HP 5830AF-48G Series Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Calculators
Marketing Name / Model
[List multiple models if applicable.]
HP 5830AF-48G Series Switch Chassis
（
JG316A
）
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
4
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Unscrew the screws on filler panel 3, and then remove filler panel 3.
4. Unscrew the screws on fan-assembly 4, and then remove fan-assembly 4.
5. Remove the filler panel 5.
6. Remove the power 6.
7. Unscrew the screws on top cover 10, and remove top cover 10.
8. Unscrew the screws on front panel 7, and then remove front panel 7.
9. Unscrew the screws on bracket 9, and then remove bracket 9.
10. Unscrew the screws on bracket 11, and then remove bracket 11.
11. Unscrew the screws on heat sink 12, and then remove heat sink 12.
12. Unscrew the screws on PCB 13, and remove PCB 13.
13. Remove all of the labels.
14. Remove film 4-8.
15. Unscrew the screws on 4-7, and then remove 4-7.
16. Unscrew the screws on 4-6, and then remove 4-6.
17. Unscrew the screws on 4-5, and then remove 4-5.
18. Unscrew the screws on 4-4, and then remove 4-4.
19. Unscrew the screws on pcb 4-9, and then remove 4-9.
20. Unscrew the screws on pulled handle 4-1, and then remove pulled handle 4-1.
21. Remove lamp 4-2.
22. Remove bushing 4-3.
23. Unscrew the screws on 5-1, and then remove 5-1.
24. Remove shielding finger 5-3.
25. Remove film 7-1.
26. Remove film 7-2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Figure 1Remove mounting angle Figure 2 Rear of HP S5810-52C-EI
Figure 3Treatments to the product Figure 4 Treatments to fan-assembly 4
Figure 5 Treatments to filler panel 5 Figure 6 Treatments to front panel 7
3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight
percentage
Selective treatment for
materials and components
Details
Chassis
1
Fe
76
1.2%
Fe
recycling
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01

2
Fe
180
3%
Fe
recycling
3
Fe
35
0.5%
Fe
recycling
4
4-1
Fe
24
0.4%
Fe
recycling
4-4
Fe
12
0.2%
Fe
recycling
4-5
PBT, Cu
580
9.4%
Pla
recycling
4-6
Fe
36
0.6%
Fe
recycling
4-7
Fe
48
0.7%
Fe
recycling
4-9
Complex
PWB
30
0.3%
The surface of PCB is
greater than 10
square centimeters
；
4-10
Fe
210
3.4%
5
5-4
Fe
100
1.6%
6
Fe,
Complex
PWB
1000
16.1%
7
7-3
Fe
361
5.8%
Fe
recycling
8
Complex
PWB
1620
26.2%
The surface of PCB is
greater than 10
square centimeters;
electrolyte capacitor
height is more than 25
mm
9
Fe
18
0.22%
Fe
recycling
10
Fe
1766
28.5%
Fe
recycling
11
Fe
30
0.3%
Fe
recycling
12
Al
10
0.1%
Al
recycling
13
Complex
PWB
40
0.6%
The surface of PCB is
greater than 10
square centimeters;
electrolyte capacitor
height is more than 25
mm
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01