HP MSR954 Series Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP MSR954,RTUZ2954WLW,Router Host(JH299A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

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Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Remove the cover 2.
3. Remove all of the inner cables.
4. Unscrew the screws on PCB 3, and then remove PCB 3.
5. Unscrew the screws on PCB 7, and then remove PCB 7.
6. Remove film 5 from panel 2.
7. Remove all of the labels.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure1 Remove mounting angle

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Figure2 Treatment to the product
3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight
percentage
Selective treatment for materials
and components
Details
1.
Mountangle
Fe
175
14.7%
Fe recycling
2
Top case
Fe
350
29.5%
Fe recycling
3.
Main board
Complex
PCB
220
18.5%
The surface of PCB is greater
than 10 square centimeters
4
Bottom case
Fe
290
38.8%
Fe recycling
5
Film
PC
5
0.4%
Containing brominated flame
retardants
6
Bracket
Fe
8
0.5%
7
Power PCB
Complex
PCB
125
10.5%
The surface of PCB is greater
than 10 square centimeters
8
AC Power jack
PA
16
1.2%
Containing brominated flame
retardants
4. Revised record
Date
Version
Author
Modify content
2015.6.10
V0
He Changlu
Initial version