HP FF 12910 Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP FF 12910 Main Processing Unit (JG621A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or
PCAs already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0

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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2＃
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws on heat sink 3, and then remove heat sink 3 from panel 5.
2. Unscrew the screws on pcb 1, and then remove pcb 1.
3. Unscrew the screws on guiding set 2, and then remove guiding set 2 from pcb 1.
4. Remove shielding finger 4 from panel 5.
5. Remove film 6 from panel 5.
6. Remove battery from pcb 1.
(a) Remove conformal coating (if any) and clean work area of any contamination, oxides, adhesives, residues or
fluxes.
(b) Install thermal drive desoldering tip handpiece.
(c) Start with tip temperature of approximately 315°C and change as necessary.
(d) Thermal shock tip with damp sponge.
(e) Tin tip with solder. (See Figure 2.)
(f) Lower tip contacting solder connection.
(g) Confirm complete solder melt of contacted lead. (See Figure 3.)
(h) For a flat lead, move lead back and forth; for a round lead, use a circular motion and apply vacuum while
continuing lead movement. (See Figures 4&5)
(i) Lift tip from lead, hold vacuum for an additional 3 seconds to clear all molten solder from heater chamber. (See
Figure 6.)
(j) Repeat for all solder connections.
(k) Re-tin tip end with solder and return handpiece to its stand.
(l) Lift the component body free of the printed board.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 disassembly process

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Figure 2 Position Tip
Figure3 Melt Solder
Figure 4 Move Lead & Apply Vacuum

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Figure 5 Move Lead & Apply Vacuum
Figure 6 Lift Handpiece
3.3 Material of the facility built Table 1
Facility
Components
Material
Weight(g)
Weight
percentage
Selective treatment for
materials and components
Details
1
Complex PWB
828.4
32.743%
The surface lf PCB is
greater than 10 square
centimeters
2
Zn
48.0
1.897%
Zn recycling
3
Al
273.4
10.806%
Al recycling
4
Be-Cu
1.7
0.067%
Cu recycling
5
Fe
1373.4
54.285%
Fe recycling
6
PC
5.1
0.202%
Containing brominated
flame retardants
Pla recycling
4. Revised record
Date
Version
Author
Modify content
2013.03.21
V0
Huang Zhengwei
Initial version