I-see Igep dm3730 Quick user guide

Document: MAN-PR-IGEP0030-RGxx

Revision: 3.0

Date: June 07, 2016

ISEE

Integration Software &

Electronics Engineering.

C/ Marcos Redondo, 5 Valldoreix

08197 - Barcelona

SPAIN

+34 93 5763931

[email protected]

http://www.isee.biz/

IGEP TM COM MODULE

DM3730/AM3703

HARDWARE REFERENCE

MANUAL

 
IGEPTM COM MODULE Hardware Reference Manual 
ISEE 2007 S.L. All rights reserved, IGEP is a registered trademark from ISEE 2007 S.L. The following is provided for informational purposes only. 
DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx 

 
Table of contents 
 
Table of contents........................................................................................................................... 2 
COPYRIGHT NOTICE............................................................................................................... 4 
WARRANTY............................................................................................................................ 4 
OVERVIEW............................................................................................................................. 5 
1 ORDERING INFORMATION ............................................................................................ 5 
2 ABOUT THIS MANUAL ................................................................................................... 6 
3 IGEPTM COM MODULE DM3730/AM3703 DESCRIPTION............................................... 6 
4 IGEPTM COM MODULE DM3730/AM3703 FEATURES.................................................... 8 
5 IGEPTM COM MODULE DM3730 BLOCK DIAGRAM...................................................... 11 
6 IGEPTM COM MODULE AM3703 BLOCK DIAGRAM...................................................... 12 
7 GENERAL VIEW............................................................................................................ 13 
ON-BOARD DEVICES & INTERFACES.................................................................................... 14 
1 SUMMARY ................................................................................................................... 14 
2 IGEPTM COM MODULE DM3730/AM3703 CONNECTORS MAP................................... 15 
3 OMAP PROCESSOR...................................................................................................... 15 
4 MEMORY ..................................................................................................................... 16 
5 POWER MANAGEMENT............................................................................................... 16 
6 WIFI/BLUETOOTH INTERFACE ..................................................................................... 16 
6.1 BLOCK DIAGRAM................................................................................................. 17 
6.2 IGEP™COM MODULES DM3730 ANTENNAS (INTERNAL UD11/EXTERNAL J2) ... 17 
7 USB 2.0 OTG: J200 & J1 ............................................................................................... 17 
8 USB 2.0 HOST: J4 ......................................................................................................... 18 
9 MICRO-SD: J6............................................................................................................... 19 
10 LED INDICATORS: D210 & D440 .................................................................................. 19 
11 CAMERA INTERFACE: J5 .............................................................................................. 19 
12 EXPANSION INTERFACE II: J7....................................................................................... 20 
EXPANSION CONNECTORS INTERFACES: J1 & J4................................................................. 22 
1 PINOUT TABLE OF EXPANSION CONNECTORS ............................................................ 22 
DEVELOPING A BASE BOARD............................................................................................... 25 

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

6.1 IGEP™ NEW YORK BASEBOARD................................................................................... 25

6.2 IGEP™ BERLIN BASEBOARD ......................................................................................... 25

7 MECHANICAL SPECIFICATIONS............................................................................................ 27

8 ELECTRICAL CHARACTERISTICS............................................................................................ 28

9 LIST OF TABLES .................................................................................................................... 30

10 LIST OF FIGURES .............................................................................................................. 30

11 KNOWN ISSUES ............................................................................................................... 31

12 TROUBLESHOOTING........................................................................................................ 31

13 CHANGE HISTORY............................................................................................................ 31

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

1COPYRIGHT NOTICE

This document is copyrighted, 2016, by ISEE 2007 SL. All rights are reserved. ISEE reserves the

right to make improvements to the products described in this manual at any time without

notice. No part of this manual may be reproduced, copied, translated or transmitted in any

form or by any means without the prior written permission of the original manufacturer.

Information provided in this manual is intended to be accurate and reliable. However, the

original manufacturer assumes no responsibility for its use, nor for any infringements upon the

rights of third parties which may result from its use.

