HP Aruba 4100i Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Networking
Marketing Name / Model
[List multiple models if applicable.]
HPE Aruba 4100i 12G CL4/6 POE 2SFP+ DIN Sw (JL817A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
1216
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
3
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screwdriver #2
M3
Torx style screwdriver
T10
Flathead screwdriver
1.0
Hexagon screwdriver
M3
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the Plastic Protectors cover, and terminal conn.
1. Using a Phillips screwdriver #2, remove the screws attaching the terminal.
2. Remove the top ground lug.
1. Using a Phillips screwdriver #2, remove the screws attaching the ground lug 2pcs
3. Remove the din kit
1. Using a Phillips screwdriver #2, remove the screws attaching the din kit 4pcs
4. Remove the back logo cover bottom
1. Using a torx style screwdriver T10, remove the screws attaching the logo cover bottom 6pcs
5. Remove the riser bracket
1. Using a Phillips screwdriver #2 remove the screws attaching the riser bracket
6. Remove the logo cover assembly
1. Using a flathead screwdriver r, remove the logo cover
7. 7. Remove the side logo cover bottom
1. Using a torx style screwdriver T10, remove the screws attaching the logo cover bottom 6pcs

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
8. Remove the front bezal
1. Using a Phillips screwdriver #2, remove the screws attaching the logo cover bottom 8pcs
9. Remove the base
1. Using a Phillips screwdriver #2, remove the screws attaching the base 6pcs
10. Remove the PHY board
1. Using a Phillips screwdriver #2, remove the screws attaching the PHY board 4pcs
11. Remove the riser bracket
1. Using a Hexagon screwdriver and Phillips screwdriver #2 remove the screws attaching the riser bracket
12. Remove the Asic board
1. Using a Phillips screwdriver #2, remove the screws attaching the Asic board 4pcs
13. 12-Finish
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01