HP Compaq Presario V2000 Series Assembly instructions

HP-00007-01, Appendix 3 13-Oct-2004
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Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq Presario V2000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 1
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants Declaration limited to case plastics only. 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials
containing refractory ceramic fibers 0

HP-00007-01, Appendix 3 13-Oct-2004
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Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-cross #1
Screwdriver Type-cross #0
Screwdriver Type-T #8
3.0 Product Disassembly Process
List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 8 or 12 cell main battery.
2 Remove two M2.5*6L screws on HDD door and HDD, then remove two M2.5*6L and HDD
module.
3 Remove one M2.5*6L screws on lower case, then remove ODD module.
4 Remove four M2.5*14L screws on logic lower and then remove keyboard cover.
5 Remove two M2.5*6L and four M2.5*6L screws, then remove LCD module
6 Remove four M2.5*3L then remove keyboard.
7 Reverse it back and remove eleven M2.5*14L screws and five M2.5*6L screws on logic
lower then disassemble logic lower.
8 Remove four spring screws on thermal module, then remove thermal module on M/B.
9 Remove seven M2.5*6L screws, then remove thermal frame.
10 Remove four M2.5*6L screws, remove M/B.
11 Remove RTC coin cell battery on M/B for selective treatment
12 Remove two M2.5*4L on audio board, then remove audio board.
13 Remove six M2.5*4L screws on trackpad board, then remove trackpad module.
14 Remove four M2.5*6L screws on LCD module, then disassemble LCD bezel from LCD
module, then remove LCD module.
15 Remove mercury bulb from LCD assy for selective treatment
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:

HP-00007-01, Appendix 3 13-Oct-2004
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