2WARRANTY

THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND

IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING

ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods.

Further, the user indemnifies ISEE 2007 SL from all claims arising from the handling or use of

the goods. Due to the open construction of the product, it is the user’s responsibility to take

any and all appropriate precautions with regard to electrostatic discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE

LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL

DAMAGES.

ISEE 2007 SL currently deals with a variety of customers for products, and therefore our

arrangement with the user is not exclusive. ISEE assumes no liability for applications

assistance, customer product design, software performance, or infringement of patents or

services described herein.

Please read specifically, the Warnings and Restrictions notice in this manual prior to handling

the product. This notice contains important safety information about temperatures and

voltages. For additional information on IGEP™environmental and/or safety programs, please

contact with ISEE ([email protected]om).

No license is granted under any patent right or other intellectual property right of ISEE

covering or relating to any machine, process, or combination in which such ISEE products or

services might be or are used.

NOTE: It could be found a detailed warranty and sales conditions of IGEP™on ISEE website:

http://www.isee.biz

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

3OVERVIEW

3.1 ORDERING INFORMATION

IGEPTM Device

Reference

Description

IGEPTM COM MODULE

DM3730 WIFI

IGEP0030-RG60

DM3730 Processor, 512MB RAM, 512 MB

NandFlash, with WIFI/Bluetooth

IGEPTM COM MODULE

DM3730 NO WIFI

IGEP0030-RG70

DM3730 Processor, 512MB RAM, 512 MB

NandFlash, without WIFI/Bluetooth

Customized models

IGEPTM COM MODULE

AM3703 WIFI

IGEP0030-RG2x

AM3703 Processor, 512MB RAM, 512 MB

NandFlash, with WIFI/Bluetooth

IGEPTM COM MODULE

AM3703 NO WIFI

IGEP0030-RG8x

AM37030 Processor, 512MB RAM, 512 MB

NandFlash, without WIFI/Bluetooth

Expansion Boards

IGEPTM BERLIN

BASE0010-RB3

Expansion Board for fast prototyping of user´s

project

IGEPTM NEW YORK

ILMS0015-RA2

Expansion Board for fast prototyping of user´s

project

Table 1 Ordering information

Data matrix is located above micro-SD card holder:

Figure 1 IGEPTM COM MODULE DM3730/AM3703 RG version matrix location

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

3.2 ABOUT THIS MANUAL

This manual describes IGEPTM COM MODULE DM3730/AM3703 version RG hardware features.

IGEPTM COM MODULE DM3730/AM3703 COMs are IGEPTM technology devices from ISEE. You

can find additional information at our website www.isee.biz

The “OVERVIEW” chapter describes general features of these COM boards and show the block

diagrams. The “ON-BOARD DEVICES & INTERFACES” chapter describes in more detail each

device and interface connectors included on these products. “EXPANSION CONNECTORS

INTERFACES: J1 & J4”chapter describes in detail the function of each pin of the expansion

connector included on these boards. “DEVELOPING A BASE BOARD”chapter describes some

expansion boards available for IGEPTM COM MODULE DM3730/AM3703 boards that helps you

to develop a custom base board. “MECHANICAL SPECIFICATIONS” chapter describes the

mechanical characteristics of these products and finally chapter “ELECTRICAL

CHARACTERISTICS” show a table with the electrical specifications of these products.

At the end of this document you will find a list of tables, figures and change log. You will find

these elements in chapters: “LIST OF TABLES”, “LIST OF FIGURES”, “KNOWN ISSUES”,

“TROUBLESHOOTING” and “CHANGE HISTORY”.

THIS MANUAL ONLY REFERS TO IGEPTM COM MODULE DM3730/AM3703 RG

VERSION. HARDWARE MANUAL REVISION 2.0 REFERS TO IGEPTM COM MODULE

DM3730/AM3703 LEGACY RE VERSION

3.3 IGEPTM COM MODULE DM3730/AM3703 DESCRIPTION

IGEPTM COM MODULE DM3730/AM3703 are embedded processor computer on modules

(COMs) based on Texas Instruments DM3730/AM3703 processors.

