HP Classmate Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Classmate Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCBA, IO Board, RAM, HDD, TOUCHPAD
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries Li-ion polymer
Battery,lithium coin batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LCD
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Adapter Cable, Power Core
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
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Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Base Rubber and Dis-fastent Screws *8
2. Remove Keyboard and Pull out The KB's FFC Cable.
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3. Dis-fastn TOP Screw*6
4. Dis-fasten the Base Screws*8 and Open Base Case with Top Cover
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5. Remove The Battery's Black Tape and Dis-fasten Battery's Screws *2
6. Remove the Battery
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7. Dis-fasten the HDD’s Screws *4, Pull Out HDD’s FPC Cable and Remove HDD.
8. Dis-fasten The HDD Bracket Screw*4
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9. Remove the HDD Bracket
10. Remove the HDD Rubber and FPC Cable
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11. Remove the DDR’s Acetate Tape and the HDD
12. Remove the Wlan Card’s Acetate Tape and Dis-fasten the Wlan Card’s Screw *1
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13. Pull Out the WLan Cable and Remove the WLan Card
14. Separate WLan Cable
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15. Dis-Fasten the Thermal Model’s Screws*3
16. Remove the Thermal Model.
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17. Dis-fasten the LVDS Cable’s Screws*1 and Pull out the LVDS Cable.
18. Pull out the MIC cable
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19. Remove the DC-in Sponge.
20. Pull out the DC-in cable, Dis-fasten the DC-in Screws*1 and Remove the Dc-in Cable
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21. Pull out the Speaker Cable
22. Dis-fasten the Speaker’s Screwa*4
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23. Remove the Speaker Cable
24. Pull out the IO Board FFC*2 and Touch Pad FFC*1.
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25. Dis-fasten the MotherBoard Screws*2 and the IO Board Screws*1
26. Remove the MotherBoard and the IO Board.
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27. Remove the IO Board FFC Cable* 2
28. Remove the DDR Mylar on the MotherBoard.
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29. Remove the Touch Pad FFC on the MotherBoard
30. Remove the Acetate Tape and the MB’s Al Foil
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31. Remove the CMOS Battery
32. Dis-fasten the LCD Hinge-R screws*1
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33. Remove Hinge Cover
34. Dis-fasten LCD Hinge screw*2
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35. Separate LCD Module with Base units
36. Dis-fasten the Palmrest screw *6
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37. Remove the Palmrest
38. Remove LCD Rubber and Dis-fasten the Screw*8
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