i-MO i3C Lite User manual

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PREFACE
This manual explains how to use the i³C Lite.
No part of this publication may be reproduced, transmitted, transcribed, stored in a retrieval system,
or translated into any language or computer language, in any form by any means, electronic,
mechanical, magnetic, optical, chemical, manual or otherwise, without the prior agreement and
written permission of IMO. All software described in this document or media is also copyrighted
material subject to the terms and conditions of the IMO Software License Agreement.
Information in this document is subject to change without notice and does not represent a
commitment on the part of IMO.
Ethernet™ is a trademark of Xerox Corporation.
microSD™ and CompactFlash are registered trademarks of SanDisk Corporation.
For user manual updates, contact Technical Support:
IMO Precision Controls Ltd:
Tel: [phone]
Website: http://www.imopc.com
Email: [e-mail]

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LIMITED WARRANTY AND LIMITATION OF LIABILITY
IMO Precision Controls Ltd ("IMO") warrants to the original purchaser that the i³C Lite module
manufactured by IMO is free from defects in material and workmanship under normal use and service.
The obligation of IMO under this warranty shall be limited to the repair or exchange of any part or
parts which may prove defective under normal use and service within three (3) years from the date of
manufacture, such defect to be disclosed to the satisfaction of IMO after examination by IMO of the
allegedly defective part or parts. THIS WARRANTY IS EXPRESSLY IN LIEU OF ALL OTHER WARRANTIES
EXPRESSED OR IMPLIED INCLUDING THE WARRANTIES OF MERCHANTABILITY AND FITNESS FOR USE
AND OF ALL OTHER OBLIGATIONS OR LIABILITIES AND IMO NEITHER ASSUMES, NOR AUTHORIZES ANY
OTHER PERSON TO ASSUME FOR IMO, ANY OTHER LIABILITY IN CONNECTION WITH THE SALE OF THIS
i³A Lite module. THIS WARRANTY SHALL NOT APPLY TO THIS i³C Lite module OR ANY PART THEREOF
WHICH HAS BEEN SUBJECT TO ACCIDENT, NEGLIGENCE, ALTERATION, ABUSE, OR MISUSE. IMO MAKES
NO WARRANTY WHATSOEVER IN RESPECT TO ACCESSORIES OR PARTS NOT SUPPLIED BY IMO. THE
TERM "ORIGINAL PURCHASER", AS USED IN THIS WARRANTY, SHALL BE DEEMED TO MEAN THAT
PERSON FOR WHOM THE i³C Lite module IS ORIGINALLY INSTALLED. THIS WARRANTY SHALL APPLY
ONLY WITHIN THE BOUNDARIES OF THE CONTINENTAL UNITED STATES. In no event, whether as a
result of breach of contract, warranty, tort (including negligence) or otherwise, shall IMO or its
suppliers be liable of any special, consequential, incidental or penal damages including, but not limited
to, loss of profit or revenues, loss of use of the products or any associated equipment, damage to
associated equipment, cost of capital, cost of substitute products, facilities, services or replacement
power, down time costs, or claims of original purchaser's customers for such damages.
To obtain warranty service, return the product to your distributor with a description of the problem,
proof of purchase, postpaid, insured, and in a suitable package.
ABOUT PROGRAMMING EXAMPLE
Any example programs and program segments in this manual or provided on accompanying
diskettes are included solely for illustrative purposes. Due to the many variables and requirements
associated with any installation, IMO cannot assume responsibility or liability for actual use based on
the examples and diagrams. It is the sole responsibility of the system designer utilizing the i³C Lite
module to appropriately design the end system, to appropriately integrate the i³C Lite module and
to make safety provisions for the end equipment as is usual and customary in industrial applications
as defined in any codes or standards which apply.
NOTE: The programming examples shown in this manual are for illustrative purposes only. Proper
machine operation is the sole responsibility of the system integrator.