IGEPTM COM MODULE DM3730

IGEPTM COM MODULE AM3703

Texas Instruments DM3730 processor

@1 GHz

oDSP TMS320DM-C64+ @800

MHz

oNEON SIMD Coprocessor

oVideo Acceleration

oCamera Interface

RAM 512 MBytes LPDDR SDRAM

@200 MHz

NAND Flash 512 MBytes

On board micro-SD socket

Designed for industrial and

commercial purposes.

USB OTG 2.0 on mini AB connector

LED Indicators

Size: 18x68,5 mm

Texas Instruments AM3703 processor

@1 GHz

oNEON SIMD Coprocessor

oCamera Interface

RAM 256 MBytes LPDDR SDRAM

@200 MHz

NAND Flash 512 MBytes

On board micro-SD socket

Designed for industrial and

commercial purposes.

USB OTG 2.0 on mini AB connector

LED Indicators

Size: 18x68,5 mm

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

J5: Camera interface

J1 and J4: Expansion interface

Non-populated parts:

oJ7: Expansion interface II

WIFI & Bluetooth

J2: External WIFI antenna connector

J5: Camera interface

J1 and J4: Expansion interface

Non-populated parts:

oJ7: Expansion interface II

IGEPTM COM MODULE AM3703 RG version Bottom View

Figure 3 IGEPTM COM MODULE AM3703 RG version View

IGEPTM COM MODULE AM3703 RG version Top View

IGEPTM COM MODULE DM3730 RG version Bottom View

Figure 2 IGEPTM COM MODULE DM3730 RG version View

IGEPTM COM MODULE DM3730 RG version Top View

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

Figure 4 IGEPTM COM MODULE DM3730 RG version GENERAL VIEW

3.4 IGEPTM COM MODULE DM3730/AM3703 FEATURES

Feature

IGEPTM COM MODULE DM3730

Specifications

IGEPTM COM MODULE AM3703

Specifications

ARM CPU

Texas Instruments DM3730 @1 GHz

L1 cache: 112 KB (DSP), 64 KB (ARM)

L2 cache: 96 KB (DSP), 256 KB (ARM)

NEON SIMD Coprocessor

DMA, Interrupt controllers and Timers

Texas Instruments AM3703 @1 GHz

L1 cache: 64 KB

L2 cache: 256 KB

NEON SIMD Coprocessor

DMA, Interrupt controllers and Timers

DSP

TMS320DM-C64+ @800 MHz

2D/3D

graphics

acceleration

PowerVR SGX 530 GPU, providing

2D/3D graphics acceleration with

OpenGL ES1.0, OpenGL ES2.0 and

Open VG support

Video

acceleration

Video acceleration: H.264, H.263,

MPEG-4, MPEG-2, JPEG, WMV9 and

additional codecs. Video

encoder/decoder up to 720p.

Camera

Interface

Camera ISP processing capability to connect RAW image sensor modules

Table 2 Processor

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

Feature

IGEPTM COM MODULE DM3730

Specifications

IGEPTM COM MODULE AM3703

Specifications

RAM Memory

512 MBytes LPDDR SDRAM @200 MHz

256 MBytes LPDDR SDRAM @200 MHz

Storage

NAND Flash 512 MBytes

On board micro-SD socket

NAND Flash 512 MBytes

On board micro-SD socket

Table 3 Memory and Storage

Feature

IGEPTM COM MODULE DM3730/AM3703 Specifications

Debug

Console 1,8 V CMOS into J1 connector

Indicators

2 Bicolor USER LEDs

USB 2.0 LS/FS/HS OTG

1 Mini AB USB connector (dual role)

microSD

micro-SD connector (SD and SDHC cards supported)

Expansion connector

2 x Expansion 70-pin connector:

