EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Top cover. (see Figure 1-2)
2. Remove Gfx and CPU cooler (see Figure 3-6 )
3. Remove MB (see Figure 7-9)
4. Remove the DIMM,CPU and Battery (see Figure 10-13)
5. Remove the MB tray (see Figure 14)
6. Remove the Function Board (see Figure 15-16)
7. Remove the HDD (see Figure 17-18)
8. Remove the ODD (see Figure 19-21)
9. Remove the Voodoo grille light board (see Figure 22-23)
10. Remove the Front lighting board (see Figure 24-26)
11. Remove the Rear Bezel (see Figure 27-30)
12. Remove the Antenna cable (see Figure 31)
13. Remove the HDD FAN (see Figure 32)
14. Remove the FRONT_TOP_FILTER (see Figure 33)
15. Remove the PCI FAN (see Figure 34)
16. Remove the ODD SATA cable (see Figure 35-41)
17. Remove the HDD SATA cable (see Figure 42-43)
18. Remove the EXTEND POWER CORD (see Figure 44)
19. Remove the PSU from chassis (see Figure 45-48)
20. Remove the Electrolytic Capacitors from PSU board HP P/N: 854201-003 (DPS-1300AB-5 A) (see Figure 49-60)
21. Remove the Electrolytic Capacitors from PSU board HP P/N: 854200-004 (Niagara 600W) (see Figure 61-73)
22. Remove the CPU LC FAN (see Figure 74-75)
23. Remove the GFX LC FAN (see Figure 76)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
