Galaxy GHDXS2-1430R-16F4D User manual

Galaxy RAID
16-bay GHDXS2-1430R-16F4D
4G FC to SAS/SATA RAID Subsystem
Installation and Hardware
Reference Manual
Version 1.0 (9/07)

Galaxy GHDXS2-1430R-16F4D Installation and Hardware Reference Manual
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Contact Information
Americas
Rorke Data
76276 Golden Triangle Drive
Eden Prairie, MN 55344
USA
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://www.rorke.com

Galaxy GHDX2-1430R-16F4D Installation and Hardware Reference Manual
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Copyright 2007
This Edition First Published 2007
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Rorke Data, Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Furthermore, Rorke
Data reserves the right to revise this publication and to make changes from
time to time in the content hereof without obligation to notify any person of
such revisions or changes. Product specifications are also subject to change
without prior notice.
Trademarks
Rorke, the Rorke logo, RAIDWatch and Galaxy are registered trademarks of
Rorke Data, Inc. Other names prefixed with “GAL” and “Galaxy” are
trademarks of Rorke Data, Inc.
PowerPC® is a trademark of International Business Machines Corporation
and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.

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Warnings and Certifications
Restricted Access Location:
This equipment is intended to be installed in a RESTRICTED ACCESS
LOCATION only.
Electric Shock Warning!
To Prevent Electric Shock:
Access to this equipment is granted only to trained operators and service
personnel who have been instructed of and fully understand the possible
hazardous conditions and the consequences of accessing non-field-
serviceable units.
FCC (applies in the U.S. and Canada)
FCC Class A Radio Frequency Interference Statement
This device complies with Part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device may accept any interference received,
including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.

Galaxy GHDX2-1430R-16F4D Installation and Hardware Reference Manual
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WARNING:
A shielded power cord is required in order to meet FCC emission limits and
also to prevent interference to nearby radio and television reception.
Use only shielded cables to connect I/O devices to this equipment. You are
cautioned that changes or modifications not expressly approved by the party
responsible for compliance could void your authority to operate the
equipment.
This device is in conformity with the EMC.
CB (Certified Worldwide)
This device meets the requirements of the CB standard for electrical
equipment with regard to establishing a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus.
This standard covers only safety aspects of the above apparatus; it does
not cover other matters, such as style or performance.
China RoHS
In Compliance with AeA China RoHS Regulations (SJ/T 11364-2006)
CCC For Power Supplies’ compatibility to China Compulsory Certification.
ITE BSMI Class A, CNS 13438 (for Taiwan)

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This device is in conformity with UL standards for safety.
Rorke is committed to being properly prepared and taking all the
necessary steps that will result in our compliance with the new
European directive, RoHS (2002/95/EC), on or before the specific dates
set forth in those applicable laws and regulations. Rorke is applying its
own internal efforts and expertise and is working closely with
customers and suppliers to achieve compliance while maintaining an
uninterrupted supply of quality products. Rorke is currently
investigating, evaluating, and qualifying our materials and components
to ensure that products sold on or after 1 July 2006, in such territory,
are in compliance with the above regulations.
Disposal of Old Electrical & Electronic Equipment (Applicable in the
European Union and other European countries with separate collection
systems)
This symbol on the product or on its packaging indicates that this
product shall not be treated as household waste. Instead it shall be
handed over to the applicable collection point for the recycling of
electrical and electronic equipment. By proper waste handling of this
product you ensure that it has no negative consequences for the
environment and human health, which could otherwise be caused if this
product is thrown into the garbage bin. The recycling of materials will
help to conserve natural resources.
For more details information about recycling of this product, please
contact your local city office, your household waste disposal service or
the shop where you purchased the product.
Table of Contents
CONTACT INFORMATION .................................................................................................... II
COPYRIGHT 2007................................................................................................................III
This Edition First Published 2007.......................................................................................iii
Disclaimer..........................................................................................................................iii
Trademarks........................................................................................................................iii
WARNINGS AND CERTIFICATIONS ......................................................................................IV
TABLE OF CONTENTS .........................................................................................................VI
Precautions and Instructions.............................................................................................IX
ESD Precautions................................................................................................................X
ABOUT THIS MANUAL......................................................................................................... X
REVISION HISTORY ............................................................................................................. X
WHO SHOULD READ THIS MANUAL? ...................................................................................XI
Related Documentation .....................................................................................................xi
CONVENTIONS .....................................................................................................................XI
Naming ..............................................................................................................................xi
Lists ...................................................................................................................................xi
Software and Firmware Updates.......................................................................................xii
CHAPTER 1 INTRODUCTION
1.1 PRODUCT OVERVIEW ............................................................................................1-1
1.1.1 Product Introduction.................................................................................... 1-1
1.2 CHASSIS OVERVIEW ..............................................................................................1-2
1.2.1 Front Panel Overview................................................................................. 1-3
1.2.2 Rear Panel Overview..................................................................................1-3
1.2.3 Integrated Backplane..................................................................................1-5
1.2.4 Physical Dimensions................................................................................... 1-5
1.3 MAJOR SUBSYSTEM COMPONENTS.......................................................................1-5