UART, McBSP, McSPI, ADCs, I2C, GPIOs, GPMC, IRQ and

clocks

Analog input / output audio

LCD 24-bit parallel interface

USB 2.0 HS HOST

USB 2.0 LS/FS/HS OTG

Resets

RTC VBAT and 4,2 V input voltage

1 x Camera 27-pin connector

1x Expansion 27-pin connector (optional):

Keyboard matrix, McSPI, MMC, McBSP and S-VIDEO

Table 4 On-board connectors and devices

Feature

IGEPTM COM MODULE DM3730

WI-FI

IEEE 802.11 b/g/n 2,4GHz

Bluetooth

4.0 Class 1

Antenna Wi-

Fi/Bluetooth

Shared internal antenna (integrated on PCB) and optional

external antenna (HIROSE UL connector)

Table 5 Wireless connectivity

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

Feature

IGEPTM COM MODULE DM3730/AM3703 Specifications

Power from

expansion connector

3,5-4,2 Vcc / 0,5 A (Without USB) –3,5-4,2 Vcc / 0,7A (With USB)

2 mm socket connector for wall plug or JST Connector

Power from

expansion connectors

Supply Voltage: 5 V, 4,2 V and 1,8 V

Power Management

TPS65950

Table 6 Power

Feature

IGEPTM COM MODULE DM3730/AM3703 Specifications

Temperature Range

Commercial (0 to 70 Cº) and Industrial range (-40 to +85 Cº

Degrees) are available (Contact ISEE sales)

PCB size

18x68,5x1,6 mm

Table 7 Mechanical and environmental

WARNING: IGEPTM COM MODULE DM3730/AM3703 CAN ONLY BE POWERED

UP TO +4,2 Vdc POWER SUPPLY, OTHERWISE THE BOARD WILL BE PERMANENT

DAMAGED!

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

3.5 IGEPTM COM MODULE DM3730 BLOCK DIAGRAM

Figure 5 IGEPTM COM MODULE DM3730 RG version Block Diagram

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

3.6 IGEPTM COM MODULE AM3703 BLOCK DIAGRAM

Figure 6 IGEPTM COM MODULE AM3703 RG version Block Diagram

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

3.7 GENERAL VIEW

Figure 7 IGEPTM COM MODULE DM3730 RG version board top side components

Figure 8 IGEPTM COM MODULE DM3730 RG version board bottom side components

Figure 9 IGEPTM COM MODULE AM3703 RG version board top side components

Figure 10 IGEPTM COM MODULE AM3703 RG version board bottom side components

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

4ON-BOARD DEVICES & INTERFACES

4.1 SUMMARY

Device

Connector

Ref:

Comments

OMAP PROCESSOR

p/n: DM3730 or AM3703

http://focus.ti.com

MEMORY

POP TECHNIQUE

NAND Flash 512 MB

512 MB or 256 MB LPDDR SDRAM @200 MHz

POWER

Management

p/n: TPS65950

http://focus.ti.com

WIFI 802.11 b/g/n

p/n: WL1831

UD11,

J2(*)

OPTIONAL EXTERNAL ANTENNA (U.FL coaxial connector)

Only available into IGEP COM MODULE DM3730

BLUETOOTH

p/n: WL1831

UD11,

J2(*)

OPTIONAL EXTERNAL ANTENNA (U.FL coaxial connector)

Only available into IGEP COM MODULE DM3730

MAIN POWER

Expansion 70-pin connector

J1, J4

+4,2 Vdc (VBAT)

1,8 V SERIAL DEBUG

Expansion 70-pin connector

UART3

KEYBOARD MATRIX

Expansion 27-pin connector

J7(*)

Keyboard matrix 3x3

TFT INTERFACE

Expansion 70-pin connector

DSS_DATA0:23 and display clocks

S-VIDEO

Expansion 27-pin connector

J7(*)