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TABLE OF CONTENTS
Table of Contents
TABLE OF CONTENTS...........................................................................................................................4
CHAPTER 1: SAFETY / COMPLIANCE....................................................................................................9
1.1 Safety Warnings and Guidelines ......................................................................................... 9
1.2 Grounding .........................................................................................................................10
1.3 Compliance........................................................................................................................10
CHAPTER 2: INTRODUCTION............................................................................................................11
2.1 Visual Overview of i³C Lite ................................................................................................ 11
2.2 Where to Find Information about the i³C Lite ..................................................................12
2.3 Four Main Types of Information are covered in this Manual........................................... 12
2.6 Connectivity to the i³C Lite................................................................................................ 13
2.7 Features of the i³C Lite......................................................................................................14
2.8 Accessories........................................................................................................................ 15
CHAPTER 3: MECHANICAL INSTALLATION .......................................................................................16
3.1 Mounting Overview .......................................................................................................... 16
3.2 Mounting Procedures (Installed in a Panel Door)............................................................. 16
3.3 Mounting Clip Locations ...................................................................................................17
3.4 Mounting Orientation.......................................................................................................17
3.5 Panel Cutout......................................................................................................................18
3.6 Factors Affecting Panel Layout Design and Clearances ....................................................19
3.7 Clearance / Adequate Space.............................................................................................19
3.8 Grounding .........................................................................................................................19
3.9 Temperature / Ventilation................................................................................................ 20
3.10 Noise ................................................................................................................................. 20
3.11 Shock and Vibration.......................................................................................................... 20
3.12 Panel Layout Design and Clearance Checklist...................................................................21
CHAPTER 4: ELECTRICAL INSTALLATION .......................................................................................22
4.1 Grounding Definition ........................................................................................................22
4.2 Ground Specifications....................................................................................................... 22
4.3 How to Test for Good Ground........................................................................................... 23
4.4 Primary Power Port...........................................................................................................24
CHAPTER 5: SERIAL COMMUNICATIONS.......................................................................................25
5.1 Overview ...........................................................................................................................25
5.2 Port Descriptions............................................................................................................... 25
5.3 Wiring—MJ1/MJ2 Serial Ports.......................................................................................... 25
5.4 RS-485 Termination and Biasing ....................................................................................... 26
5.5 i³ Config Programming via Serial Port............................................................................... 27
5.6 Ladder-Controlled Serial Communication.........................................................................27
5.7 Configuration via Mini-B USB............................................................................................ 27
CHAPTER 6: CAN COMMUNICATIONS ..........................................................................................28

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6.1 Overview ...........................................................................................................................28
6.2 CAN Port Wiring................................................................................................................ 29
6.3 i³ Config Programming via CAN......................................................................................... 29
6.4 Ladder-Controlled CAN Communication........................................................................... 29
6.5 Using CAN for I/O Expansion (Network I/O) ..................................................................... 30
6.6 CAN and Termination and Bias .........................................................................................30
CHAPTER 7: ETHERNET COMMUNICATIONS....................................................................................31
7.1 Ethernet Module Protocols and Features.........................................................................31
7.2 Ethernet System Requirements ........................................................................................ 31
7.3 Ethernet Module Specifications........................................................................................31
7.4 Ethernet Module Configuration........................................................................................ 32
7.5 Ethernet Configuration –IP Parameters........................................................................... 35
7.6 Ethernet Module Protocol Configuration .........................................................................35
CHAPTER 8: DOWNLOADABLE COMMUNICATION PROTOCOLS .....................................................36
8.1 Overview ...........................................................................................................................36
8.2 Protocol Config.................................................................................................................. 38
8.3 Network Configuration ..................................................................................................... 39
8.4 Device List and Device Configuration................................................................................41
8.5 Scan List.............................................................................................................................42
8.6 Data Mapping Configuration (Scan List Entry)..................................................................43
CHAPTER 9: SYSTEM SETTING AND ADJUSTMENTS......................................................................45
9.1 System Menu - Overview..................................................................................................45
9.2 System Menu –Navigation and Editing............................................................................ 47
9.3 System Settings Details..................................................................................................... 48
9.4 Touch Screen Calibration .................................................................................................. 64
CHAPTER 10: REMOVABLE MEDIA..............................................................................................66
10.1 Overview ...........................................................................................................................66
10.2 microSD Cards...................................................................................................................66
10.3 microSD File System..........................................................................................................67
10.4 Using the Removable Media Manager ............................................................................. 67
10.5 Using Removable Media to Log Data................................................................................68
10.6 Using Removable Media to Load and Save Applications.................................................. 68
10.7 Using Removable Media to View and Capture Screens....................................................69
10.8 Configuration of a Removable Media............................................................................... 69
10.9 Removable Media (RM) Features—Program Logic........................................................... 70
10.10 Removable Media (RM) Features—Program Features....................................................71
10.11 Removable Media (RM) Features—Graphic/Screen Editor..............................................71
10.12 Removable Media Features—Additional Configuration................................................... 71
10.13 Filenames used with the Removable Media (RM) Function Blocks.................................. 72
10.14 System Registers used with RM........................................................................................ 73
10.15 Safe Removal of Removable Media Card.......................................................................... 74
CHAPTER 11: GENERAL I/O .........................................................................................................75
11.1 Overview ...........................................................................................................................75
11.3 Solid-State Digital Outputs................................................................................................76

