HP Spectre x360 15 Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Spectre x360 15 Convertible PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[x] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps 15.6”
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
#00, #0, #1,T5,
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove Base screw*2, Base rubber foot *2, screw*6, and Base sub-assy.*1
2. Pull out cable Antenna(WWAN)
3. Remove battery screw*6 and remove battery.
4. Remove front speaker screw *4 and remove front speaker*2.
5. RemoveThermal screw *6 and remove Thermal *1
6. Remove Fan screw *4 and remove Fan *2
7. Pull out FFC*8 (Touchpad, Keyboard membrane, Keyboard backlight, Power FFC, FPR FFC, IR FFC, SD FFC, Audio FFC)
8. Pull out cable*3 (LVDS, Camera, Antenna(WLAN))
9. Pull out SHIELDING CAN *1, and remove SSD screw *1 to remove SSD Card *1
10. Remove screw *3(SD DB screw*1, FPR BKT screw *2) and remove SD DB*1, FPR BKT*1, FPR DB*1
11. Remove screw *6(Audio DB*1, MB screw*4, Power DB*1) and remove Audio DB*1, MB*1, Power DB*1
12. Remove screw *4(IR DB*1, Touch-pad*3) and remove Touch-pad, IR DB
13. Remove DC Cable screw *1 and remove DC Cable*1
14. Remove rear speaker screw *4 and remove rear speaker*2
15. Remove Hinge screw*4 and LCD module assy
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.21 Total
3.22 Remove Rear side rubber, base screw and base assy.
3.23 Remove SSD SHIELDING CAN, SSD Card, Thermal, and battery, all screw.

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
3.24 Remove Touchpad, speaker, FPR BKT, FPR Board, MB board, Power Board, Audio Board, IR Board, SD Board,
Audio Board FFC, FPR FFC, IR Board FFC, Touchpad FFC, Power Board FFC, SD Board FFC, Bracket and all screw.
3.25 The LCD module is not disassembly