S-Video output

CAMERA

Expansion 27-pin connector

CAM_D0:D11 + image clocks

RTC BATTERY BACK

UP SOURCE

Expansion 70-pin connector

RTC BACKUP BATTERY power signal available

USB 2.0 OTG

USB mini AB socket or Expansion 70-

pin connector

J200,

HSUSB

USB 2.0 HOST

Expansion 70-pin connector

USB1HS

AUDIO

Expansion 70-pin connector

MIC_SUB, AUXR, AUXL,HSOR, HSOL and MIC_MAIN_M

from TPS65950

LED INDICATORS

2x bicolor LED

D210,

D440

Bicolor red and green LEDs

EXPANSION

CONNECTORs

Expansion 70-pin connectors and

expansion 27-pin connectors

J1, J4,

J5 and

Expand many functionalities from OMAP3 processor,

Parallel output display, Parallel input cam, GPMC,

AUDIOs, ADCs, POWER, I2Cs, SPIs, McBSPs, USBs, GPIOs,

MMC, Keypad, S-VIDEO, Resets, CLKs, IRQs, UARTs, etc.

Table 8 IGEPTM COM MODULE DM3730/AM3703 RG version Interfaces summary

(*) THESE DEVICES and/or CONNECTORS ARE NOT POPULATED BY DEFAULT

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

4.2 IGEPTM COM MODULE DM3730/AM3703 CONNECTORS MAP

Figure 11 IGEPTM COM MODULE DM3730/AM3703 RG version CONNECTORS MAP TOP

Figure 12 IGEPTM COM MODULE DM3730/AM3703 RG version CONNECTORS MAP BOTTOM

4.3 OMAP PROCESSOR

IGEPTM COM MODULE DM3730/AM3703 COM uses DM3730 or AM3703 as core processor and

comes in a 0,4 mm pitch memory POP package on it.

POP (Package on Package) is a technique where the memory, NAND and SDRAM, are mounted

on top of the processor. For this reason, when looking at the IGEPTM COM MODULE

DM3730/AM3703 COM, you will not find an actual part labeled processor name.

Figure 13 POP Package

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

For accurate information on this processor, revise OMAP DATA MANUAL official document

from Texas Instruments official site http://focus.ti.com

4.4 MEMORY

The memory is mounted on top of the processor as mentioned. The key function of the POP

memory is to provide:

512 MBytes NAND x16

256 MBytes (AM3703 variant) or 512 MBytes (DM3730 variant) LP-DDR SDRAM x32 @

200 MHz

4.5 POWER MANAGEMENT

The TPS65950 is used to provide power to the IGEPTM COM MODULE DM3730/AM3703 COM.

In addition to the power it also provides:

Stereo Line Audio out

Stereo Line Audio in

Stereo Mic in

Power on reset

USB OTG PHY

Status LED

For accurate information on this chip, revise TPS65950 DATA MANUAL official document

from Texas Instruments official site http://focus.ti.com

4.6 WIFI/BLUETOOTH INTERFACE

WLAN: Chipset based on TI Wilink8 WL1831. The WL1831 integrates a RF transceiver operating

at 2,4 GHz and is IEEE802.11 b/g/n compliant.

Bluetooth: Power class 1 and 4.0 compliant.

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

4.6.1 BLOCK DIAGRAM

Figure 14 WIFI/Bluetooth Combo module block Diagram

4.6.2 IGEP™COM MODULES DM3730 ANTENNAS (INTERNAL UD11/EXTERNAL J2)

J2 is U.FL series Hirose connector for the external WIFI/BLUETOOTH antenna (Part number

U.FL-R-SMT-1). For the cable you will find cable assemblies if you look for cable assembly RF

U.FL to SMA MALE.

PERMANENT DAMAGE CAN BE CAUSED IF ANY VOLTAGE IS APPLIED TO J2

CONNECTORS. ENSURE CORRECT INSERTION ON COAXIAL CONNECTOR IN ORDER

TO DO NOT LOSE RF PERFORMANCE

4.7 USB 2.0 OTG: J200 & J1

IGEPTM COM MODULE DM3730/AM3703 COM includes a single USB 2.0 LS/FS/HS OTG Port

(J200) mini AB socket directly connected to the USB OTG pins of the OMAP processor.