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11.4 Relay Outputs.................................................................................................................... 79
11.5 Sinking and Sourcing Outputs........................................................................................... 80
11.6 Digital Inputs..................................................................................................................... 81
11.7 Analog Inputs .................................................................................................................... 83
11.8 I/O Status and Calibration.................................................................................................83
11.9 RTD Wiring on J3 Connector .............................................................................................86
11.10 4i³C Lite-20mA Wiring for Input and Output ....................................................................87
11.11 Analog Inputs .................................................................................................................... 88
11.12 Analog Outputs ................................................................................................................. 88
CHAPTER 12: HIGH SPEED I/O (HSC/PWM)................................................................................89
12.1 Overview ...........................................................................................................................89
12.2 Glossary of High Speed I/O Terms ....................................................................................89
12.3 High Speed Counter (HSC) Functions................................................................................ 90
12.4 HSC (High Speed Counter) ................................................................................................97
12.5 Pulse Width Modulation (PWM) Functions ...................................................................... 97
12.6 PWM Functions Register Map ........................................................................................ 100
Chapter 13: User Interface.............................................................................................................101
13.1 Overview .........................................................................................................................101
13.2 Displaying and Entering Data.......................................................................................... 101
13.3 Numeric keypad..............................................................................................................102
13.4 Screen Navigation ...........................................................................................................105
13.5 Ladder Based Screen Navigation.....................................................................................106
13.6 Touch (Slip) Sensitivity .................................................................................................... 107
13.7 Alarms .............................................................................................................................108
13.8 Removable Media ........................................................................................................... 111
13.9 Screen Saver.................................................................................................................... 113
13.10 Screen Brightness............................................................................................................ 113
CHAPTER 14: REGISTERS ...........................................................................................................114
14.1 Register Definitions......................................................................................................... 114
14.2 Useful %S and %SR registers........................................................................................... 114
14.3 Register Map for i³C Lite I/O ........................................................................................... 118
14.4 Resource Limits............................................................................................................... 119
CHAPTER 15: i³ CONFIG CONFIGURATION................................................................................120
15.1 Overview .........................................................................................................................120
15.2 i³ Config Status Bar..........................................................................................................120
15.3 Establishing Communications ......................................................................................... 121
15.4 Communicating via MJ1 Serial Port ................................................................................ 128
15.5 Communicating via On Board Ethernet Port ..................................................................129
15.6 Configuration ..................................................................................................................133
15.7 Digital / HSC Input Configuration.................................................................................... 134
15.8 Digital / PWM Output Configuration ..............................................................................136
15.9 Analog Input Configuration.............................................................................................137
15.10 Analog Output Configuration..........................................................................................138
15.11 Scaling Analog Inputs ...................................................................................................... 139
CHAPTER 16: FAIL –SAFE SYSTEM .................................................................................................141

