HP ENVY x2 Detachble PC 12 Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP ENVY x2 Detachble PC 12
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB / USB DB / IR+ALS DB / TS DB
4
Batteries
All types including standard alkaline and lithium
coin or button style batteries Main battery
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps 12.3"
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver
#1 / #0
Description #2 Heat gun
Description #3 Suction cup
Description #4 Opening stick
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble LCD
2. Remove LCD cable and TS cable
3. Remove the SD Card Tray
4. Remove the Nano SIM Card Tray
5. Remove TS M/B
6. Remove Slate frame left
7. Remove 1 pcs of screws and disassemble Slate frame FPC
8. Remove 1 pcs of screws and disassemble Slate frame right
9. Remove 2 pcs of screws and disassemble USB-C MB CONN BKT
10. Remove TS FPC
11. Remove 3 pcs of screws and disassemble Battery CONN BKT
12. Remove 4 pcs of screws and disassemble Battery
13. Remove 2 pcs of screws and disassemble Slate Frame down.
14. Remove 1 pcs of screws and disassemble USB C SUP BKT
15. Remove 1 pcs of LED LENS RUBBER
16. Remove USB FPC
17. Remove USB M/B
18. Remove LCD FPC.
19. Remove 2 pcs of screws and Gasket Mylar, disassemble Pogo Pin FPC.
20. Remove 1 pcs of screws and disassemble Audio FPC
21. Remove 1 pcs of screws and disassemble Volume FPC
22. Loose Antenna deduction point on M/B
23. Remove the Rear Camera , Front camera, WEB CAM LED FPC , IR Camera.
24. Remove the IR FPC
25. Remove the IR M/B
26. Remove 2 pcs of screws and disassemble SPK L side.
27. Remove 2 pcs of screws and disassemble PW FPC
28. Disassemble SPK R side.
29. Remove 4 pcs of screws and disassemble M/B
30. Remove Camera Frame
31. Disassemble Front MIC FPC
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.21 Total part disassembly
3.22 Disassemble LCD and remove LCD cable and TS cable
3.23 Remove the SD Card Tray
3.24 Remove the Nano SIM Card Tray
3.25 Remove TS M/B
3.26 Remove Slate frame left

EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.27 Remove 1 pcs of screws and disassemble Slate frame FPC
3.28 Remove 1 pcs of screws and disassemble Slate frame right
3.29 Remove 2 pcs of screws and disassemble USB-C MB CONN BKT
3.30 Remove TS FPC
3.31 Remove 3 pcs of screws and disassemble Battery CONN BKT
3.32 Remove 4 pcs of screws and disassemble Battery
3.33 Remove 2 pcs of screws and disassemble Slate Frame down

EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.34 Remove 1 pcs of screws and disassemble USB C SUP BKT
3.35 Remove 1 pcs of LED LENS RUBBER
3.36 Remove USB FPC
3.37 Remove USB M/B

EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.38 Remove LCD FPC
3.39 Remove 2 pcs of screws and Gasket Mylar, disassemble Pogo Pin FPC.
3.40 Remove 1 pcs of screws and disassemble Audio FPC
3.41 Remove 1 pcs of screws and disassemble Volume FPC

EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.42 Remove the Rear camera, Front camera, WEB CAM LED FPC, IR Camera
3.43 Remove the IR FPC
3.44 Remove the IR M/B
3.45 Remove 2 pcs of screws and disassemble SPK L side

EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.46 Remove 2 pcs of screws and disassemble PW FPC
3.47 Disassemble SPK R side
3.48 Remove 4 pcs of screws and disassemble M/B
3.49 Remove Camera Frame

EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
3.50 Disassemble Front MIC FPC