3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws (qty 18) with a T-10 driver, from the top of the chassis (Figure 1)
2. Unscrew the screws (qty 3) with a T-10 driver, from the right side of the chassis (Figure 1)
3. Unscrew the screws (qty 3) with a T-10 driver, from the left side of the chassis (Figure 1)
4. Remove the lid from the chassis base
5. Remove the plastic tab fr chassis (Figure 2)
6. Remove the coin battery from its holder on the right side of the main PCA (Figure 3)
7. Cut cable tie with wire snips, remove the screw (qty 1) with a T-10 driver, from the PCA at the rear right corner of the
switch (Figure 4)
8. Disconnect the cable and remove the PCA (Figure 4)
9. Unscrew the screw (qty 1) with a T-10 driver, and the bracket that were under the rear PCA (Figure 5)
10. Unscrew the screw (qty 2) with a T-10 driver, and remove front PCA (Figure 6)
11. Use force to pull out the flex cable fr the 2 connector (Figure 7)
12. Unscrew the screw (qty 1) with a T-10 driver, from the front left chassis, and remove the shield cover and shield (Figure
8)
13. Unscrew the screws (qty 6) with a T-10 driver, that secure the daughter PCA to the base (Figure 9)
14. Remove the sheet metal parts that is securing the daughter PCA, remove the daughter PCA and then remove the 2
plastic airflow baffle (Figure 10)
15. Remove the DIMM PCA from the daughter PCA (Figure 11)
16. Remove the small heatsink by unclipping the two wire bails from the daughter PCA, then twist and untwist a couple of
times to remove the heatsink from the thermal interface material (Figure 12)
17. Unscrew the screws (qty 2) at the side, with a T-10 driver, and remove the left and right air baffle (Figure 13)