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1.3.1 LCD Keypad Panel.....................................................................................1-5
1.3.2 Drive Tray................................................................................................... 1-6
1.3.3 MUX Kit ......................................................................................................1-7
1.3.4 The RAID Controller Module....................................................................... 1-8
1.3.4.1 JBOD Support..........................................................................................................1-9
1.3.4.2 Controller Module Interfaces...................................................................................1-9
1.3.4.3 DIMM Module.......................................................................................................1-12
1.3.5 BBU.......................................................................................................... 1-12
1.3.6 PSUs ........................................................................................................1-13
1.3.7 Cooling Modules.......................................................................................1-14
1.4 SUBSYSTEM MONITORING...................................................................................1-15
1.4.1 I2C bus..................................................................................................... 1-15
1.4.2 LED Indicators..........................................................................................1-16
1.4.3 Firmware (FW) and RAIDWatch GUI........................................................1-16
1.4.4 Audible Alarms .........................................................................................1-16
1.5 HOT-SWAPPABLE COMPONENTS.........................................................................1-17
1.5.1 Hot-swap Capabilities............................................................................... 1-17
1.5.2 Components............................................................................................. 1-17
CHAPTER 2 HARDWARE INSTALLATION
2.1 INTRODUCTION......................................................................................................2-1
2.2 INSTALLATION PREREQUISITES............................................................................2-1
2.3 SAFETY PRECAUTIONS ..........................................................................................2-3
2.3.1 Precautions and Instructions ......................................................................2-3
2.3.2 Static-free Installation.................................................................................2-4
2.3.3 Preparation.................................................................................................2-4
2.4 GENERAL INSTALLATION PROCEDURE.................................................................2-5
2.4.1 Installation Procedure Flowchart................................................................. 2-6
2.5 UNPACKING THE SUBSYSTEM................................................................................2-6
2.5.1 Preinstalled Components............................................................................2-7
2.5.2 Components to be Installed........................................................................2-7
2.6 HARD DRIVE INSTALLATION.................................................................................2-7
2.6.1 Hard Drive Installation Prerequisites........................................................... 2-7
2.6.2 Drive Installation without MUX Kit...............................................................2-9
2.6.3 Drive Installation with MUX Kit.................................................................... 2-9
2.7 DRIVE TRAY INSTALLATION ...............................................................................2-10
2.8 OPTIONAL MUX KIT INSTALLATION .................................................................2-12
2.9 BBU INSTALLATION ............................................................................................2-13
2.9.1 BBU Warnings and Precautions ............................................................... 2-13
2.9.2 Installation Procedure............................................................................... 2-14
2.10 RACKMOUNTING..................................................................................................2-16
CHAPTER 3 SUBSYSTEM CONNECTION
3.1 FC HOST CONNECTION PREREQUISITES..............................................................3-1
3.1.1 Choosing the Fibre Cables.....................................................................................3-1
3.1.2 FC Lasers ..............................................................................................................3-2
3.1.3 SFP Transceivers .................................................................................................. 3-3
3.1.4 FC Port Dust Plugs................................................................................................3-3
3.2 TOPOLOGY AND CONFIGURATION CONSIDERATIONS..........................................3-3
3.2.1 Basic Configuration Rules......................................................................................3-3
3.2.2 Fibre Channel Topologies......................................................................................3-4
3.2.3 Host-side Topologies .............................................................................................3-4
3.2.4 Drive-side Connection............................................................................................3-5
3.2.5 Internal Connections..............................................................................................3-5
3.2.6 Unique Identifier.....................................................................................................3-5
3.2.7 ID/LUN Mapping ....................................................................................................3-5
3.3 DIP SWITCH...........................................................................................................3-6
3.4 SAMPLE TOPOLOGIES............................................................................................3-8
3.4.1 Multiple RAID, Fault-tolerant Connection...............................................................3-8
3.4.2 Dual-Controller, Fault-Tolerant Connection ......................................................... 3-11
3.4.3 Drive-side Expansion...........................................................................................3-12
CHAPTER 4 SYSTEM OPERATION AND MONITORING.
4.1 POWER ON.............................................................................................................4-1
4.1.1 Check List................................................................................................... 4-1
4.1.2 Power On Procedure..................................................................................4-2
4.1.3 Power On Status Check .............................................................................4-3

