Fujitsu MHS2030AT - 2.5" Notebook 30GB Drive User manual

C141-E171-03EN
MHS2060AT, MHS2040AT
MHS2030AT, MHS2020AT
DISK DRIVES
PRODUCT MANUAL

FOR SAFE OPERATION
Handling of This Manual
This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section “Important Alert Items” in this manual. Keep this manual handy, and keep it carefully.
FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Use the product according to this manual.
IMPORTANT NOTE TO USERS
READ THE ENTIRE MANUAL CAREFULLY BEFORE USING THIS PRODUCT.
INCORRECT USE OF THE PRODUCT MAY RESULT IN INJURY OR DAMAGE TO
USERS, BYSTANDERS OR PROPERTY.
While FUJITSU has sought to ensure the accuracy of all information in this manual, FUJITSU
assumes no liability to any party for any damage caused by any error or omission contained in this
manual, its updates or supplements, whether such errors or omissions result from negligence,
accident, or any other cause. In addition, FUJITSU assumes no liability with respect to the
application or use of any product or system in accordance with the descriptions or instructions
contained herein; including any liability for incidental or consequential damages arising therefrom.
FUJITSU DISCLAIMS ALL WARRANTIES REGARDING THE INFORMATION
CONTAINED HEREIN, WHETHER EXPRESSED, IMPLIED, OR STATUTORY.
FUJITSU reserves the right to make changes to any products described herein without further
notice and without obligation.
This product is designed and manufactured for use in standard applications such as office work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices
for life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for mission-critical applications must have safety-assurance
measures in place beforehand. Moreover, they are requested to consult our sales representative
before embarking on such specialized use.
The contents of this manual may be revised without prior notice.
The contents of this manual shall not be disclosed in any way or reproduced in any media without
the express written permission of Fujitsu Limited.
All Rights Reserved, Copyright FUJITSU LIMITED 2002

C141-E171-03EN
Revision History
(1/1)
Edition Date Revised section (*1)
(Added/Deleted/Altered) Details
01 2002-07-12
02 2002-07-31
03 2002-09-20
*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

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C141-E171-03EN i
Preface
This manual describes the MHS Series, 2.5-inch hard disk drives. These drives
have a built-in controller that is compatible with the ATA interface.
This manual describes the specifications and functions of the drives and explains
in detail how to incorporate the drives into user systems. This manual assumes
that the reader has a basic knowledge of hard disk drives and their
implementations in computer systems.
This manual consists of seven chapters and sections explaining the special
terminology and abbreviations used in this manual:
Overview of Manual
CHAPTER 1 Device Overview
This chapter gives an overview of the MHS Series and describes their features.
CHAPTER 2 Device Configuration
This chapter describes the internal configurations of the MHS Series and the
configuration of the systems in which they operate.
CHAPTER 3 Installation Conditions
This chapter describes the external dimensions, installation conditions, and switch
settings of the MHS Series.
CHAPTER 4 Theory of Device Operation
This chapter describes the operation theory of the MHS Series.
CHAPTER 5 Interface
This chapter describes the interface specifications of the MHS Series.
CHAPTER 6 Operations
This chapter describes the operations of the MHS Series.
Glossary
The glossary describes the technical terms that need to be understood to read this
manual.
Acronyms and Abbreviations
This section gives the meanings of the definitions used in this manual.

Preface
ii C141-E171-03EN
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert
signal also indicates that damages to the product or
other property may occur if the user does not perform
the procedure correctly.
This indicates information that could help the user
use the product more efficiently.
In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:
(Example)
Data corruption: Avoid mounting the disk drive near strong
magnetic sources such as loud speakers. Ensure that the disk drive
is not affected by external magnetic fields.
The main alert messages in the text are also listed in the “Important Alert Items.”
Operating Environment
This product is designed to be used in offices or computer rooms.
Conventions
An MHS-series device is sometimes simply referred to as a "hard disk drive,"
"HDD," "drive," or "device" in this document.
Decimal numbers are represented normally.
Hexadecimal numbers are represented as shown in the following examples:
X'17B9', 17B9h, 17B9H, or 17B9H.
Binary numbers are represented as shown in the following examples: 010 or
010b.

