HP 64100A User manual

HP64000
Logic Development
System
Model 64100A
Mainframe
Service Manual
r/i~ HEWLETT
~a PACKARD

CERTIFICATION
Hewlett-Packard Company certifies that this product met its published specifications at the
time
of shipment from the factory. Hewlett-Packard further certifies that its calibration
measurements are traceable to the United States National Bureau of Standards, to the extent
allowed by the Bureau's calibration facility, and to the calibration facilities of other
International Standards Organization members.
WARRANTY
This Hewlett-Packard system product is warranted against defects in materials and
workmanship
for a period of 90 days from date of installation. During the warranty period, HP
will, at its options, either repair
or replace products which prove to be defective.
Warranty service
of this product will be performed at Buyer's facility at no charge within HP
service travel areas. Outside HP service travel areas, warranty service will be performed at
Buyer's facility
only upon HP's prior agreement and Buyer shall pay HP's round trip travel
expenses. In all
other cases, products must be returned to a service facility designated by HP.
For products returned to HP for warranty service. Buyershall prepay shipping charges to HP
and HP shall pay shipping charges to return the
product to Buyer. However, Buyershall pay all
shipping charges, duties, and taxes for products returned to HP from another country.
HP warrants that its software and firmware designated by HP for use with
an instrument will
execute its programming instructions when
properly installed on that instrument. HPdoes not
warrant that the operation
of the instrument, or software, or firmware will be uninterrupted or
error free.
LIMITATION OF WARRANTY
The foregoing warranty shall not apply to defects resulting from improper or inadequate
maintenance by Buyer, Buyer-supplied software
or interfacing, unauthorized modification or
misuse, operation outside of the environmental specifications forthe product, or improper site
preparation or maintenance.
NO OTHER WARRANTY IS EXPRESSED OR IMPLIED. HP SPECIFICALLY DISCLAIMS THE
IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE.
EXCLUSIVE REMEDIES
THE REMEDIES PROVIDED HEREIN ARE BUYER'S SOLE AND EXCLUSIVE REMEDIES. HP
SHALL NOT BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, WHETHER BASED ON CONTRACT, TORT, OR ANY OTHER
LEGAL THEORY.
ASSISTANCE
Product maintenance agreements and other customer assistance agreements are available for
Hewlett-Packard products.
For any assistance, contact your nearest Hewlett-Packard Sales and Service Office. Addresses
are
provided at the back of this manual.
CW&A 2/81

SERVICE MANUAL
MODEL 64100A
MAINFRAME
SERIAL NUMBERS
This manual applies directly to MAINFRAMES with
serial numbers prefixed 2336A.
© COPYRIGHT HEWLETT-PACKARD COMPANY 1981, 1982, 1983
LOGIC SYSTEMS DIVISION
COLORADO SPRINGS, COLORADO, U.S.A
Manual
Part No. 64100-90910
Microfiche Part No. 64100-90810
All Rights Reserved
PRINTED: DECEMBER 1983

