-24
4.13
DC Spindle Motor Control Timing Chart (1) .......................... 4-25
4.13
DC Spindle Motor Control Timing Chart (2) ......................... 4-26
4.14 SEEK Control Block
Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4-28
4.15 SEEK Control Flow Chart
......................•................ 4-29
4.16 CONTROLLED
STEP Mode Timing Chart .•........................ 4-30
4.17 SLAVE
STEP Mode Timing Chart ................................. 4-31
4.18 Speed Up/Slow Down Step Rate .................................. 4-32
4.19 RTZ Mode Timing Chart
........................................ 4-33
4.20 SEEK Complete
Response Timing Chart ............................ 4-34
4.21 Stepper Driving Circuit Block Diagram
............................. 4-36
4.22 Stepper Driving Circuit Timing Chart
(Page 1 of 2) ...................• 4-37
4.22 Stepper Driving Circuit Timing Chart
(Page 2 of 2) .................... 4-38
4.23 INDEX
and SECTOR Generation Circuit Block Diagram ............ . .. 4-40
4.24 INDEX
and SECTOR Generation Circuit Timing Chart
(When a Sector Length is 300 bytes) ....................•.......... 4-41
4.25 Write Circuit Block Diagram ..................................... 4-44"
4.26 Correlation between NRZ
and MFM ... . . . . . . . . . . . . . . . . . . . . . . . . . . . .• 4-45
4.27
Read Circuit Block Diagram ...................................... 4-46
4.28
Read Circuit Waveform ..................................•...... 4-47
4.29 VFO Circuit Block Diagram
...................................... 4-49
B03P-4605-0003A .... B " xi

FIGURE Page
4.30 VFO Circuit Phase Comparator Timing Chart ........................ 4-50
4.31 Data Demodulation Circuit
...................................... 4-51
8.1 TTL Medium/High Speed IC level ................................. 8-1
8.2 TTL Super High Speed IC level ................................... 8-2
8.3
low Power Schottky level ...................................... 8-2
8.4
ECl logic level .............................................. 8-3
9.1 MICRO-DISK DRIVE .......................................... 9~2
9.2 MICRO-DISK DRIVE .......................................... 9-4
xii B03P-4605-0003A .... B

Tables
TABLE ;Page
1.1 Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 1-6
.
3.1 Cable and Connector Specification ................................ 3-6
3.2 Device Number
of Selection ...................................... 3-9
3.3 SECTOR/BYTE CLOCK
........................................ 3-10
3.4 SECTOR during the Generation
of INDEX .......................... 3-10
3.5 W/R
DATA and W/P CLOCK ..................................... 3-11
3.6 Sector Counter Byte Table ....................................... 3-11
3.7 Method of Assigning the Number of Sectors ......................... 3-12
3.8
DELAY SKC ................................................. 3-13
3.9 Drive Selection Control
......................................... 3-14
7.1
Spare Parts List ............................................... 7-1
9.1 MICRO-DISK DRIVE .......................................... 9-3
9.2 MICRO-DISK DRIVE
.......................................... 9-5
B03P-4605-0003A .... B
xiii