Preface
C141-E171-03EN iii
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are
needed. Please write your opinions or requests on the Comment at the back of
this manual and forward it to the address described in the sheet.
Liability Exception
“Disk drive defects” refers to defects that involve adjustment, repair, or
replacement.
Fujitsu is not liable for any other disk drive defects, such as those caused by user
misoperation or mishandling, inappropriate operating environments, defects in the
power supply or cable, problems of the host system, or other causes outside the
disk drive.

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C141-E171-03EN v
Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Normal Operation Data corruption: Avoid mounting the disk near strong
magnetic sources such as loud speakers. Ensure that the disk
drive is not affected by external magnetic fields.
Damage: Do not press the cover of the disk drive. Pressing
it too hard, the cover and the spindle motor contact, which
may cause damage to the disk drive.
Static: When handling the device, disconnect the body
ground (500 kΩor greater). Do not touch the printed circuit
board, but hold it by the edges.
3-7

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C141-E171-03EN vii
Manual Organization
MHS2060AT, MHS2040AT
MHS2030AT, MHS2020AT
DISK DRIVES
PRODUCT MANUAL
(C141-E171)
<This manual>
• Device Overview
• Device Configuration
• Installation Conditions
• Theory of Device Operation
• Interface
• Operations
MHS2060AT, MHS2040AT
MHS2030AT, MHS2020AT
DISK DRIVES
MAINTENANCE MANUAL
(C141-F059)
• Maintenance and Diagnosis
• Removal and Replacement Procedure

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C141-E171-03EN ix
Contents
Device Overview.................................................................................................1-1
1.1 Features ...................................................................................................1-2
1.1.1 Functions and performance...................................................................1-2
1.1.2 Adaptability...........................................................................................1-2
1.1.3 Interface.................................................................................................1-3
1.2 Device Specifications..............................................................................1-4
1.2.1 Specifications summary ........................................................................1-4
1.2.2 Model and product number ...................................................................1-5
1.3 Power Requirements ...............................................................................1-5
1.4 Environmental Specifications .................................................................1-8
1.5 Acoustic Noise ........................................................................................1-9
1.6 Shock and Vibration................................................................................1-9
1.7 Reliability..............................................................................................1-10
1.8 Error Rate ..............................................................................................1-11
1.9 Media Defects .......................................................................................1-11
1.10 Load/Unload Function ..........................................................................1-11
1.11 Advanced Power Management..............................................................1-12
CHAPTER 2 Device Configuration ................................................................2-1
2.1 Device Configuration ..............................................................................2-2
2.2 System Configuration..............................................................................2-4
2.2.1 ATA interface .......................................................................................2-4
2.2.2 1 drive connection.................................................................................2-4
2.2.3 2 drives connection ...............................................................................2-4

Contents
xC141-E171-03EN
CHAPTER 3 Installation Conditions ............................................................. 3-1
3.1 Dimensions ..............................................................................................3-2
3.2 Mounting .................................................................................................3-3
3.3 Cable Connections...................................................................................3-9
3.3.1 Device connector...................................................................................3-9
3.3.2 Cable connector specifications............................................................3-10
3.3.3 Device connection ...............................................................................3-10
3.3.4 Power supply connector (CN1) ...........................................................3-11
3.4 Jumper Settings .....................................................................................3-11
3.4.1 Location of setting jumpers.................................................................3-11
3.4.2 Factory default setting.........................................................................3-12
3.4.3 Master drive-slave drive setting ..........................................................3-12
3.4.4 CSEL setting........................................................................................3-13
3.4.5 Power Up in Standby setting...............................................................3-14
CHAPTER 4 Theory of Device Operation..................................................... 4-1
4.1 Outline .....................................................................................................4-2
4.2 Subassemblies..........................................................................................4-2
4.2.1 Disk........................................................................................................4-2
4.2.2 Head.......................................................................................................4-2
4.2.3 Spindle...................................................................................................4-3
4.2.4 Actuator .................................................................................................4-3
4.2.5 Air filter.................................................................................................4-3
4.3 Circuit Configuration ..............................................................................4-4
4.4 Power-on Sequence .................................................................................4-7
4.5 Self-calibration ........................................................................................4-8
4.5.1 Self-calibration contents........................................................................4-8
4.5.2 Execution timing of self-calibration......................................................4-9
4.5.3 Command processing during self-calibration......................................4-10
4.6 Read/write Circuit .................................................................................4-10