SAFETY SUMMARY
The following general safety precautions must be observed during all phases of operation, service,
and repair of this Instrument. Failure
to comply with these precautions or with specific warnings
elsewhere In
this manual violates safety standards of design, manufacture, and Intended use of the
Instrument. Hewlett-Packard Company assumes no /lability for the customer's failure
to comply
with these requirements.
GROUND THE INSTRUMENT.
To minimize shock hazard, the instrument chassis and cabinet must be connected to an electrical
ground. The instrument is equipped with a three-conductor ac power cable. The power cable
must either be plugged into an approved three-contact electrical outlet or used with a three-contact
to
two-contact adapter with the grounding wire (green) firmly connected to an electrical ground
(safety ground) at the power outlet. The power
jack and mating plug of the power cable meet
International Electrotechnical Commission (IEC) safety standards.
DO NOT OPERATE IN AN EXPLOSIVE ATMOSPHERE.
Do not operate the instrument in the presence of flammable gases or fumes. Operation of any
electrical instrument in such an environment constitutes a definite safety hazard.
KEEP AWAY FROM LIVE CIRCUITS.
Operating personnel must not remove instrument covers. Component replacement and internal
adjustments must be made by qualified maintenance personnel. Do not replace components with
power cable connected. Under certain conditions, dangerous voltages may exist even with the
power cable removed. To avoid injuries, always
disconnect power and discharge circuits before
touching them.
DO NOT SERVICE OR ADJUST ALONE.
Do not attempt internal service or adjustment unless another person, capable of rendering first aid
and resuscitation,
is present.
USE CAUTION WHEN EXPOSING OR HANDLING THE CRT.
Breakage of the Cathode-ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion).
To prevent CRT implosion, avoid rough handling or jarring of the instrument. Handling of the CRT shall
be done only by qualified maintenance personnel using approved safety mask and gloves.
DO NOT SUBSTITUTE PARTS OR MODIFY INSTRUMENT.
Because of the danger of introducing additional hazards, do not install substitute parts or perform
any
unauthorized modification of the instrument. Return the instrument to a Hewlett-Packard
Sales and Service Office for service and repair to ensure that safety features are maintained.
DANGEROUS PROCEDURE WARNINGS.
Warnings, such as the example below, precede potentially dangerous procedures throughout this
manual. Instructions contained in the warnings must be followed.
I WARNING I
Dangerous voltages, capable of causing death, are present in this instrument.
Use extreme caution when handling, testing, and adjusting.
88-2-1/76

Model 64100A - Table of contents
Table of Contents
Section
Title
Page
I General Information .............................................. 1-1
1-1
Manual Introduction .................................. " ..... 1-1
1-4 Chapter Introduction ........................................ 1-1
1-6
Physical Description ........................................ 1-1
1-15 Specifications ................................. , ............ 1-3
1-17 Instruments Covered In This Manual .......................... 1-3
1-20 Related Documents ........................................... 1-4
II Installation ..................................................... 2-1
2-1
Introduction ................................................ 2-1
2-3
Initial Inspection .......................................... 2-1
2-4
Packaging ................................................... 2-1
2-5
Original Packaging .......................................... 2-1
2-9 Installation and Removal of Mainframe Components ............ 2-2
III Operation ........................................................ 3-1
3-1 General ..................................................... 3-1
IV
Performance Verification ......................................... 4-1
4-1 Introduction ................................................ 4-1
4-4 Boot-Up Modes ............................................... 4-1
4-6 Power-Up Sequence ........................................... 4-2
4-9 Power-Up ROM Test ........................................... 4-3
4-10 Power-Up RAM Test ........................................... 4-4
4-11 Performance Verification Boot Procedure ..................... 4-6
4-12 Performance Verification Procedure .......................... 4-8
4-15 ROM Test Procedure ......................................... 4-11
4-16 RAM Test Procedure ......................................... 4-12
4-17
I/O Write Test Procedure ................................... 4-13
4-18 I/O Read Test Procedure .............. '" ................... 4-14
4-19 Time Interrupt Test Procedure .............................. 4-15
4-20 Keyboard Test Procedure .................................... 4-15
4-21
System Bus Test Procedure .................................. 4-16
4-22 RS232 Test Procedure ....................................... 4-17
4-23 PV On Existing Local Mass Storage Option ................... 4-17
4-24
Floppy Disc Test Procedure ................................. 4-18
4-25 Tape Test Procedure ........................................ 4-19
4-26
Troubleshooting PV Failures Using SA. '" ................... 4-20
4-29 Troubleshooting ............................................ 4-20
MF iii

Model 64100A - Table of contents
Table of Contents (Cont'd)
Section
Title
Page
v Adjustments ...................................................... 5-1
5-1 General ..................................................... 5-1
VI Replaceable Parts ................................................ 6-1
6-1 Introduction ..........................•..................... 6-1
6-3 Abbreviations ............................................... 6-1
6-5 Major Components ............................................ 6-1
6-7 Ordering Information ........................................ 6-3
6-10 Direct Mail Order System .................................... 6-3
6-13 Parts List .................................................. 6-3
VII Manual Backdating ..........................•..................... 7-1
7 -1 Introduct ion ................................................ 7-1
7-3 Manual Changes .............................................. 7-1
VIII Service .......................................................... 8-1
8-1 Block Diagram Description ............. '" ................... 8-1
MF iv

