HP TouchSmart Series Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP TouchSmart IQ500/IQ504/IQ505/IQ506/IQ507/IQ510 series PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
10
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
4
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
3
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part Description
Weight
(grams)
ISO
11469:2000
Plastic Part
Mark
Optional:
Photo
JAN_MAIN_REAR_COVER
JAN_MAIN_REAR_COVER
267g
>ABS<
JAN_CHIN
JAN_CHIN
118.25g
>ABS<
JAN_SIDE_CAP_RT
JAN_SIDE_CAP_RT
28.2g
>PMMA<
JAN_SIDE_CAP_RT
JAN_SIDE_CAP_RT
28.2g
PC+ABS
JAN_SIDE_CAP_LF
JAN_SIDE_CAP_LF
29.5g
>PMMA<
JAN_SIDE_CAP_LF
JAN_SIDE_CAP_LF
29.5g
>PC+ABS<
JAN_REAR_PANEL
JAN_REAR_PANEL
372g
>ABS<
JAN_LOWER_REAR_COVER
JAN_LOWER_REAR_COVER
99.9g
>ABS<
JAN_OUTER_BEZEL
JAN_OUTER_BEZEL
112.6g
>ABS<
JAN_INNER_BEZEL
JAN_INNER_BEZEL
93.6g
>ABS<
JAN_AMBIENT_LIGHT_FILLER
JAN_AMBIENT_LIGHT_FILLER
25.5g
>ABS<
JAN_SIDE_CAP_LF_NON_AMB
JAN_SIDE_CAP_LF_NON_AMB
29g
>PMMA<
JAN_SIDE_CAP_LF_NON_AMB
JAN_SIDE_CAP_LF_NON_AMB
29g
>PC+ABS<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 M3 Screwdriver
Description #2 M2 Screwdriver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. See detailed instructions attached below
2.
3.
4.
5.
6.
7.
8.

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).