Contents
C141-E171-03EN xi
4.6.1 Read/write preamplifier (HDIC) .........................................................4-10
4.6.2 Write circuit ........................................................................................4-10
4.6.3 Read circuit .........................................................................................4-12
4.6.4 Digital PLL circuit ..............................................................................4-13
4.7 Servo Control ........................................................................................4-14
4.7.1 Servo control circuit............................................................................4-14
4.7.2 Data-surface servo format ...................................................................4-17
4.7.3 Servo frame format..............................................................................4-19
4.7.4 Actuator motor control........................................................................4-20
4.7.5 Spindle motor control..........................................................................4-21
CHAPTER 5 Interface .....................................................................................5-1
5.1 Physical Interface ....................................................................................5-2
5.1.1 Interface signals ....................................................................................5-2
5.1.2 Signal assignment on the connector......................................................5-3
5.2 Logical Interface .....................................................................................5-6
5.2.1 I/O registers ...........................................................................................5-7
5.2.2 Command block registers......................................................................5-8
5.2.3 Control block registers ........................................................................5-13
5.3 Host Commands ....................................................................................5-14
5.3.1 Command code and parameters ..........................................................5-14
5.3.2 Command descriptions........................................................................5-18
5.3.3 Error posting......................................................................................5-104
5.4 Command Protocol..............................................................................5-106
5.4.1 PIO Data transferring commands from device to host......................5-106
5.4.2 PIO Data transferring commands from host to device......................5-108
5.4.3 Commands without data transfer ......................................................5-110
5.4.4 Other commands ...............................................................................5-112
5.4.5 DMA data transfer commands ..........................................................5-112
5.5 Ultra DMA Feature Set .......................................................................5-115
5.5.1 Overview ...........................................................................................5-115
5.5.2 Phases of operation ...........................................................................5-116

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xii C141-E171-03EN
5.5.3 Ultra DMA data in commands ..........................................................5-116
5.5.3.1 Initiating an Ultra DMA data in burst .............................................5-116
5.5.3.2 The data in transfer..........................................................................5-117
5.5.3.3 Pausing an Ultra DMA data in burst ...............................................5-117
5.5.3.4 Terminating an Ultra DMA data in burst........................................5-118
5.5.4 Ultra DMA data out commands ........................................................5-121
5.5.4.1 Initiating an Ultra DMA data out burst ...........................................5-121
5.5.4.2 The data out transfer........................................................................5-121
5.5.4.3 Pausing an Ultra DMA data out burst .............................................5-122
5.5.4.4 Terminating an Ultra DMA data out burst......................................5-123
5.5.5 Ultra DMA CRC rules.......................................................................5-125
5.5.6 Series termination required for Ultra DMA ......................................5-126
5.6 Timing .................................................................................................5-127
5.6.1 PIO data transfer................................................................................5-127
5.6.2 Multiword data transfer.....................................................................5-128
5.6.3 Ultra DMA data transfer ...................................................................5-129
5.6.3.1 Initiating an Ultra DMA data in burst .............................................5-129
5.6.3.2 Ultra DMA data burst timing requirements ....................................5-130
5.6.3.3 Sustained Ultra DMA data in burst.................................................5-133
5.6.3.4 Host pausing an Ultra DMA data in burst.......................................5-134
5.6.3.5 Device terminating an Ultra DMA data in burst .............................5-135
5.6.3.6 Host terminating an Ultra DMA data in burst.................................5-136
5.6.3.7 Initiating an Ultra DMA data out burst ...........................................5-137
5.6.3.8 Sustained Ultra DMA data out burst...............................................5-138
5.6.3.9 Device pausing an Ultra DMA data out burst.................................5-139
5.6.3.10 Host terminating an Ultra DMA data out burst...............................5-140
5.6.3.11 Device terminating an Ultra DMA data out burst ...........................5-141
5.6.4 Power-on and reset ............................................................................5-142
CHAPTER 6 Operations................................................................................. 6-1
6.1 Device Response to the Reset .................................................................6-2
6.1.1 Response to power-on ...........................................................................6-2
6.1.2 Response to hardware reset ...................................................................6-3
6.1.3 Response to software reset ....................................................................6-5