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4.1.4 LCD Screen................................................................................................4-4
4.2 POWER OFF PROCEDURE ......................................................................................4-5
4.3 SYSTEM MONITORING OVERVIEW .......................................................................4-6
4.4 STATUS-INDICATING LEDS...................................................................................4-8
4.4.1 Brief Overview of the LEDs.........................................................................4-8
4.4.2 LCD Keypad Panel.....................................................................................4-8
4.4.3 Drive Tray LEDs ....................................................................................... 4-10
4.4.4 Controller Module LEDs............................................................................ 4-10
4.4.4.1 Controller Status LEDs..........................................................................................4-11
4.4.4.2 Fibre Port LEDs.....................................................................................................4-11
4.4.4.3 Restore Default LED .............................................................................................4-11
4.4.4.4 LAN Port LEDs.....................................................................................................4-11
4.4.5 BBU LED.................................................................................................. 4-12
4.4.6 PSU LEDs ................................................................................................ 4-12
4.4.7 Cooling Module LEDs............................................................................... 4-13
4.5 AUDIBLE ALARM .................................................................................................4-14
4.6 I2CMONITORING.................................................................................................4-15
CHAPTER 5 SYSTEM MAINTENANCE
5.1 OVERVIEW .............................................................................................................5-1
5.1.1 About Subsystem Maintenance.................................................................. 5-1
5.1.2 General Notes on Component Replacement.............................................. 5-2
5.2 REPLACING CONTROLLER MODULE COMPONENTS ............................................5-3
5.2.1 Considerations............................................................................................5-3
5.2.2 Removing the Controller Module ................................................................ 5-3
5.2.3 Replacing the Controller Module.................................................................5-5
5.3 DIMMMODULE REPLACEMENT..........................................................................5-7
5.3.1 DIMM Module Considerations .................................................................... 5-7
5.3.2 DIMM Module Upgrade/Replacement Procedure....................................... 5-7
5.4 REPLACING A FAULTY BBU..................................................................................5-9
5.5 REPLACING A FAULTY PSU ................................................................................5-12
5.5.1 PSU Overview .......................................................................................... 5-12
5.5.2 Replacing the PSU ................................................................................... 5-13
5.6 COOLING MODULE MAINTENANCE ....................................................................5-16
5.6.1 Notes on Cooling Module Maintenance.................................................... 5-16
5.6.2 Replacing a Cooling Module..................................................................... 5-17
5.7 REPLACING A FAILED HARD DRIVE ...................................................................5-19
5.7.1 Hard Drive Maintenance Overview........................................................... 5-19
5.7.2 Replacing a Hard Drive.............................................................................5-20
5.8 REPLACING A MUX KIT......................................................................................5-22
APPENDIX A SPECIFICATIONS
A.1 TECHNICAL SPECIFICATIONS...............................................................................A-1
Environmental Specifications.....................................................................................A-1
Power Requirements...................................................................................................A-1
Certifications.................................................................................................................A-2
Warning Alarms............................................................................................................A-2
A.2 FUNCTIONAL SPECIFICATIONS.............................................................................A-2
Configuration Specifications.......................................................................................A-2
Architectural Specifications........................................................................................A-3
A.3 DRIVE TRAY SPECIFICATIONS .............................................................................A-3
A.4 POWER SUPPLY SPECIFICATIONS.........................................................................A-3
A.5 COOLING MODULE SPECIFICATIONS...................................................................A-4
A.6 RAID MANAGEMENT...........................................................................................A-4
A.7 FAULT TOLERANCE MANAGEMENT..................................................................... A-5

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APPENDIX B SPARE PARTS AND ACCESSORIES
B.1 SPARE PARTS ........................................................................................................ B-1
B.2 ACCESSORIES........................................................................................................ B-2
APPENDIX C PINOUTS
C.1 SFP CONNECTOR PINOUTS ..................................................................................C-1
C.2 COM1 CABLE:DB9 AND AUDIO JACK PINOUTS ................................................C-3
C.3 COM1 CABLE:DB9 AUDIO JACK Y-CABLE PINOUTS........................................C-3
C.4 COM2 UPSCABLE:DB9 AND AUDIO JACK PINOUTS........................................C-4
C.5 GAL-9011 NULL MODEM ....................................................................................C-5
C.6 LAN PORT PINOUTS.............................................................................................C-6
C.7 POWER CONNECTORS...........................................................................................C-7
C.8 CONNECTOR TYPE AND OTHER INFORMATION ..................................................C-7
C.8.1 Connector Type and Supported Connections..........................................................C-7

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Precautions and Instructions
•If it is necessary to transport the subsystem, repackage all disk drives
with its drive trays in the foam blocks in the original shipping package.
•Provide a soft, clean surface to place your subsystem on before working
on it. Servicing on a rough surface may damage the exterior of the
chassis.
•Leaving any of these drive bays empty will seriously affect the
efficiency of the airflow within the enclosure, and will consequently
lead to the system overheating, which can cause irreparable damage.
•Prior to powering on the subsystem, ensure that the correct power range
is being used.
•All modules must be properly installed before powering on the
subsystem. If a cooling module is missing, the power supply unit (PSU)
will overheat rapidly.
•If a module fails, leave it in place until you have a replacement unit and
you are ready to replace it.
•Handle subsystem modules using their retention screws, eject levers,
and the metal frames/face plates. Avoid touching PCB boards and
connector pins.
•Airflow Consideration: The subsystem requires an airflow clearance,
especially at the front and rear.
•Be sure that the rack cabinet into which the subsystem chassis will be
installed provides sufficient ventilation channels and airflow circulation
around the subsystem.
•To comply with safety, emission, or thermal requirements, none of the
covers or replaceable modules should be removed. Make sure that all
enclosure modules and covers are securely in place during operation.
•Dual redundant controller models come with two controller modules
that must be installed into the subsystem.
ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work pad are
recommended. Avoid dust and debris in your work area.