iameco ecoXPc User manual

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ecoXPcInstallation guide
Copyright © 2007
includes setup, service and
troubleshooting information

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All rights reserved.
Copyright © 2007, iamecoP™computers.
MicroPro™and the iameco™logo are registered
trademarks of Multimedia Computer Systems Ltd and its related entities.
All other trademarks are the property of their respective owners.
Alterations in respect of construction and design, errors and printing errors reserved.

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Environmental issues traditionally confined to certain regions or countries have come to global attention
thanks to treaties aimed at protecting the environment such as the 1989 Montreal Protocol, the United
Nations Framework Convention on Climate Change and the Rio Declaration. In the process, a growing
number of people became aware of the seriousness of environmental degradation stemming from
pollutants and began making efforts to clean up the environment in various industries.
Initially, people paid attention mostly to coping with "end-of-pipe" pollutants in an attempt to minimize
the amount of pollution. Naturally, they relied heavily on highly efficient processing facilities for dealing
with pollutants. However, that method was not able to reduce pollution at the source. Overcoming the
problem requires using fewer raw materials and/or utilizing non-toxic substances. This new approach is
considered a pollution prevention system that is more advanced than the traditional end-of-pipe cleanup
method.
The European Parliament enacted the Directive on Waste Electrical and Electronic Equipment (WEEE),
which defines extended producer responsibility (EPR) regarding electronic and electrical products, and the
Directive on the Restriction of the Use of Certain Hazardous Substances (RoHS), which is designed to ban
the use of specific toxic substances. The two directives are set to take effect in Jan. 2007 and July 2006
respectively. In addition, the European commission proposes a directive on the eco-design of energy-using
products (EuP), which will make it mandatory to consider the environmental impact associated from the
whole life cycle of a product from its designing phase.
These various rules for the development and supply of environmentally friendly products pushed private
enterprises like iameco to come up with integrated product policies (IPP). Businesses are applying IPP to
assess the environmental impact of their products and make improvements as necessary. In so doing, we
make use of LCA and eco-designing techniques with regard to all product-related processes.
Environmentally friendly products require close collaboration and among all entities involved in production,
including end-product producers. For this reason, most end-product producers in the electronics industry
are operating the so-called "green" procurement system (GPS) in an effort to use raw materials and
components that are not harmful to the environment.
In line with the growing popularity of "green" procurement system, electronics manufacturers, many of
who are the customers of iameco, are increasingly demanding eco-products as well as LCA and
environmental information on products. iameco is doing all it can to supply eco-products in order to meet
customer demand.

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First, iameco developed a green computer called the XPc to evaluate and manage eco-product data in a
systematic fashion. Eco Product System (EPS) consists of five modules including LCA, Eco-design, green
purchasing, environmental accounting, and environmental customer treatment. EPS provides LCA data
within a month to the general public and experts. The system will also provide data for environmental
label accreditation and a database on environmental suitability of raw and semi-raw materials. It will
further be used to provide environmental information on work processes, loadings of substance, costs of
products, evaluation of suppliers, and accreditation of eco-partners. In addition, EPS is equipped with the
green procurement capability (for acquiring environmentally friendly raw materials) and Eco-DB (for
providing customers with product-related environmental data in real time).
Second, iameco is supplying eco-products that comply with the EU RoHS Directive (EU RoHS Directive
banned the use of Pb, Hg, Cd, Cr+6, PBB (polybromide biphenyl) and PBDEs (polybrominated diphenyl
ethers in a product). Moreover, we at iameco are continuing our efforts to develop products that do not
require internationally banned toxic chemicals.
Supported by:

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Getting started
You have just purchased a high quality environmentally friendly XPc! Your purchase has contributed to
reducing the burden on the environment and to the further development of environmentally adapted
electron c products.
i
Please read this manual thoroughly before operating the XPc and keep your user’s manual in an accessible
place at all the times. Make sure the XPc has not been damaged in transit. Before you set up your XPc,
remove any protective film from the outside of it.
Package contents
CPU iameco™XPc
Cables 1 × Power Cord (3)
1 × FDD cable (2)
1 × Power extension cable (9)
Accessories 1 × ICE Heat-Pipe (1)
1 × Adhesive (5)
2 × cable ties (12)
1 × Cable clip (4)
1 × Heatsink compound (10)
Screws (11)
Application CD/Disk 2 × Motherboard CD Drivers (32bits/64bits) (7)
1 × XPc Extras CD (8)
2 × RAID Driver Floppy Disk (32bits/64bits) (6)
Documentation 1 × User guide (13)
1 × RAID manual (14)
™
If any items are missing or damaged, contact your iameco dealer.
Warning: Your AC cord comes equipped with a three-wire grounding plug. This plug will fit a standard AC
outlet. If you are unable to insert the plug into an outlet because the outlet isn’t grounded, contact a
licensed electrician to replace the outlet with a properly grounded outlet.
Note: Please keep the box and packing materials in a safe place for re-use. It can be used when
transporting your XPc in the future or return the packaging to iameco for recycling and re-use.

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Getting to know your XPc
Exterior Dissection
1. 5.25" Bay
2. HDD LED
3. Power LED
4. Power
5. Line-in
6. Mic
7. Headphone
8. USB ports
9. FireWire®400 mini port
Note: iameco™offers a variety of different XPc models loaded with various options. The illustrations here will
help familiarize you with the included features in your new XPc.
Rear connection ports
1. AC Power socket
2. COM port
3. VGA port
4. FireWire®400 port
5. USB Ports
6. LAN port
7. PS/2 Mouse
8. PS/2 Keyboard
9. Line-In port
10. Central / Bass
11. Rear out(R/L)
12. Front out (R/L)
13. Clear CMOS button
A. Wireless LAN perforation
B. Parallel port perforation
Note: Never force or over-tighten any connectors. If the connectors or ports don’t join with reasonable
ease, they probably don’t match. Make sure that the connectors match the port that you are connecting
and that you have positioned the connector correctly in relation to the ports. Otherwise you may damage
the connections.
The XPc has been designed to be easily configured directly by the end user. The iameco™XPc owes its
popularity to its unique combination of small-size, high performance and near universal component
compatibility. However, unlike ordinary desktop computers, iameco™XPc’s have been engineered as
complete systems.

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iameco XPc Intel Mainboard
Mainboard illustration

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XPc Installation Guide
Before you proceed
Take note of the following precautions before you any components or change any the component settings.
Also please read the safety information (discussed on page …) before you plug your PC into a wall socket.
• Unplug the power cord from the wall socket before touching any component.
Use a grounded wrist strap or touch a safely grounded object or a metal object, such as the power
supply case, before handling components to avoid damaging them due to static electricity.
• Avoid wearing synthetic fabrics, particularly Nylon.
• Hold components by the edges to avoid touching the ICs on them.
• Whenever you uninstall any component, place it on a grounded antistatic pad or in the bag that
came with the component.
Before you install or remove any component, ensure that the ATX power supply is switched off or the
power cord is detached from the power supply. Failure to do so may cause severe damage to the
motherboard, peripherals, and/or components.
Remove the cover
1. Unscrew the three thumbscrews of the chassis cover.
2. Slide the cover backwards and upwards.
Remove the rack
1. Unbuckle the two Serial ATA HDD mounting brackets from
the rack.
2. Remove the rack.
3. Unscrew and remove the front bay covers.
Note: There are 2 screws on each side of the mounting rack.

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CPU and ICE Installation
Remove the ICE Module
1. Unfasten the ICE fan thumbscrews on the back of the
chassis.
2. Unplug the fan power connector.
3. Unfasten the four ICE module attachment
screws.
4. Remove the ICE module from the chassis
and put it aside.
Install the CPU
Note: This 775 pin socket is fragile and easily damaged. Always use extreme care when installing a CPU
and limit the number of times that you remove or change the CPU.
1. Remove the protective cover.
2. First unlock and raise the socket lever, then
open the load plate (be careful not to touch the
socket pins during this process).

