HP JH321A Assembly instructions

EL-MF877-00 Page 1
Template Revision B
Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HPE FF 5950 32Q28 Swch(JH321A)
HPE FF 5950 32Q28 TAA Swch(JH322A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sqcm
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame
Retardantsweighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.

EL-MF877-00 Page 2
Template Revision B
Tool Description
Tool Size (if
applicable)
Screw driver
2#
Socket wrench
2.5#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Remove the fan-assembly 3.
4. Remove the power 4.
5. Remove the filler panel 5.
6. Unscrew the screws on top cover 6, and remove top cover 6.
7. Unscrew the screws on front panel 7, and then remove front panel 7.
8. Unscrew the screws on heat sink device 9
9. Unscrew the screws on plastic airguide 10,and then remove the plastic airguide 10
10. Unscrew the screws on PCB-assembly 11, and then remove PCB-assembly 11.
11. Remove all of the labels.
12. Unscrew the screws and hexagon posts on PCB 12, and then remove PCB 12.
13. Unscrew the screws on 13, and remove 13.
14. Unscrew the screws on PCB-assembly 14, and remove PCB-assembly 14.
15. Unscrew the screws on fan 3-1, and then remove fan 3-1.
16. Remove the fan snap rivets 3-2.
17. Remove the 3-3.
18. Remove the 3-4.
19. Unscrew the hexagon posts on PCB 11-1, and remove PCB 11-1.
20. Unscrew the screws on PCB 14-1, and remove PCB 14-1.
21. Remove all the shielding finger.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3
Template Revision B
Figure 1Remove mounting angleFigure 2 Rear of the product
Figure 3Treatments to the productFigure 4Treatments to the product
Figure 5 Treatments to fan-assembly 3Figure 6Treatments to PCB-assembly 11

EL-MF877-00 Page 4
Template Revision B
3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight
percentage
Selective treatment for
materials and components
Details
1
Fe
362
3.57%
Fe
recycling
2
Fe
76
0.76%
Fe
recycling
3
3-1
Fe
26
0.25%
Fe
recycling
3-2
PC
10
0.10%
Containing brominated flame
retardants
3-3
Fe
25
0.25%
Fe
recycling
3-4
PC
100
0.99%
Containing brominated flame
retardants
3-5
Fe
25
0.25%
Fe
recycling
4
Fe
1050
10.43%
Fe
recycling
5
Fe
20
0.20%
Fe
recycling
6
Fe
1950
19.38%
Fe
recycling
7
Fe
330
3.28%
Fe
recycling
8
Fe
2650
26.33%
Fe
recycling
9
Fe
400
3.97%
Fe
recycling
10
PC
21
0.21%
Containing brominated flame
retardants
11
Figure 7Treatments to PCB-assembly 14

EL-MF877-00 Page 5
Template Revision B
11-1
Complex
PWB
10
0.10%
The surface of PCB is greater
than 10 square centimeters;
11-2
Complex
PWB
200
1.99%
The surface of PCB is greater
than 10 square centimeters;
12
Complex
PWB
2700
26.83%
The surface of PCB is greater
than 10 square centimeters;
13
Fe
29
0.29%
Fe
recycling
14
14-1
Complex
PWB
20
0.20%
The surface of PCB is greater
than 10 square centimeters;
14-2
Complex
PWB
60
0.60%
The surface of PCB is greater
than 10 square centimeters;
4. Revised record
Date
Version
Author
Modify content
2016.03.17
V0
Zhou Hongjia
Initial version