HP 280 Pro G2 Small Form Factor Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 280 Pro G2 Small Form Factor Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
MB, Memory,HDD PCA,ODD PCA,PSU PCA
5
Batteries
All types including standard alkaline and lithium
coin or button style batteriesMB
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
2
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
system fan, Cooler fan,PSU fan
3
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
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EL-MF877-00 Page 2
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Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1crisscross screw driver
2#
Description #2 hexagon screw driver
T15
Description #3 electric iron
QUICK 310
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release the screw on the access panel.
2. Remove access panel from the unit.
3. Remove front bezel from the unit.
4. Remove the heat sink cover from unit.
5. Remove HDD / ODD cable from the unit.
6. Remove ODD from the unit.
7. Remove HDD cage from the unit.
8. Remove HDD from HDD cage.
9. Remove PCA power cable and system fan cable from PCA.
10. Take out PCA from unit.
11. Remove cooler from PCA.
12. Remove memory from PCA
13. Take off PSU and system fan from the unit.
14. Open the PSU and take off the PSU fan.
15. Take off PCA from the PSU.
16. Take off CAP using electric iron..
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Release the screw on
the access panel.
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EL-MF877-00 Page 3
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2. Remove access panel
from the unit.
Griping the tab at the end
of access panel, pull access
panel towards the rear and
remove it from unit.
3. Remove front bezel
from the unit.
Release 3 bezel latches
from chassis by pulling the
bezel latches outwards.
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EL-MF877-00 Page 4
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1. 2.
3. 4
4. Remove the heat sink
cover from unit.
5. Remove HDD / ODD
cable from the unit.
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EL-MF877-00 Page 5
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6. Remove ODD from the
unit.
.
7. Remove HDD cage from
the unit.
Release screw from the
HDD cage, and take out the
HDD cage from unit.
8. Remove HDD from HDD
cage.
Release 4pcs screw from
HDD cage, and take out
HDD from HDD cage.
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EL-MF877-00 Page 6
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9. Remove PCA power
cable and system fan
cable from PCA.
10. Take out PCA from
unit.
Release 7pcs screws
from PCA, and take out the
motherboard from unit.
11. Remove cooler from
PCA.
Release 4pcs cooler screws
from PCA, and remove
cooler from PCA.
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EL-MF877-00 Page 7
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12. Remove memory from
PCA.
13. Take off PSU and
system fan from the unit.
Release 4pcs system fan
screws from chassis, press PSU
raised and takes out PSU from
the unit.
14. Open the PSU and take
off the PSU fan.
Rotate screw driver to
release PSU cover, and
remove PSU fan.
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EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
15. Take off PCA from the
PSU.
Rotate the screw driver to
release the PCA from PSU.
16. Take off CAP using
electric iron.
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