Model 64100A - Table of contents
List of Illustrations
Figure
Title
Page
1-1 64100A Mainframe ................................................. 1-0
1- 2 Mainframe Dimensions ............................................. 1-4
1-3 Mainframe Configuration .......................................... 1-5
4-1 Rear Panel Switch Locations ...................................... 4-9
4-2
Display Test Pattern ............................................. 4-9
4-3
Performance Verification Test ................................... 4-11
4-4 Keyboard PV Test Sequence ....................................... 4-16
4-5 Mainframe Troubleshooting Guide ................................. 4-22
6-1 Mainframe Component Locator (3 pages) ........................... 6-7
6-2
Mainframe Attach Screw Locator (7 pages) ....................... 6-10
8-1 Mainframe Simplified Block Diagram ............................... 8-6
8-2
A2 Motherboard Component Locator ................................. 8-7
List of Tables
Table Title
Page
1-1 Basic Power Current Drain ........................................ 1-2
1-2
Power and Environmental Requirements ............................. 1-3
4-1 PV Boot Keys ..................................................... 4-8
4-2
Performance Verification Soft Keys .............................. 4-10
4-3 Failure Conditions and Routing .................................. 4-21
6-1 List of Manufacturers' Codes ..................................... 6-2
6-2
Reference Designators and Abbreviations .......................... 6-5
6-3 Replaceable Parts ................................................ 6-6
6-4 Attach Screw Index .............................................. 6-17
7-1 Serial Number vs. Manual Change Number ........................... 7-1
8-1 Card Type Vs. Supply Voltage ..................................... 8-3
8-2 Display Driver Connector J14 Signals ............................. 8-4
8-3 Keyboard Connector J15 Signals ................................... 8-4
8-4 BNC Connector J16 Signals ........................................ 8-5
8-5
Motherboard Signal Distribution .................................. 8-7
MFv

Model 64100A - General Information
r
, \
\
j
1
1
\
\
\
Figure 1- 1. 64100A Mainframe.
MF 1-0

"Model 64100A - General Information
SECTION I
GENERAL INFORMATION
1-1. MANUAL INTRODUCTION.
1-2. This manual contains technical information to troubleshoot, install, and
maintain the 64100A Logic Development Station. Each of the five chapters
(Mainframe, CPU, Display Controller, I/O, and Power Supply) is seperated by a
Tab. This allows the user to easily find any chapter.
1-3. Each of the five chapters is organized into eight sections: Section I
introduces the reader to the manual and gives a brief physical description of
the product. Section II presents the installation and removal procedures for
the system components. Section III covers operation and handling. Section IV
describes how to troubleshoot and repair the system. Section V references
those components that have adjustments. Section VI lists the replaceable parts
and Section VII contains backdating information needed to make this manual
applicable to older machines. Section VIII presents the theory-of-operation to
the block diagram level and is intended to support the troubleshooting
procedures.
1-4. CHAPTER INTRODUCTION.
1-5. This chapter contains technical information concerning the installation,
maintenance, troubleshooting and theory-of-operation of the 64100A Mainframe.
The information contained in the Mainframe Chapter describes the overall system
and how the various components relate to each other with the emphasis on
troubleshooting and repairing. More detailed information on the components can
be found under the respective Chapter or the component in question (i.e., CPU,
DISPLAY CONTROLLER and DRIVER, I/O, POWER SUPPLY, and OPTIONS).
1-6. PHYSICAL DESCRIPTION.
1-7. The 64100A Mainframe is a single enclosure similar to a CRT terminal (see
figure 1-1). It weighs 34.02 Kg (75 pounds) and thus some care should be used
in moving it. The Mainframe dimensions are given in figure 1-2. The five
major areas of the developement station mainframe are:
a. CRT Display
b. Keyboard
c. Rear Panel
d. Card Cage
e. Power Supply
1-8. The four areas of display generation consist of the display controller
board, display driver, the CRT and CRT bezel assembly.
MF 1-1

