HP Cray Cls 4U 106-18TB Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Storage
Marketing Name / Model
[List multiple models if applicable.]
HPE Cray Cls 4U 106-18TB SAS Drive Encl
HPE Cray Cls 4U 106-10TB SAS Drive Encl
HPE Cray Cls 4U 106-12TB SAS Drive Encl
HPE Cray Cls 4U 106-14TB SAS Drive Encl
HPE Cray Cls 4U 106-16TB SAS Drive Encl
HPE Cray CS E1000 20TB 4U106 FIO HDD Encl
HPE Cray Cls 4U 106-24TB SAS Drive Encl
HPE Cray CS E1000 10TB 4U106 SED HDD Encl
HPE Cray CS E1000 16TB 4U106 SED HDD Encl
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HPE products to remove components and materials requiring selective treatment,
as defined by Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic
Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm.
1 in each of 2 I/O modules (IOMs)
1 in each of 2 power cooling modules
1 in 24-HDD baseplane in each of 4 PCBAs
1 in 10-HDD baseplane
1 in each of 4 expander riser cards
1 in each of 8 expanders
1 in each of 2 passthrough cards
1 in EBOD PCBA
1 in midplane PCBA
25 max
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with
gas discharge lamps
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in
product
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Count varies depending on PSU model
2 or 9
External electrical cables and cords
1 power cord for each of 2 power supplies.
4 SAS expansion cables for each of 2 IOMs.
2 RJ45 cable for each of 2 IOMs.
14 max
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips driver
#0, #1, #2
Torx driver
T10, T15
Pliers
Small
Drill
Standard
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove the top drive bay cover.
2. Remove the bezel and hubcaps from the front of the enclosure.
3. Remove all disk drives.
4. For each disk drive, remove the disk from the plastic carrier.
5. Remove both power cooling modules (PCMs).
6. Remove both IOMs.
7. Remove each rear fan module.
8. Remove both controller fans.
9. Disassemble each PCM. See the PCM disassembly procedure.

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
10. Disassemble each IOM. See the IOM disassembly procedure.
11. Disassemble each rear fan. See the rear fan disassembly procedure.
12. Disassemble each controller fan. See the controller fan disassembly procedure.
13. Disassemble the chassis. See the chassis disassembly procedure.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.2.1 PCM disassembly procedure
ss
Artesyn PSU –RMN: 700-014575-XXXX
(where XXXX- can be any alphanumeric combination which does not affect safety)
1. Remove the eight casing screws using a Philips #1 bit screwdriver and slide the casing in the direction shown
by the red arrow.

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
2. Remove the three screws and the LED connector from the marked locations, and then remove the PCA from
the enclosure.

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Bel Power PSU –RMN: SPASGAT-02
1. Remove the three casing screws shown by the red circles in the images below. Free the crimps marked by
the yellow boxes using a protruding tool and then pull up the top cover.

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
2. Remove the LED connector from the connector marked in the image.

MF877-00 Page 9
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3. Remove the four screws from the bottom of the enclosure as marked in the image by the red circles to remove
the PCA from the PSU.

MF877-00 Page 10
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3.2.2 IOM disassembly procedure
1. Remove the EMI Gasket from the metal base.
2. Remove the casing screws using a Philips #1 bit and pull the top cover in the direction shown by the red
arrows.