The USB 2.0 OTG interface is implemented with the DM3730/AM3703 USB 2.0 OTG controller:

Operates either as the function controller of a high/full speed USB peripheral or as host

in point-to-point or multipoint communications

Complies with the USB 2.0 standard for high-speed (480 Mbps) function and with on-

the-go (OTG) supplement.

Supports USB 2.0 peripheral at High Speed (480 Mbps) and Full Speed (12 Mbps)

Supports USB 2.0 host at High (480 Mbps), Full (12 Mbps) and Low Speed (1.5 Mbps)

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

J200 is an USB Type mini AB Socket Connector with Part Number FCI 10033527-N3212MLF or

any other compatible.

The USB OTG signals are available through next connector pins:

Signal Name

Pin #

Description

VBUS_5V

J200:1

USB OTG VBUS (+5VDC)

HSUSB_DN

J200:2

USB OTG negative data (D-)

HSUSB_DP

J200:3

USB OTG positive data (D+)

HSUSB_ID

J200:4

USB OTG ID

GND

J200:5

Digital ground

Table 9 USB OTG J200 connector signals

Expansion 70-pin connector has available the same USB OTG signals from J830 connector:

Signal Name

Pin #

Description

VBUS_5V

J1:54

USB OTG VBUS (+5VDC)

HSUSB_DN

J1:37

USB OTG negative data (D-)

HSUSB_DP

J1:36

USB OTG positive data (D+)

HSUSB_ID

J1:46

USB OTG ID

GND

J1:70

Digital ground

Table 10 USB OTG J1 connector signals

IGEPTM COM MODULE DM3730/AM3703 RG version COM cannot be powered standalone using

J200 connector. Not use J200 and J1 USB OTG signals at the same time. For additional details,

please refer to section 22.1 of the DM3730 Technical Reference Manual”

4.8 USB 2.0 HOST: J4

IGEPTM COM MODULE DM3730/AM3703 COM HS HOST Port supports only high speed devices

(USB 2.0 HS devices). In order to support low speed devices (USB 1.0 LS devices) or full speed

devices (USB 1.1 FS devices), external self-powered USB 2.0 HUB must be used.

The USB HOST signals are available through next connector pins:

Signal Name

Pin #

Description

HOST_D-

J4:35

USB negative data (D-)

HOST_D+

J4:34

USB positive data (D+)

GND

J4:33

Digital ground

GPMC_NCS3 (GPIO_54)

USB Host reset

Table 11 USB HOST J4 connector signals

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

4.9 MICRO-SD: J6

A micro-SD connector is provided for micro-SD cards form factor. The micro-SD connector

supports SD and SDHC cards. SDHC (Secure Digital High Capacity, SD 2.0) is an extension of the

SD standard which increases card's storage capacity up to 32 GB. SDHC cards shares the same

physical and electrical form factor as older (SD 1.x) cards, allowing SDHC-devices to support

both newer SDHC cards and older SD-cards.

4.10 LED INDICATORS: D210 & D440

There are two bicolor LED provided with IGEPTM COM MODULE DM3730/AM3703 COM that

can be controlled by the user. In total are like 4 individual LED and 16 color schemes

Two LED are controlled via GPIO pins on the DM3730/AM3703 Processor

Two LED are controlled via I2C interface on the TPS65950

Signal Name

LED:COLOR

Description

PMIC: LEDA

D440:RED

Controlled by TPS65950 LEDA

GPIO_168 (I2C2_SCL)

D440:GREEN

Controlled by GPIO_168

GPIO_16 (ETK_D2)

D210:RED

Controlled by GPIO_16

PMIC: LEDB

D210:GREEN

Controlled by TPS65950 LEDB

Table 12 Bicolor LEDs D440 & D210 signals

4.11 CAMERA INTERFACE: J5

There is one 27 pin HIROSE Series FH26 (0.3mm pitch for flex circuit cable) used for Camera

interface named J5 connector:

