HP Compaq LE2001wm Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP Compaq LE2001wm LCD Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
2
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
Hand
Description #2
Slotted
Screwdriver
Description #3
Philips
Screwdriver
Description #4
Hex Socket
Screwdriver
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
2.
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

The Disassembly Procedure
LE2001wl Disassembly Diagram

1. Remove screws(4 pcs).
SCREW

2. Remove Base assembly.
Base assemblyBase assembly

3. Remove screws(4 pcs).
SCREWSCREWSCREWSCREWSCREWSCREWSCREW

4. Remove Bucket.
BucketBucket

5. Remove Panel and Chassis.
Panel
Chassis
Panel
Chassis
Panel

6. Remove Buttons and Lens.
LensLens
Buttons

7. Separate Panel and Chassis.
Chassis
Panel

8. Remove Screws(2 pcs).
Screw

SCREW
9. Remove Screws(6 pcs).
SCREWSCREW

10. Remove Main Board and Power Board.
Main BoardMain Board
Power Board
Main Board

i.PUSH
ii.Remove
11. Remove Neck Assembly.

12. Remove Screws(4 pcs) and Rubber(7 pcs).
SCREWSCREW
SCREW
RUBBERRUBBERRUBBERRUBBERRUBBERRUBBERRUBBERRUBBERRUBBER
RUBBER
SCREWSCREWSCREW

13. Remove Bracket.
BracketBracket

14. Remove Screws(3 pcs).
SCREWSCREW

15. Remove VESA Bracket and Hinge Cover.
Hinge Cover
VESA Bracket
Hinge Cover

16. Remove ARM BACK.
ARM BACK

17. Remove Screws(4 pcs).
SCREWSCREW