Model 64100A - General Info~ation
1-9. The-four areas of the Rear panel are Power Control, HP-IB system interface
bus, RS-232 serial interface, and system control source. The power functions
are on the lower right-hand side of the rear panel. The model 64100A requires
110/220 VAC +/-15%, 48-66 HZ. The position of the LINE SELECTOR determines
either 110 V (10 AT fuse) or 220 V (5 AT fuse) operation. The power ON/OFF
switch is a rocker type.
1-10. A card cable opening is provided to the outside of the mainframe through
the space between the rear of the top cover and rear panel. Three slots with
clamps are provided for access. Cable length for option boards is determined
at the factory and are shipped at maximum length.
1-11. There are 13 PC board slots (see figure 1-3). The first three slots have
printed circuit boards installed at the factory. These PC boards must be
installed in the order given for the 64000 system to operate. The three
required boards are:
slot A - I/O PC Board
slot B - Display Control PC Board
slot C - CPU PC Board
1-12. For convenience, board identifier labels for the first three boards are
located just above the cardcage on the left-hand side. The remaining ten
option slots are numbered 0-9.
1-13. The PC boards interface to the system through the motherboard on the
bottom of the card cage. A cable from the Rear Panel PC board (on the rear
panel) makes connection to the top center connector on the I/O board.
1-14. There is a limit to the number and types of option boards that may be
installed in the cardcage without exceeding the capability of the 400 watt
Power Supply. This limit is determined by the amount of available current from
the power supplies. Table 1-1 lists the power supply current drain for the
mainframe with only the three mandatory boards installed.
MF 1-2
Table 1-1. Basic Power Supply Current Drain
ITEM
Processor ,ROM
I/O
Disp Control,RAM
Keyboard
Display Driver
Rear Panel
Bus
Pullups
Subtotal
Available Current
(NO OPTIONS INSTALLED)
+12V
0·595
0.164
0.640
1·500
2.899
4 Amps
+5V
1.429
0.708
1·533
0.100
0.714
0.070
4.793
45 Amps
-5V
0.0003
0.0064
0.239
0.2457
25 Amps
-12V
0.078
0.078
1 Amp
-3V
0.0003
0.0064
0.239
0.2457
30 Amps

Model 64100A - General Information
1-15. SPECIFICATIONS.
1-16. The environmental specifications and power requirements for the 64100A
Mainframe are supplied in Table 1-2.
Table 1-2. Power and Environmental Requirements
ITEM OPERATING REQUIREMENTS
Line Voltage 110/220, + or - 15%
Single Phase
Line Frequency 50/60 Hz +15% or -10%
Operating Temperature
Operating Humidity
Power Outlets:
US, Canada, Japan
UK
Australia, New Zealand
Europe (except UK and
Switzerland)
Switzerland
o Deg C (32 Deg F) to
40 Deg C (104 Deg F)
0% to 80% RH, non-condensing
(max wet bulb temp: 26 Deg C
(78 Deg F)
NEMA 5-15 (15A)
BS 1363 (13A)
AS C112 (7-5A)
CEE 7-V11 (10/16A)
SEV 1011 (lOA)
1-17. INSTRUMENTS COVERED BY THIS MANUAL.
1-18. Attached to the instrument is a serial number plate. The serial number
is in the form: OOOOA 00000. It is in two parts; the first four digits and
the letter are the serial prefix and the last five digits are the suffix. The
prefix is the same for all identical instruments; it changes only when a change
is made to the instrument. However, the suffix is assigned sequentially and is
different for each instrument. The contents of this manual apply to
instruments with serial number prefix(es) listed under SERIAL NUMBERS on the
title page.
1-19. An instrument manufactured after the printing of this manual may have a
serial number prefix that is not listed on the title page. This unlisted
serial number prefix indicates the instrument is different from those described
in this manual. The manual for this modified instrument is accompanied by a
yellow Manual Changes supplement. the supplement contains "change information"
that explains how to adapt the manual to the newer instrument.
MF 1-3

