Contents
Contents
Preface.................................................................................................................................................................... I
1 GR551x Overview................................................................................................................................................1
1.1 Features............................................................................................................................................................... 1
1.2 Block Diagram......................................................................................................................................................4
2 Pinout................................................................................................................................................................. 5
2.1 GR5515IGND/GR5515IENDU QFN56................................................................................................................... 5
2.2 GR5515I0NDA QFN56.......................................................................................................................................... 8
2.3 GR5515RGBD BGA68......................................................................................................................................... 12
2.4 GR5515GGBD BGA55.........................................................................................................................................16
2.5 GR5513BEND (NRND)/GR5513BENDU QFN40.................................................................................................. 20
3 Minimal Design for GR551x SoC........................................................................................................................23
3.1 Schematic Design Guideline.............................................................................................................................. 23
3.1.1 Power Supply............................................................................................................................................ 23
3.1.1.1 Introduction......................................................................................................................................23
3.1.1.2 Power-on Sequence......................................................................................................................... 24
3.1.1.3 Power Supply Scheme......................................................................................................................26
3.1.1.4 I/O LDO.............................................................................................................................................29
3.1.2 Clock..........................................................................................................................................................31
3.1.2.1 Introduction......................................................................................................................................31
3.1.2.2 32 MHz Clock (XO)........................................................................................................................... 31
3.1.2.3 32.768 kHz Clock..............................................................................................................................32
3.1.3 RF.............................................................................................................................................................. 33
3.1.3.1 Introduction......................................................................................................................................33
3.1.3.2 RF Scheme........................................................................................................................................34
3.1.4 I/O Pins..................................................................................................................................................... 34
3.1.5 SWD Interfaces..........................................................................................................................................35
3.1.6 External Flash............................................................................................................................................35
3.2 PCB Design and Layout Guideline..................................................................................................................... 36
3.2.1 PCB Layer Stackup.................................................................................................................................... 36
3.2.2 Components Layout.................................................................................................................................. 37
3.2.3 Power Supply............................................................................................................................................ 37
3.2.3.1 DC-DC Switching Regulator.............................................................................................................. 37
3.2.3.2 RF Input Power Supply.....................................................................................................................38
3.2.4 Clock..........................................................................................................................................................39
3.2.5 RFIO Port...................................................................................................................................................40
3.2.6 Grounding................................................................................................................................................. 41
3.2.7 ESD Protection Design.............................................................................................................................. 42
3.2.7.1 System-level ESD Design.................................................................................................................. 42
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