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3. Orientate the CPU and socket, aligning the yellow
triangle on the corner of the CPU with the triangle
on the socket. Making sure the CPU is perfectly
horizontal; insert the CPU into the socket. Close the
load plate, lower the CPU socket lever and lock in
place.
4. Spread an even layer of thermal compound on
the CPU die.
Install the ICE Module
Note: Please do not use too much Heatsink compound.
1. Place the ICE the module on top of the CPU and alig the spring-
loaded screws with the mainboard mounting holes.
n
2. Screw the ICE module to the mainboard. Note
to press down on the opposite diagonal corner
ng each screw.
3. Attach the fan power connector to the extension
cable connected to the mainboard.
while tighteni
4. Fasten the Smart Fan to the chassis with the four
thumbscrews.

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DDR Memory Installation
Memory Configuration: Install memory in any or all of the banks according to the combinations shown
below:
TOTAL 2 DIMM up to 2GB and 1GB per DIMM
Density 64 Mbit 128 Mbit 256 Mbit 512 Mbit
Device Width X8 X16 X8 X16 X8 X16 X8 X16
Single Side 64MB 64MB 128MB 128MB 256MB 256MB 512MB 512MB
Double Side 128MB 128MB 256MB 256MB 512MB 512MB 1024MB N/A
Note: Double-side X16 DDR-SDRAM chips are not supported by 512M Tech.
Note: 1. Maximum installable memory is 2GB.
2. Registered DIMMs are not supported.
3. Only unbuffered without ECC DIMM are supported.
ote: No jumper settings are required to configure memory.
The system BIOS utility automatically detects the memory settings.
Check the total installed system memory value in the BIOS menu.
Install a DDR module in DIMM1/DIMM2
N
1. Unlock the DIMM latch.
2. Align the DDR module's cutout with the DIMM slot
notch.
Slide the DDR module into the DIMM slot.
3. Check that the latches are closed, and the DDR
module is firmly installed.
Cable and Rack Installation
Install the FDD Cable
1. Plug the FDD cable in the FDD header (FDD1).
2. Fold the FDD cable under the power supply.
3. Fix the FDD cable to the power and chassis rail
with the supplied adhesive tape.

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he IDE
4. Loosen the purse lock and separate t
HDD/FDD power cable.
ckInstall the Ra
Note: n each side.Please make sure to secure the screws o
1. Place the HDD and FDD in the rack and secure with screws
from the side.
ssis.
2. Place the rack in the cha
3. Refasten the rack.
on the
ock and
e.
4. Place the power cables in the rack clip located
underside of the rack mount then loosen the purse l
separate the Optical Drive power cabl
Peripheral Installation
Install the Serial ATA HDD
1. Connect the Serial ATA and power
Install the Floppy Drive
1. Connect the FDD and power cables to the Floppy drive.

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Install an Optical Drive
1. Slide the optical drive into the chassis.
ide screws. 2. Fasten the four s
3. Plug the optical drive cable and power cable into the optical
drive.
Note: To prevent exposure to laser emanations (harmful to human eye), do not attempt to disassemble
the unit.
Accessories Installation
Install PCI/ AGP Card
1. A PCI/AGP card will be used to demonstrate the installation
procedure. Unfasten expansion slot bracket screws.
2. Remove the back panel bracket and put the bracket aside.
slot.
3. Install the PCI card into the PCI
4. As shown Install the AGP card into the AGP slot.
. Secure the bracket.
5

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Final Touches
Close the Chassis Cover
1. Replace the cover and refasten the thumbscrews.
2. Complete.
Technical Notes: Clear CMOS Button
On some selected XPcs t
information to factory default settings.
here is an easy-to-use Clear CMOS Button that allows users to reset BIOS
e XPc and remove the power cord.
2 Press the Clear CMOS Button by inserting a pointed object (e.g. a
pen nib) into the clear CMOS hole. Keep it pressed for 5 seconds.
3 Reconnect the power cord and turn on the computer.
Note: Remove the power cord before cleari
1 Power down th
ng CMOS.

