3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Relax screw to disassembly RAM door
2. Relax screw to disassembly HDD door
3. Remove screw*2 to disassembly HDD assy
4. Remove screw*2 to disassembly KB
5. Remove screw*15 and FFC，Speaker connector to disassembly TOP-ASSY and base assy。
6. Remove screw*2 to disassembly SD DB
7. Removed screw*1 to disassembly battery
8. Remove USB daughter board on base assy
9. Remove screw*2 to disassembly Fan
10. Remove screw*1 to disassembly Type-C BKT
11. Remove screw*1 to disassembly Wwan module
12. Remove screw*1 to disassembly main board
13. Removed Daughter board & FFC on Top-assy：Power, TP module, Finger printer
14. Remove screw*2 to disassembly speaker assy
15. Disassembly LCD Bezel-assy with LCD Cover-assy
16. Remove screw*4 to disassembly Panel
17. Removed screw*8 to disassembly cover assy
18. Removed screw*4 to disassembly hinge
19. Removed Cable：LVDS、Antenna
20.
21.
22.
23.
24.
25.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove screw*13 to disassembly HDD, KB and base’s screw.
