HP t310 G2 Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Thin Client
Marketing Name / Model
[List multiple models if applicable.]
HP t310 G2 Zero Client
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances

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Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Phillips screwdriver
Description #2: Diagonal cutting plier
Description #3 Nipper
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove chassis labels on label mylar tab
2. Remove chassis rubber and screws
3. Remove upper plastic and metal chassis
4. Remove EMI contact fingers and heatsink EMI gasket from the upper metal chassis
5. Remove light shielding rubber from the upper plastic chassis
6. Separate upper metal chassis from upper plastic chassis
7. Separate PCBA board from the chassis using the screwdriver
8. Separate lower metal chassis from lower plastic chassis
9. Remove label mylar tab
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).