Contents
C141-E171-03EN xiii
6.1.4 Response to diagnostic command .........................................................6-6
6.2 Power Save..............................................................................................6-7
6.2.1 Power save mode...................................................................................6-7
6.2.2 Power commands ..................................................................................6-9
6.3 Defect Processing....................................................................................6-9
6.3.1 Spare area..............................................................................................6-9
6.3.2 Alternating processing for defective sectors.......................................6-10
6.4 Read-ahead Cache .................................................................................6-12
6.4.1 Data buffer structure ...........................................................................6-12
6.4.2 Caching operation ...............................................................................6-12
6.4.3 Using the read segment buffer ............................................................6-15
6.4.3.1 Miss-hit (no hit) ................................................................................6-15
6.4.3.2 Sequential reading.............................................................................6-16
6.4.3.3 Full hit ...............................................................................................6-18
6.4.3.4 Partial hit...........................................................................................6-19
6.5 Write Cache...........................................................................................6-20
6.5.1 Caching operation ...............................................................................6-20
Glossary...........................................................................................................GL-1
Acronyms and Abbreviations.........................................................................AB-1
Index ................................................................................................................. IN-1

Contents
xiv C141-E171-03EN
Illustrations
Figures
Figure 1.1 Negative voltage at +5V when power is turned off ...........................1-6
Figure 1.2 Current fluctuation (Typ.) at +5V when power is turned on .............1-8
Figure 2.1 Disk drive outerview ..........................................................................2-2
Figure 2.2 Configuration of disk media heads.....................................................2-3
Figure 2.3 1 drive system configuration ..............................................................2-4
Figure 2.4 2 drives configuration.........................................................................2-4
Figure 3.1 Dimensions.........................................................................................3-2
Figure 3.2 Orientation..........................................................................................3-3
Figure 3.3 Mounting frame structure...................................................................3-4
Figure 3.4 Location of breather ...........................................................................3-5
Figure 3.5 Surface temperature measurement points ..........................................3-6
Figure 3.6 Service area ........................................................................................3-7
Figure 3.7 Handling cautions...............................................................................3-8
Figure 3.8 Connector locations............................................................................3-9
Figure 3.9 Cable connections ............................................................................3-10
Figure 3.10 Power supply connector pins (CN1).................................................3-11
Figure 3.11 Jumper location.................................................................................3-11
Figure 3.12 Factory default setting ......................................................................3-12
Figure 3.13 Jumper setting of master or slave drive ............................................3-12
Figure 3.14 CSEL setting.....................................................................................3-13
Figure 3.15 Example (1) of Cable Select .............................................................3-13
Figure 3.16 Example (2) of Cable Select .............................................................3-14
Figure 4.1 Head structure ....................................................................................4-3
Figure 4.2 Power Supply Configuration..............................................................4-5
Figure 4.3 Circuit Configuration .........................................................................4-6
Figure 4.4 Power-on operation sequence.............................................................4-8
Figure 4.5 Read/write circuit block diagram .....................................................4-11
Figure 4.6 Frequency characteristic of programmable filter .............................4-12
Figure 4.7 Block diagram of servo control circuit.............................................4-14
Figure 4.8 Physical sector servo configuration on disk surface ........................4-18
Figure 4.9 Servo frame format...........................................................................4-19