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16.1 Overview .........................................................................................................................141
16.2 Settings............................................................................................................................ 142
16.3 Backup / Restore Data ....................................................................................................142
16.4 AutoLoad......................................................................................................................... 147
16.5 AutoRun .......................................................................................................................... 149
CHAPTER 17: CLONE UNIT.........................................................................................................150
17.1 Overview .........................................................................................................................150
17.2 Clone ............................................................................................................................... 150
17.3 Load Clone....................................................................................................................... 154
CHAPTER 18: MAINTENANCE....................................................................................................156
18.1 Firmware Updates........................................................................................................... 156
18.2 Backup Battery................................................................................................................ 157
18.3 Indications the battery needs replacing ......................................................................... 157
18.4 Battery Replacement ......................................................................................................157
CHAPTER 19: MODBUS COMMUNICATIONS ............................................................................158
19.1 Modbus Overview........................................................................................................... 158
19.2 Modbus Slave Overview..................................................................................................158
19.3 Modbus Master Overview ..............................................................................................159
19.4 Opening I³ Config Help File ................................................................................................160
19.5 Modbus Addressing Table for i³C Lite Units.................................................................... 161
CHAPTER 20: TROUBLESHOOTING / TECHNICAL SUPPORT ......................................................162
20.1 Connecting to the i³C Lite ...............................................................................................162
20.2 Connecting Troubleshooting Checklist (serial port –MJ1 Programming) ...................... 163
20.3 Connecting Troubleshooting Checklist (USB Port - Mini B Programming) ..................... 163
20.4 Connecting Troubleshooting Checklist (ETN port programming)................................... 163
20.5 Local Controller and Local I/O......................................................................................... 164
20.6 Local I/O Troubleshooting Checklist ............................................................................... 164
20.7 iCAN Network..................................................................................................................164
20.8 ICAN Network Troubleshooting Checklist....................................................................... 165
20.9 Basic Troubleshooting..................................................................................................... 166
20.10 Technical Support Contacts ............................................................................................166

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CHAPTER 1: SAFETY / COMPLIANCE
1.1 Safety Warnings and Guidelines
When found on the product, the following symbols specify:
•All applicable codes and standards need to be followed in the installation of this product.
•For I/O wiring (discrete), use the following wire type or equivalent: Belden 9918, 18 AWG, or
larger.
Warning: Consult user documentation.
Warning: Electrical Shock Hazard.
WARNING –EXPLOSION HAZARD: Do not disconnect equipment unless power has been switched off
or the area is known to be non-hazardous
WARNING: To avoid the risk of electric shock or burns, always connect the safety (or earth) ground
before making any other connections.
WARNING: To reduce the risk of fire, electrical shock, or physical injury it is strongly recommended
to fuse the voltage measurement inputs. Be sure to locate fuses as close to the source as possible.
WARNING: Replace fuse with the same type and rating to provide protection against risk of fire and
shock hazards.
WARNING: In the event of repeated failure, do not replace the fuse again as a repeated failure
indicates a defective condition that will not clear by replacing the fuse.
WARNING: EXPLOSION HAZARD—Substitution of components may impair suitability for Class I,
Division 2.
WARNING: The USB parts are for operational maintenance only. Do not leave permanently
connected unless area is known to be non-hazardous.
WARNING: EXPLOSION HAZARD—BATTERIES MUST ONLY BE CHANGED IN AN AREA KNOWN TO BE
NON-HAZARDOUS
WARNING: BATTERY MAY EXPLODE IF MISTREATED. DO NOT RECHARD, DISASSEMBLE, OR DISPOSE
OF IN FIRE.
WARNING: Only qualified electrical personnel familiar with the construction and operation of this
equipment and the hazards involved should install, adjust, operate, or service this equipment. Read
and understand this manual and other applicable manuals in their entirety before proceeding.
Failure to observe this precaution could result in severe bodily injury or loss of life.
WARNING: If the equipment is used in a manner not specified by IMO, the protection provided by
the equipment may be impaired.