Figure 16 IGEPTM COM MODULE DM3730/AM3703 RG version J5 location

Below pin table show you pin out of IGEP™COM MODULE DM3730/AM3703 camera connector

J5, with functionalities that you can configure. Each table has several columns:

Figure 15 IGEPTM COM MODULE DM3730/AM3703 RG version D210 & D440 location

D440

D210

IGEPTM COM MODULE Hardware Reference Manual

DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-IGEP0030-RGxx

Pin #: (JJ:PP format) where JJ means J5 connector and PP means pin number.

TYPE: What kind of pin and origin silicon chip:

OMAP: processor; PMIC: power management chip; PWR: Power and ground lines

MODE 0, MODE 1, MODE 2, MODE 3, MODE 4, MODE 5, MODE 6, MODE 7: OMAP3x

pin could be configured up to 7 different modes. Complexity of configuration could be

solved at “Pin Mux Utility for ARM(R) Microprocessors” on

http://www.ti.com/tool/pinmuxtool

Functions within [] brackets on column “MODE 0” denote board pin function.

For additional details, please refer to “DM3730 or AM3703 Applications Processor”

(www.TI.com)

Pin #

TYPE

MODE 0

MODE 2

MODE 4

MODE 5

MODE 7

J5:1

OMAP

CAM_HS

GPIO_94

hw_dbg0

safe_mode

J5:2

OMAP

CAM_VS

GPIO_95

hw_dbg1

safe_mode

J5:3

OMAP

CAM_XCLKA

GPIO_96

safe_mode

J5:4

OMAP

CAM_PCLK

GPIO_97

hw_dbg2

safe_mode

J5:5

OMAP

CAM_FLD

cam_global_reset

GPIO_98

hw_dbg3

safe_mode

J5:6

OMAP

CAM_D0

GPIO_99

safe_mode

J5:7

OMAP

CAM_D1

GPIO_100

safe_mode

J5:8

OMAP

CAM_D2

GPIO_101

hw_dbg4

safe_mode

J5:9

OMAP

CAM_D3

GPIO_102

hw_dbg5

safe_mode

J5:10

OMAP

CAM_D4

GPIO_103

hw_dbg6

safe_mode

J5:11

OMAP

CAM_D5

GPIO_104

hw_dbg7

safe_mode

J5:12

OMAP

CAM_D6

GPIO_105

safe_mode

J5:13

OMAP

CAM_D7

GPIO_106

safe_mode

J5:14

OMAP

CAM_D8

GPIO_107

safe_mode

J5:15

OMAP

CAM_D9

GPIO_108

safe_mode

J5:16

OMAP

CAM_D10

GPIO_109

hw_dbg8

safe_mode

J5:17

OMAP

CAM_D11

GPIO_110

hw_dbg9

safe_mode

J5:18

OMAP

CAM_XCLKB

GPIO_111

safe_mode

J5:19

OMAP

CAM_WEN

cam_shutter

GPIO_167

hw_dbg10

safe_mode

J5:20

OMAP

CAM_STROBE

GPIO_126

hw_dbg11

safe_mode

J5:21

PWR

VIO_1V8

J5:22

PMIC

PMIC_SYSEN

J5:23

PWR

GND

J5:24

PWR

VBAT

J5:25

OMAP

GPMC_WAIT1

GPIO_63

safe_mode

J5:26

OMAP

I2C3_SCL

GPIO_184

safe_mode

J5:27

OMAP

I2C3_SDA

GPIO_185

safe_mode

Table 13 Camera connector J5 signals

All signals are 1,8 V. It is suggested that the VBAT voltage rail (3,3 V- 4, 2 V) be used to

generate the required voltages for an adapter card.

WARNING: CAMERA signals go directly to OMAP processor. Improper use of

this connector could result on permanent damage to this processor.

4.12 EXPANSION INTERFACE II: J7

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