Contents
C141-E171-03EN xv
Figure 5.1 Interface signals....................................................................................5-2
Figure 5.2 Execution example of READ MULTIPLE command .....................5-21
Figure 5.3 Read Sector(s) command protocol.................................................5-107
Figure 5.4 Protocol for command abort ..........................................................5-108
Figure 5.5 WRITE SECTOR(S) command protocol.......................................5-110
Figure 5.6 Protocol for the command execution without data transfer...........5-111
Figure 5.7 Normal DMA data transfer ............................................................5-114
Figure 5.8 Ultra DMA termination with pull-up or pull-down .......................5-126
Figure 5.9 PIO data transfer timing ...................................................................5-127
Figure 5.10 Multiword DMA data transfer timing (mode 2).............................5-128
Figure 5.11 Initiating an Ultra DMA data in burst ............................................5-129
Figure 5.12 Sustained Ultra DMA data in burst ................................................5-133
Figure 5.13 Host pausing an Ultra DMA data in burst......................................5-134
Figure 5.14 Device terminating an Ultra DMA data in burst ............................5-135
Figure 5.15 Host terminating an Ultra DMA data in burst................................5-136
Figure 5.16 Initiating an Ultra DMA data out burst ..........................................5-137
Figure 5.17 Sustained Ultra DMA data out burst ..............................................5-138
Figure 5.18 Device pausing an Ultra DMA data out burst ................................5-139
Figure 5.19 Host terminating an Ultra DMA data out burst..............................5-140
Figure 5.20 Device terminating an Ultra DMA data out burst ..........................5-141
Figure 6.1 Response to power-on ..........................................................................6-3
Figure 6.2 Response to hardware reset ..................................................................6-4
Figure 6.3 Response to software reset ...................................................................6-5
Figure 6.4 Response to diagnostic command.........................................................6-6
Figure 6.5 Sector slip processing.........................................................................6-10
Figure 6.6 Alternate cylinder assignment processing..........................................6-11
Figure 6.7 Data buffer structure...........................................................................6-12

Contents
xvi C141-E171-03EN
Tables
Table 1.1 Specifications .....................................................................................1-4
Table 1.2 Model names and product numbers....................................................1-5
Table 1.3 Current and power dissipation ...........................................................1-7
Table 1.4 Environmental specifications .............................................................1-8
Table 1.5 Acoustic noise specification...............................................................1-9
Table 1.6 Shock and vibration specification ......................................................1-9
Table 3.1 Surface temperature measurement points and standard values..........3-6
Table 3.2 Cable connector specifications.........................................................3-10
Table 5.1 Signal assignment on the interface connector....................................5-3
Table 5.2 I/O registers ........................................................................................5-7
Table 5.3 Command code and parameters........................................................5-15
Table 5.4 Information to be read by IDENTIFY DEVICE command .............5-34
Table 5.5 Features register values and settable modes.....................................5-44
Table 5.6 Diagnostic code ................................................................................5-56
Table 5.7 Features Register values (subcommands) and functions..................5-68
Table 5.8 Format of device attribute value data...............................................5-72
Table 5.9 Format of insurance failure threshold value data.............................5-72
Table 5.10 Log Directory Data Format...............................................................5-77
Table 5.11 Data format of SMART Summary Error Log...................................5-78
Table 5.11.1 Data format of SMART Comprehensive Error Log ......................5-79
Table 5.12 SMART self test log data format ......................................................5-80
Table 5.13 Contents of security password..........................................................5-82
Table 5.14 Contents of SECURITY SET PASSWORD data ............................5-86
Table 5.15 Relationship between combination of Identifier and
Security level, and operation of the lock function ...........................5-87
Table 5.16 DEVICE CONFIGURATION IDENTIFY data structure .................5-93
Table 5.17 Command code and parameters .....................................................5-104
Table 5.18 Ultra DMA data burst timing requirements .....................................5-130
Table 5.19 Ultra DMA sender and recipient timing requirements ....................5-132