Model 64l00A - General Information
1-20. In addition to change information, the supplement may contain
information for correcting errors in the manual. To keep this manual as
current and accurate as possible, Hewlett-Packard recommends that you
periodically request the latest Manual Changes supplement. The supplement for
this manual is identified with the manual print date and part number, both of
which appear on the manual title page.
1-21. For information concerning a serial number prefix that is not listed on
the title page or in the Manual Changes supplement, contact your nearest
Hewlett-Packard Sales/Service Office.
1-22 RELATED DOCUMENTS.
1-23. The following documents provide addition~~ information pertaining to the
use of the HP 64000 system. It is recommended that the System Overview Manual
be referenced first.
System Overview Manual
System
Software Reference Manual
Installation and Configuration Manual
Editor Manual
~
0 Ir
II
724
(28
-1/2)
NOTES:
1. DIMENSIONS ARE FOR GENERAL
INFORMATION ONLY. IF DIMEN-
SIONS ARE REQUIRED FOR BUILDING
SPECIAL ENCLOSURES, CONTACT
YOUR HP FIELD ENGINEER.
2. DIMENSIONS ARE IN MILLIMETRES
AND (INCHES).
508
(20)
0
0=0
0
0
o:~:c:::::J
0
0
,/
0
u
DI,
u
Figure 1-2. Mainframe Dimensions
MF 1-4

Model 64100A - General Information
REAR PANEL 1/0 A8)
POWER SUPPLY (Al)
FLOPPY OR TAPE CONTROL BOARD (OPTION) (All)
DISPLAY DRIVER (A7)
FAN
CRT
c::JCJCJCJCJCJCJCJ
, SOFTKEYS ,
KEYBOARD (A4)
00000000000000
DDDDDDDDDDDDDD
DDDDDDDDDDD~
DDDDDDDDDDD
I I
, ASCII KEYBOARD
'"
MICROPROCESSOR BOARD (A3)
DISPLAY CONTROL BOARD (AS)
I/O CONTROL BOARD (AS)
MOTHERBOARD (A2)
FLOPPY DISC DRIVE
OR
TAPE TRANSPORT
(OPTION)
c:::J c:::J c=Jc:::J
'--SYSTEM CONTROL./
KEYS
DD
<ID
IPROM I
PROGRAMMER
DDD
SOCKET
DO
(OPTION)
DDD
'-DISPLAY"'/
KEYS
Figure 1-3. Mainframe Configuration
MF 1-5/(1-6 blank)

Model 64100A - Installation
SECTION II
INSTALLATION
2-1. INTRODUCTION.
2-2. This section contains information for unpacking, initial inspection, and
installation and removal of the model 64100A mainframe components. For more
information refer to paragraph 1-20 (related documents) for more information on
installation and site selection instructions.
2-3. INITIAL INSPECTION.
a. Unpack the mainframe.
b. Keep the
contents
shipping carton and cushioning material until the
have been checked. The carrier will want to inspect
the shipping materials if a claim is made.
c. Check the mainframe mechanically and electrically. The
electrical performance verification is given in Section IV.
For initial inspection, the "CYCLE" softkey selection should be
used.
d. If the contents are not complete, there is mechanical damage or
defect, or it does not pass the performance verification test
then notify the carrier as well as the Hewlett-Packard
Sales/Service Office. They will arrange for repair or
replacement at HP option without waiting for the claim against
the carrier to be settled.
2-4. PACKAGING.
2-5. ORIGINAL PACKAGING.
2-6. Containers and packing materials identical to those used in factory
packaging are available through Hewlett-Packard Sales/Service Offices.
MF 2-1

Model 64100A - Installation
2-7. OTHER PACKAGING
2-8. The following general instructions should be used for repacking with
commercially available materials:
a. Wrap the Model 64100A in heavy paper or plastic.
b. Use a strong shipping container. A double-wall carton made of
350-pound test material is adequate.
c. Use a layer of shock~absorbing material 70 to 100 mm (3 to 4
in) thick around all sides of the 64100A to provide firm
cushioning and prevent movement inside the container.
d. Seal shipping container securely.
e. Mark shipping container FRAGILE to ensure careful handling.
f. In any correspondence, refer to the instrument by model number
and full serial number.
2-9. INSTALLATION AND REMOVAL OF THE MAINFRAME COMPONENTS.
2-10. This section contains the installation and removal instructions for the
Mainframe components excluding the Power Supply, CPU PC board, I/O PC board,
Display Controller PC board, and the Display Driver PC board. The installation
and removal instructions for these components are contained in Section II of
the respective service tabs for these items.
2-11. The removal and installation of Mainframe components is straight-forward
since the mounting/attach scheme for the various components is obvious. As an
aid, however, the number location and purpose of the mounting screws are shown
in figure 6-2, sheets 1 through 7.
MF 2-2