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Adhere to the following safety precautions whenever any type of connection is made to the module.
a. Connect the green safety (earth) ground first before making any other connections.
b. When connecting to electric circuits or pulse-initiating equipment, open their related
breakers. Do not make connections to live power lines.
c. Make connections to the module first; then connect to the circuit to be monitored.
d. Route power wires in a safe manner in accordance with good practice and local codes.
e. Wear proper personal protective equipment including safety glasses and insulated gloves
when making connections to power circuits.
f. Ensure hands, shoes, and floors are dry before making any connection to a power line.
g. Make sure the unit is turned OFF before making connection to terminals. Make sure all circuits
are de-energized before making connections.
h. Before each use, inspect all cables for breaks or cracks in the insulation. Replace immediately
if defective.
1.2 Grounding
Grounding is covered in various chapters within this manual.
1.3 Compliance
To check for compliance and updates, visit the IMO website.
IMO Precision Controls Ltd: https://imopc.com

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CHAPTER 2: INTRODUCTION
2.1 Visual Overview of i³C Lite
Touch Screen (Press upper right corner to bring out the function keys and SYSTEM key
to access the Main Menu.)
Figure 2.1 –Visual Overview of the i³C Lite

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2.2 Where to Find Information about the i³C Lite
a) Datasheet –The datasheet is the first document to refer to for key information related
to specific i³C Lite models.
1. The datasheets for all i³C Lite models are available on the IMO website.
2. Datasheets contain pin-outs, jumper settings, and other model specific
information.
b) User Manual –This manual provides general information that is common to i³C Lite
models and can be downloaded from our website. Visit the IMO website to obtain user
documentation and updates.
IMO Precision Controls Ltd: http://www.imopc.com
2.3 Four Main Types of Information are covered in this Manual
a) Safety and Installation guidelines / instructions (Mechanical and Electrical)
b) Descriptions of hardware features –Serial ports, Removable Media, Communications,
etc.
c) Configuration and Use of the i³C Lite.
d) Maintenance and Support

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2.6 Connectivity to the i³C Lite.
The i³C Lite has excellent capability for connecting to a variety of devices. The diagram below shows
some examples of devices that can be used with the i³C Lite..
Figure 2.2 –Visual Overview of i³C Lite Connectivity
CAN
Serial
I/O
i³C Lite
Other i³ Devices
Drives
PLCs
Bar Code Readers
SCADAs
OPC Servers
Serial I/O
Sensors
Indicators
Alarms
Encoders
Pumps
Relays
Solenoids
Other i³ Devices
Smart I/O
IOS I/O
Smart I/O CAN
USB
i³Config
Ethernet
i³Config
OPC Server
Modbus TCP Devices

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2.7 Features of the i³C Lite
The i³C Lite are all-in-one industrial control devices. They combine control, user interface, I/O and
networking into a single, integrated package. Unique features of the i³C Lite includes the following:
•Small, sleek profile saves space and resources.
•Physical Specifications
omm: 96 tall x 125 wide x 331 deep
oin: 3.79 tall x 4.92 wide x 1.22 deep
oweight: 360g
•Bright color touch display
•Display of complex graphical objects including trends, gauges, meters and animations
•Advanced control capabilities including floating point, multiple auto-tuning PID loops and
string handling capabilities
•Intuitive interface
•Removable media for storage of programs, data logging, or screen captures
•iCANnetworking port for communication with remote I/O, other controllers or PCs
•i³ Config programming software that allows all aspects of the i³C Lite to be programmed and
configured from one integrated application
•Fail –Safe System which allows an application to continue running in the event of “Soft”
failures such as (Battery power loss or Battery Backed register RAM / Application flash
corruption)
•Clone Unit allows the user to “clone” the i³. This feature “clones” application program and
unit settings stored in Battery backed RAM of an i³. It can then be used to clone a different i³
(but must be the exact same model).
•Suited for most applications across a diverse range of industries

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2.8 Accessories
Please visit the IMO Control Accessories website for communication, programming, and I/O
accessories.
IMO Precision Controls Ltd https://www.imopc.com/products/97660000