Sc~ction l
(i(~ll(~r<11 I )(~s('ril)ti()ll

1. GENERAL DESCRIPTION
1.1 GENERAL
1.1.1 General
The M2301 B/M2302B micro-disk drives
are high performance disk drives with un-
formatted storage capacity
of 11.7MB and 23.4MB respectively.
The
unit consists of contact start-stop type heads and media, a unique head position-
ing band actuator, air filter,
and a DC motor and other parts to drive the disks.
All these are contained within a sealed cover. And outside the cover there is a
printed circuit board
with the following function; read-write, driver receiver and
sequence logic. In addition there
is an external head pre-amplifier board.
The
unit is remarkably compact, highly reliable and inexpensive. It was designed to
be the same size as on 8 inch floppy disk drive. The unit can also be connected in
daisy chain configuration
of up to 4 units. Its data format is of a fixed length and
together
with its easy-to-handle interface, has simplified system design.
1.1.2 Features
(1) Compact
Since the disks
are 200mm in outer diameter and are driven by a DC motor
directly connected to the spindle, the device is extremely compact in size.
The unit measures 217mm (8.5 in) in width, 111 mm (4.4 in) in height and
356mm (14.0 in) in length.
(2) Economical
The positioning mechanism
of the drive is a stepping motor which uses a steel
band and a viscous damper. This has made the unit less expensive.
(3) High Reliability
The
heads, disks, and the positioner are within the disk enclosure and are pro-
tected
by a plastic cover. In the disk enclosure, there is a breathing filter and a
recirculation
filter to keep the air clean, thus ensuring reliability.
(4) Preventive maintenance
is unnecessary.
(5)
DC Power
Because a built-in DC motor is used, the unit does not have to be modified to
suit line frequencies (50Hz/60Hz) or input power voltages (110, 115, 220,
240V).
(6) Physical
Size
The unit is the same size as an 8 inch floppy disk. Therefore, when replacing a
floppy disk, the locker need not be changed.
(7) Mounting
Plane
The unit can be installed in its locker either vertically or horizontally.
This allows
easier installation and flexible system design.
(8)
Loss Power Consumption
Very
low power demand (seeking 60W, non seek 50W) permits it to be used in
a wide
range of environmental temperature (5°C to 45°C) without a cooling
fan.
(9) Audible Noise
The unit's
low noise output, approx. 55dB (A-scale weighting) even during
seeking makes
it ideal for office use.
B03P-4605-0003A .... B
1-1

•
(10) Vibration
Vibration
is not transmitted to external parts because the unit is fitted to the
locker
with vibration isolating rubber mounts.
1.2 SPECIFICATIONS
1·2
1.2.1 Environmental Condition of Installation Site
(1) Temperature
Operating
Non-operating
Gradient
(2) Humidity
5
to 45°C (41° to 113°F)
-40 to 60°C (-40° to 140°F)
Less than 15°C/H
Operating
Non-operating
20% to 80% RH (Moisture must not condense.)
5% to 95% RH
(3) Vibration
Operating
Less than 0.2G (3 to 60Hz) (except resonance)
Both ways 2 minutes x 30 cycle (sine wave)
Non-operating (power OFF after installation)
Less than O.4G (3 to 60Hz)
Both ways 2 minutes x 30 cycle
(sine wave)
During storage or transportation
Less than 3G
(4) Shock
Operating
Less than 2G (maximum 10ms)
Non-operating Less than 3G (maximum 10ms)
During storage or transportation
(5) Altitude
Operating
Non-operating
Less than 5G (maximum 30ms)
Less than 3,OOOm (10,000 ft)
Less than 12,ooOm (40,000 ft)
B03P·4605·QO03A ..•. B

1.2.2 Power Source Specifications
(1) Consumption Current
Voltage P .. k Current
Steady Currant
+5V±5%
6.0Amax 4.1A
-5V ±5% or
O.5Amax O.5A
-7V - -16V
+24V ±10%
6.0Amax
1.6A
The voltage value above is the voltage at the power input terminal of the unit.
Steady current
is the current at AVERAGE SEEK + LATENCY TIME + 1
revolution READ or WR ITE.
(2) Current
Wave Form
(a) +24V current wave form
POWER ON
(A)
6
5
4
3
2
(10 SEC)
0
I \
~
~
(A)
(8)
(C)
(8)
DC motor activation
READY status Seeking
(Not seeking)
B03P4605·0003A .... A 1·3

'·4
Magnified wave of (B) part
4-6ms
Magnified wave of (C) part
~71TL
I O.5-2m. I I
: 4-6ms •
+
~J/1 /l
1_ 1m. 1 0-2m • .I
Note: The current wave shape of the leI part is the shape formed by the lapping of the above
two types
of waves asynchronously.
B03P-4605·0003A .•.. B