HP Z1 G2 Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Workstations
Marketing Name / Model
[List multiple models if applicable.]
HP Z1 Workstation G2
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries CR 2032
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LM270WQ1-SDG1
1
Cathode Ray Tubes (CRT)
N/A
0
Capacitors / condensers (Containing PCB/PCT)
N/A
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
N/A
0
External electrical cables and cords
N/A
0
Gas Discharge Lamps
N/A
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
N/A
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. N/A
0
Components and waste containing asbestos
N/A
0
Components, parts and materials containing
refractory ceramic fibers
adaptor
0
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver
T15
Description #2 Screw driver
T8
Description #3 Screw driver
T5
Description #4 Screw driver
T6
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. [system parts] Remove the stand
2. [system] Remove TOP bezel
3. [System] remove memory FAN
4. [System] Remove the HDD
5. [System] Remove Cpu thermal module
6. [System]Remove ODD
7. [System]Remove site IO board
8. [System] Remove rear IO board
9. [System]Remove EMI CAN
10. [System]Remove speaker
11. [System] Remove MXM power connector
12. [System] Remove PSU
13. [System] Remove hinge& panel IO cable
14. [System]Remover antenna
15. [System] Remove MXM module
16. [System] remove PCIE card
17. [System] Remove MB
18. [System] Remove CPU bracket/CPU
19. [System] Remove memory
20. [System] remove spring
21. [System]Remove front bezel
22. [System]Remove web camera module
23. [System]remove latch
24. [System]remove touch plan
25. System]PSU
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

[System Parts]
1) Remove the stand
a) Ready for stand remove
b)take off stand cover
c) Use T15 screw driver to
disassemble the stand screw
d) Take the stand leaving from Chassis
e) stand disassembly finish
2) Remove TOP bezel
a)push left and right side latch
b) Open the top bezel
c) disassembly LVDS cable
d) Pull the antenna aux cable out of
PCIe short card
e) Pull the antenna main cable out of
PCIe short card
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01

h)Pull the connector out of PCA
i) Use T15 screw driver to
disassemble the screw
j) Use T15 screw driver to disassemble
the screw
k) Use T15 screw driver to disassemble
the screw
l) remove Front bezel
m) disassembly finish
3)remove memory FAN
a)Push memory latch.
Then, pull up the memory fan
b) disassembly finish
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01

4) Remove the HDD
a) Ready for HDD disassembly
b)push HDD handle
pull up the HDD carrier
Pull HDD out of carrier latch
Remove connector
Disassembly SATA connector from
MB
c) Use T15 screw driver to
disassemble the screw
Remove sensor from clip
c) Use T8 screw driver to
disassemble the screw
b) disassembly finish
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01

5)Remove Cpu thermal module
a) Use T15 screw driver to
disassemble the screw
b)remove CPU thermal
C)disassembly finish
6)Remove ODD
a)disassembly SATA connector
b)push ODD latch
c)remove ODD
a) Press ODD carrier latch then pull
it out.
b) disassembly finish
7)Remove site IO board
a) Use T15 screw driver to
disassemble the screw
b)remove site io card
c) disassembly finish
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01

8)Remove rear IO board
a) Use T15 screw driver to disassemble
the screw
b)remove rear IO
c)pull out connector from rear IO
board
d) disassembly finish
9)Remove EMI CAN
a) Use T15 screw driver to
disassemble the screw
b)push out connector
c) disassembly finish
10)Remove speaker
a) Use T15 screw driver to
disassemble the screw
b)remove left and right speaker
d) disassembly finish
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01

11)Remove MXM power connector
a) Use T15 screw driver to
disassemble the screw
Remove MXM power connector
12)Remove PSU
a)push handle latch
b) Turn the latch of PSU to
downward
C)disassembly connector
d)remove PUS
e) disassembly finish
13)Remove hinge& panel IO cable
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01

a) Use T15 screw driver to disassemble the screw
b)disassembly panel IO cable
14)Remover antenna
a) Use T15 screw driver to
disassemble the screw
b) remove aux antenna
c)remove main antenna
15)Remove MXM module
a)press MXM latch
b)remove MXM module
c) Use T15 screw driver to
disassemble the screw
d)remove MXM heatsink
e)remove MXM card
16)remove PCIE card
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01

a) Pull the antenna aux cable out of
PCIe short card
b) c) Use T6 screw driver to
disassemble the screw
c)remove WLAN card module
d) Use T6 screw driver to
disassemble the screw
e) disassembly finish
17)Remove MB
a)ready for MB disassembly
b)remove connector from MB
C)remove LVDS cable from MB
d)remove backlight cable from MB
e)remove panel IO cable from MB
e)remove panel IO cable from
MB
f)remove speaker IO cable from MB
g) Use T15 screw driver to disassemble
the screw
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01