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CHAPTER 3: MECHANICAL INSTALLATION
NOTE: The datasheet is the first document to refer to for model-specific information related to i³C
Lite models and key installation information. Visit the IMO websites to obtain datasheets, user
documentation, and updates.
3.1 Mounting Overview
The mechanical installation greatly affects the operation, safety, and appearance of the system.
Information is provided to mechanically install the unit such as cut-out sizes, mounting procedures,
and other recommendations for the proper mechanical installation of the unit.
3.2 Mounting Procedures (Installed in a Panel Door)
Once the panel design hasbeen completed using the criteria and suggestions in the following sections,
use the following steps to panel mount the i³C Lite.
NOTE: Unit comes with composite clips, which are tested for typical wash down, shock, and vibration.
If metal mounting clips are needed, they can be ordered at the IMO Automation website.
1. Carefully locate an appropriate place to mount the i³C Lite. Be sure to leave enough room at
the top of the unit for insertaion. Remove the microSD card to prevent damage to the panel
edge.
2. Carefully cut the host panel per the measurements found in the datasheet .
3. Dimensions can also be found below in Section 3.5. If the opening is too large, water may leak
into the enclosure, potentially damaging the unit. If the opening is too small, the I³ may not
fit through the hole without damage.
4. Remove any burrs and/or shape edges and ensure the panel is not warped in the cutting
process.
5. Make sure the gasket is installed on the i³C Lite and is free from dust and debris. Check that
the corners of the gasket are secure.
6. Pass the unit through the panel.
7. Insert each of the four (4) mounting clips into the slots in the i³C Lite case. One composite
plastic clip should be installed on each corner. Lightly tignten each screw so the clip is held in
place.
8. Tighten the screws on the clips such that the gasket is compressed against the panel.
Recommended torque is 2-3 in-lbs (0.23 –0.34 Nm). If metal mounting clips are used in place
of the plastic composite mounting clips, the recommended torque is 4-8 in-lbs (0.45-0.90 Nm).
9. Connect communications cables to the serial port, USB ports, and CAN port as required.

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3.3 Mounting Clip Locations
Figure 3.1 –i³C Lite with Mounting Clip Location
3.4 Mounting Orientation
Figure 3.2 –Orientation of i³C Lite
NOTE: For panel mounting—The
orientation shown provides for
optimum readability screen and ease
of use of the keypad.

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3.5 Panel Cutout
For installations requiring NEMA 4X liquid and dust protection, the panel cutout should be cut with a
tolerance of +/- 0.005” (0.1mm).
Figure 3.4 –i³C Lite Dimensions

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3.6 Factors Affecting Panel Layout Design and Clearances
The designer of a panel layout needs to assess the requirements of a particular system and to consider
the following design factors.
3.7 Clearance / Adequate Space
Install devices to allow sufficient clearance to open and close the panel door.
Table 3.1 –Minimum Clearance Requirements for Panel Box and Door
Minimum Distance –between base of device and
sides of cabinet.
2” (50.80mm)
Minimum Distance –between base of device and
wiring ducts.
1.5”(38.10mm)
Minimum Distance - between bases of each
device if more than one device is installed in
panel box or on door.
4”between bases of each device
(101.60mm)
Minimum Distance –between device and closed
door when door is closed.
(Be sure to allow enough depth for the I³.)
2” (50.80mm)
3.8 Grounding
Panel Box: The panel box needs to be properly connected to earth ground to provide a good
common ground reference.
Panel Door: Tie a low impedance ground strap between the panel box and the panel door to
ensure that they have the same ground reference.
WARNING: It is important to follow the requirements of the panel manufacturer and to follow
all applicable electrical codes and standards.
WARNING: Be sure to meet the ground requirements of the panel manufacturer and meet
applicable electrical codes and standards.

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3.9 Temperature / Ventilation
Ensure that the panel layout design allows for adequate ventilation and maintains the
specified ambient temperature range. Consider the impact on the design of the panel layout
if operating at the extreme ends of the ambient temperature range. For example, if it is
determined that a cooling device is required, allow adequate space and clearances for the
device in the panel box or on the panel door.
3.10 Noise
Consider the impact on the panel layout design and clearance requirements if noise
suppression devices are needed. Be sure to maintain an adequate distance between the i³C
Lite and noisy devices such as relays, motor starters, etc.
3.11 Shock and Vibration
The i³C Lite has been designed to operate in typical industrial environments that may inflict
some shock and vibration on the unit. For applications that may inflict excessive shock and
vibration, please use proper dampening techniques or relocate the i³C Lite to a location that
minimizes shock and/or vibration.