HP EliteDesk 880 G1 Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 880 G1 Small Form Factor Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment ,as
defined by EU directive 2002/96/EC,Waste Electrical and Electronic Equipment (WEEE)
1.0 Items Requiring Selective
Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCA
3
Batteries
All types including standard alkaline and lithium
coin or button style batteries Yes
1
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Liteon 320W STD PSU
5
External electrical cables and cords
Yes
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink
Include the cartridges, print heads, tubes, vent
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
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Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
#1Torx Screwdriver
#2 Phillips Screwdriver
#3 Micro shear
T-15
2
170II
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the access panel.(see Figure 1 below)
2. Disconnect the cables from the board.(see Figure 2-7 below)
3. Remove the HDD、slim ODD、ODD from cage.(see Figure 8-10 below)
4. Remove the Memory from the board.(see Figure 11 below)
5. Remove the CPU HeatSink from the board(see Figure 12&13 below)
6. Remove the fan from CPU HeatSink(see Figure 14&15 below)
7. Remove the CPU from the board.(see Figure 16&17 below))
8. Remove the battery from the system board.(see Figure 18 below)
9. Remove stone card from chassis.(see Figure 19&20 below)
10. Remove M/B from chassis.(see Figure 21&22 below)
11. Remove system fan from chassis.(see Figure 23&24 below)
12. Remove PSU from chassis.(see Figure 25-27 below)
13. Remove Speaker from chassis .(see Figure 28&29 below)
14. Remove front bezel.(see Figure 30 below)
15. Remove Front I/O and power LED cable.(see Figure 31-33 below)
16. Remove PSU cover.(see Figure 34&35 below)
17. Remove PSU PCA,and disconnect power cables.(see Figure 36&37 below)
18. Remove the Electrolytic Capacitors.(see Figure 38-40 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Figure1 Remove the Access Panel Figure2 Disconnect PSU cables from the board
Figure3 Disconnect the ODD/HDD PSU cables Figure4 Disconnect the slim ODD cables
Figure5 Disconnect the cables from the HDD Figure6 Disconnect the CPU HeatSink cable

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Figure7 Disconnect the Front IO cable Figure8 Remove the HDD from cage
Figure9 Remove the slim ODD from cage Figure10 Remove the ODD from cage
Figure11 Remove the Memory from the board Figure12 Loose the screws from the CPU HeatSink

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Figure13 Remove the CPU HeatSink from the board Figure14 Loose the screws from the CPU HeatSink
Figure15 Remove the fan from CPU HeatSink Figure16 Rotate the handle and open it up
Figure17 Remove the CPU from the board Figure18 Remove the battery from the system board

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Figure19 Loose the stone card screws Figure20 Remove the stone card from MB
Figure21 Loose the screws from board Figure22 Remove M/B from chassis
Figure23 Loose the screws from system fan Figure24 Remove system fan

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Figure25 Loose the screws from PSU Figure26 Press the baffle and slide the PSU
Figure27 Remove PSU from chassis Figure28 Loose the screws from Speaker
Figure29 Remove Speaker Figure30 Remove front bezel

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Figure37 Remove PSU MB from PSU Chassis
（Liteon 320W STD）
Figure38 Show Ele-Cap on PCBA
Figure39 Remove Ele-Cap from PCBA Figure40 Remove Ele-Cap from PCBA