Model 64100A - Operation
SECTION III
OPERATION
3 -1. GENERAL •
3-2. Refer to paragraph 1-20 (related documents) for information on operating
instructions for the Mainframe.
MF 3-1/(3-2 blank)

Model 64100A - Performance Verification
SECTION IV
PERFORMP~CE VERIFICATION
4-1. INTRODUCTION.
4-2. This section describes the use of mainframe Performance Verification (pv),
self test on Power-up, Boot-Up and the use of PV, and troubleshooting PV using
Signature Analysis (SA).
4-3. Performance Verification (PV) is a series of tests, resident in the
mainframe, that confirm the operation of the mainframe hardware and firmware.
PV can be initiated at any time via the Rear-Panel switches or keyboard as
explained in Performance Verification Boot procedure.
NOTE
PV can also be initiated from the Front Panel when a boot is from a
hard disc or floppy disc if the operating system software has been
loaded. To do this press the CNTL and RESET keys together. For more
information, see section IV under System Chapter.
4-4. BOOY-UP MODES.
4-5. The mainframe Boot-Up mode is determined by the position of the control
source switches on the Rear-Panel. The display at completion, with no errors,
is determined by the boot source. The four control source options are
described in this section.
BIT 1 BIT 0 CONTROL SOURCE
1 1
PERFORMANCE VERIFICATION
1 0 LOCAL MASS STORAGE ADDRESSABLE
o 1
LOCAL MASS STORAGE TALK ONLY
o 0 SYSTEM BUS
NOTE
If the rear panel switches are set to "PERFORMANCE VERIFICATION", the
system will boot up with the performance verification display test
pattern appearing on the CRT. However, if the source switches are set
to either of the "LOCAL MASS STORAGE" modes and the self test sequence
was initiated, the display will read "SELF TEST COMPLETE". If the
switches are in the "SYSTEM BUS" mode, the boot is from hard disc.
Then, the system bus configuration will be displayed if a disc is
properly connected on the system bus.
MF 4-1

Model 64100A - Performance Verification
4-6. POWER-UP SEQUENCE.
4-7. The 64100A Mainframe executes a Power On ROM and RAM test every time the
mainframe does a power on boot. The definition of a Power On Boot is when the
power has been removed, or cycled. However, there are four other actions that
will cause a boot sequence. These are: 1) pressing the SHIFT and RESET key
together, 2) when the auto reset circuitry on the Ilo board generates a Low
Power ON Pulse (LPOP), 3) pressing the END TESTS key during PV, and 4) if the
operator presses the processor reset switch located on the I/O board. The
beeper is used to indicate the successful completion of certain tests upon
power-up. The
sequence is as follows:
a. BEEP - hardware initiated -Happens on Power On
Boot only. Does not happen when the
SHIFT and RESET keys are pressed together.
or the END TESTS softkey is pressed.
b. BEEP - software initiated - After initialization
sequence, the display is also enabled.
c. BEEP BEEP BEEP - ROM test completed (approximately a 7 second
delay before the next beep sequence).
d. BEEP BEEP
- successful completion of RAM test.
NOTE
The 64100A now boots up according to boot switch configuration. If the
ROM or RAM test fails upon power up, a signature analysis loop is
automatically entered for troubleshooting purposes. This will be
indicated by a RAM or ROM errror message on the screen.
4-8. Upon power up, the following sequence of events occur under software
Controll.
MF 4-2
a. The operating system software checks for Power-On or cycled
power by reading a reseverved location in RAM.
b. CRT controller chip (U33) is initialized.
c. Blank the screen.
d. ROM test is initiated; a failing ROM address range and
byte will be displayed if the test fails.