HP EliteDesk 800 G3 Installation instructions

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PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk800 G3 Tower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries All types including standard alkaline and lithium coin
or button style batteries 1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Acbel STD 3
External electrical cables and cords 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent

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including liquids, semi-liquids (gel/paste) and toner chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver T-15
Micro shear 170II
Screwdriver PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Loose the screw and remove access panel.(see Figure 1 below)
2. Rotate the driver cage form the hook on slide rail.(see Figure 2-6 below)
3. Disconnect FIO cables from the MB.(see Figure 7-9 below)
4. Disconnect HDD SATA cables from the MB.(see Figure 10 below)
5. Disconnect other PSU cables from the MB.(see Figure 11 below)
6. Remove ODD SATA/power cable.(see Figure 12-13 below)
7. Remove the memory from MB.(see Figure 14 below)
8. Remove ODD from chassis.（see Figure 15-16 below）
9. Remove FIO/PSU/Speaker/SATA power/system fan cables from the MB.(see Figure 17-24 below)
10.Remove system fan from chassis.(see Figure 25 below)
11. Remove the heatsink from MB.(see Figure 26-27 below)
12.Separate the fan from CPU heatsink .(see Figure 28-29 below)
13.Remove the CPU from the MB(see Figure 30-31 below)
14. Remove the battery from the MB.(see Figure 32 below)
15.Remove M/B from chassis.(see Figure 33-34 below)
16. Remove front panel from chassis.(see Figure 35 below)
17. Remove FIO/Speaker from chassis.(see Figure 36-38 below)
18. Rmove HDD from HDD cage.(see Figure 39 below)
19. Remove PSU cover.(see Figure 40-46 below)
20. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 47-52 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1 Press access panel latch remove access panel Figure 2 Remove the cable from the hook
Figure 3 Press the latch on ODD cage Figure 4 Disconnect HDD Power cable from HDD
Figure 5 Disconnect SATA cable from HDD Figure 6 Remove HDD cage

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Figure 7 Disconnect FIO USB2.0 cable from the MB Figure 8 Disconnect FIO Type A cable from the MB
Figure 9 Disconnect FIO Type C cable from the MB Figure 10 Disconnect HDD SATA cable from the MB
Figure 11 Disconnect PSU P2 cable from the MB Figure 12 Disconnect ODD power cable from ODD

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Figure 13 Disconnect SATA cable from ODD Figure 14 Remove the Memory card from the board
Figure 15 Press the ODD’s latch on ODD cage Figure 16 Remove the ODD from ODD cage
Figure 17 Disconnect SATA power cable from the MB Figure 18 Disconnect MB PSU cable from the MB

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Figure 19 Disconnect FIO LEDs/Switch cable from the MB Figure 20 Disconnect Speaker cable from the MB
Figure 21 Disconnect FIO audio cable from the MB Figure 22 Disconnect CPU Power cable from the MB
Figure 23 Disconnect ODD SATA cable from the MB Figure 24 Disconnect system fan cable from the MB

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Figure 25 Use PH1 screwdriver to remove system fan
from chassis Figure 26 Disconnect heatsink fan cable from MB
Figure 27 Use T-15 screwdriver to loose the screws and
remove heatsink Figure 28 Use PH1 screwdriver to loose the screws and remove the fan
Figure 29 Separate the fan from CPU heat sink Figure 30 Rotate the handle and open it up

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Figure 31 Remove the CPU from the board Figure 32 Remove the battery from the system board
Figure 33 Use T-15 screwdriver to loose the screws of MB
from board Figure 34 Remove MB from chassis
Figure 35 Remove front panel from chassis Figure 36 Use T-15 screwdriver loose the screws of FIO

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Figure 37 Remove FIO Figure 38 Use T-15 screwdriver loose the screws of speaker
and remove it
Figure 39 Remove the HDD from HDD cage Figure 40 Use T-15 screwdriver remove the screws on the
PSU chassis
Figure 41 Press the PSU’s latch on chassis Figure 42 Remove the Power supply from chassis

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L-MF877-00 P age 10
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PSG instructions for this template are available at EL-MF877-01
Figure 43 Use Micro shear 170II to cut the cable tie Figure 44 Use PH1 screwdriver to remove screw for bottom
Figure 45 Use PH1 screwdriver to remove screw for top Figure 46 Remove cover
Figure 47 Use PH1 screwdriver to remove FG screw Figure 48 Use Micro shear 170II to cut the cable tie of fan

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L-MF877-00 P age 11
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 49 Disconnect fan connector and inlet connector Figure 50 Use PH1 screwdriver to remove PCB1 screw
Figure51 Use PH1 screwdriver to remove AC inlet & Fan
screw Figure 52 Heat the solder of Electrolytic Capacitors greater than 2.5cm in diameter or height and remove it