HP ProDesk 600 G6 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 600 G6 Microtower PC
HP ProDesk 600 G6 PCI Microtower PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking
code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button
style batteries 1
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin
cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[] screws
[X] snaps
[] adhesive
[] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Lite-On 550W EPA92 PSU 1
External electrical cables and cords Power Cord 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity
of items
included
in product
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Hexagon Screw Driver T-15
Crisscross Screw Driver PH1
Electric Iron QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Use T-15 screw driver to loose thumb screw and remove access panel.
2. Disconnect ODD power cable and ODD SATA cable from ODD.
3. Press the ODD latch on ODD cage.
4. Remove the ODD from ODD cage.
5. Remove Front Bezel from chassis.
6. Remove the screw of strengthen beam.
7. Remove the strengthen beam from chassis.
8. Remove the ODD cage.
9. Disconnect HDD power cable and HDD SATA cable from HDD.
10. Use T-15 screw driver to loose the screws of HDD.
11. Remove HDD from Chassis.
12. Remove HDD from HDD cage.
13. Disconnect all SATA data cables from MB.
14. Disconnect system fan cable from MB.
15. Disconnect CPU/ODD Power cables from MB.
16. Disconnect system fan cable from MB.
17. Use PH1 screwdriver to remove system fan from chassis.
18. Disconnect cooler fan cable from MB.
19. Use T-15 screwdriver to loose the screws and remove cooler.
20. Use PH1 screwdriver to loose the screws and remove the fan.
21. Separate the fan from cooler.
22. Remove memory from MB.
23. Rotate the handle and open it up.

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
24. Remove the CPU from the board.
25. Remove the battery from the system board.
26. Remove Graphic card from MB.
27. Remove M.2 WLAN Card.
28. Remove front and rear Antenna cable.
29. Remove speaker from Chassis.
30. Remove the Card Reader from the Chassis.
31. Use T-15 screwdriver remove the PSU screws on the Chassis.
32. Disconnect the PSU cable from the MB.
33. Use T-15 screwdriver to loose the screws of MB from board.
34. Press the PSU latch on chassis.
35. Remove MB from chassis.
36. Remove the PSU from chassis.
37. Use PH1 screwdriver to remove screw for the PSU.
38. Remove PSU cover.
39. Use PH1 screwdriver to remove FG screw.
40. Disconnect fan connector and inlet connector.
41. Loose screws and remove PCA from case.
42. Use PH1 screwdriver to remove AC inlet & Fan screw.
43. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Use T-15 screwdriver to Loose thumb screw and
remove access panel
Step2 Disconnect ODD power cable and ODD SATA cable
from ODD
Step3 Press the ODD latch on ODD cage
Step4 Remove the ODD from ODD cage

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step5 Remove front bezel from chassis
Step6 Remove the screw of strengthen beam
Step7 Remove the strengthen beam from chassis Step 8 Remove the ODD cage

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step 9 Disconnect HDD power cable and HDD SATA
cable from HDD
Step10 Use T-15 screwdriver to loose the screws of HDD cage
Step11 Remove HDD from Chassis
Step12 Remove HDD from HDD cage
Step13 Disconnect all SATA data cables from MB
Step14 Disconnect P3 cable from MB

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step15 Disconnect CPU/ODD Power cables from MB
Step16 Disconnect system fan cable from MB
Step17 Use PH1 screwdriver to remove system fan from
chassis
Step18 Disconnect cooler fan cable from MB

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step19 Use T-15 screwdriver to loose the screws and
remove cooler
Step20 Use PH1 screwdriver to loose the screws and remove
the fan
Step21 Separate the fan from cooler
Step22 Remove memory from MB

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step23 Rotate the handle and open it up
Step24 Remove the CPU from the board
Step25 Remove the battery from the system board
Step26 Remove Graphic card from MB
Step27 Remove M.2 WLAN Card
Step28 Remove front and rear Antenna cable

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step29 Remove speaker from Chassis
Step30 Remove the Card Reader from the Chassis
Step31 Use T-15 screwdriver remove the PSU screws on
the Chassis
Step32 Disconnect the PSU cable from the MB

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step33 Use T-15 screwdriver to loose the screws of MB
from board
Step34 Press the PSU latch on chassis
Step35 Remove the PSU from chassis
Step36 Remove MB from chassis
Step37 Use PH1 screwdriver to remove screw for the
PSU
Step38 Remove PSU cover

EL-MF877-00 Page 11
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step39 Use PH1 screwdriver to remove FG screw
Step40 Disconnect fan connector and inlet connector
Step41 Loose screws and remove PCA from case
Step42 Use PH1 screwdriver to remove AC inlet & Fan screw
Step43 Heat the solder of the Electrolytic Capacitors of
greater than 2.5cm in diameter or height and Remove it