HP ENVY Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ENVY Notebook PC/HP ENVY 14 Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove battery module
2. Dis-fasten ODD screw*
3. Remove ODD
4. Remove BASE rubber feet*2
5. Dis-fasten BASE Cap screw*2
6. Disassemble BASE Cap*2
7. Dis-fasten BASE screw*15
8. Disassemble KB Deck
9. Pull out FFC*3 (Power, Touchpad, Fingerprint)
10. Pull out FFC*1 (USB)
11. Dis-fasten daughter boards screw*1 (Power)
12. Remove daughter boards*2 (Power, USB)
13. Pull out wire cable connectors*2 (LCD, DC cable)
14. Pull out wire cable*2 (speaker, woofer)
15. Pull out HDD assembly
16. Dis-fasten DC BKT screw*2
17. Remove DC BKT
18. Dis-connect antenna cable connector
19. Remove WLAN module
20. Dis-fasten motherboard screw*5
21. Remove motherboard
22. Dis-fasten Speaker R&L screw*1
23. Remove speaker -L & -R
24. Pull out fan cable
25. Dis-fasten Fan screws*1
26. Remove Fan module
27. Dis-fasten thermal module screw*7
28. Remove thermal module
29. Pull out DC cable connector
30. Dis-fasten Hinge screw*5
31. Remove hinge-up
32. Remove LCD Bezel screw pad*2
33. Dis-fasten LCD Bezel screws*2

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
34. Remove LCD bezel
35. Dis-fasten Hinge BKT screw*6
36. Pull out LCD cable & camera cable
37. Dis-fasten LCD BKT -L & -R screws*4
38. Remove LCD module
39. Remove Camera module
40. Remove antenna cables -L & -R
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove battery module
3.23 LCD module set disassembly

EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.24 Top case disassembly
3.25 Thermal module and mother board disassembly

EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.26 Bottom case disassembly