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sJumper Setting
Front Panel Connector (JP9/JP8)
Header JP8 can be used to provide operati at this is
an alternative header to the 50pins streamline header that also connects the motherboard to the front
daughterboard.
Headers JP9 is used to connect cable to front panel connector mounted on front-panel or back-panel. The
front panel is where the hard drive activ ights, reset button, on/off button, computer power on light,
USB connectors, 1394 connectors, and audio headers, are located.
on status signals to the front daughterboard. Note th
ity l
Pin JP8 Pin
JP8
1 HDLED_PU 6 Power_SW
2 GLEDA 7 GND
3 HDLED 8 GND
4 GLEDB 9 NC
5 Reset_SW 10 KEY
Fan Connectors (FAN1/FAN2)
g may vary depending on the fan maker.
The mainboard provides two onboard 12V cooling fan power
connectors to support CPU (FAN1), System (FAN2) cooling
fans.
Note: Both cable wiring and type of plu
Extended USB Connectors (USB1/USB3)
These headers are used to connect auxiliary USB devi
d will only allow USB cables to be connected in one ces to the mainboard. These headers are directional direction.
an
Pin USB1/ USB3
1 GND
2 GND
3 Data+
4 Data-
5 VCC
LINE-In(J4), CD-In(CN3), Mini CD-In(CN4) Connectors
Port J4(Blue), CN3(Black) and CN4 can be used to connect a stereo audio input from CD-ROM, TV-tuner or
MPEG card.
Pin J4 Pin CN3 Pin CN4
1 Line-in Left 1 CD-in Left 1 Ground
2 Ground 2 Ground 2 CD-in Right
3 Ground 3 Ground 3 Ground
4 Line-in Right 4 CD-in Right 4 CD-in Left

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SPDIF-In/Out Connector (JP4)
Port JP4 can be used to connect special device.
Pin JP4
1 SPDIF IN
2 GND
3 VCC
4 GND
5 VCC
6 SPDIF OUT
arallel Port Hea er-E TP d X . Printer Port (JP11)
A DB25 male parallel port header is located near the rear panel of the mainboard. The header is used to
connect a parallel port socket (PC8) to the mainboard. The parallel printer port can be purchased from
huttle as an optional accessory.
S
Pin JP11 Pin JP11
1 PSTB 14 PAUTOFD
2 PD0 15 P_-ERR
3 PD1 16 PINIT
4 PD2 17 PSLCTIN
5 PD3 18 GND
6 PD4 19 GND
7 PD5 20 GND
8 PD6 21 GND
9 PD7 22 GND
10 P_-ACK 23 GND
11 P_BUSY 24 GND
12 P_PE 25 GND
13 P_SLCT 26 KEY
Startup errors
The BIOS performs a variety of system tests at startup. Serious problems are reported by beep codes. The
e BIOS beep codes are as follows:red LED is also flashed at the same time as the speaker beep. Th
Beeps Error
2Bad external ROM checksum
3 External ROM initialisation error
4 No system memory found
5 Can't boot - no resident language
6 BIOS ROM checksum error
7 Bad local RAM
8 VGA ROM initialisation failure
9 Invalid sy configurati a (or force ult)stem on dat d defa
10 No ROM BI imOS age found
11 Corrupted BIOS module found
o
te: Please refer to page 15 for BIOS setting information.N

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IOS SettingsB
The BIOS ROM has a built-in setup
information is stored in battery-bac program that allows users to modify basic system configuration. This ked RAM so that it retains set p information even if the system power
turned off. ty of hardware related functions including:
System date and time
Hardware execution sequence
Power management functi s
Allocation of system resources
Enter the BIOS
u
is
The system BIOS manages and executes a varie
on
To enter the BIOS (Basic I u Ou ) utility, follow these steps:
ep1.
np t / tput System
St Power on the computer. The system will perform its POST (Power-On Self Test) routine checks.
Step2. Press the <Del> key immediately, or at the following message:
Press DEL to enter SETUP, or simultaneously press <C
trl>, <Alt>, <Esc> keys
ote 1. If you miss the train of words mentioned in step2 (the message disappears before you can
the <Ctrl>, <Alt>, <Del> keys simultaneously.
If you do not press th ys in time an m does not b he screen wil pt an error
message, and you will be given fol ptio ”
Step3.
N
respond) and you still wish to enter BIOS Setup, restart the system and try again by turning the computer
OFF and ON again or by pressing the <RESET> switch located at the computer’s front-panel. You may also
reboot by simultaneously pressing
e ke d syste
ns: "Press F1 to Continue, DEL to Enter Setup
oot, t l promNote 2. the lowing o
When you enter the BIOS rogr he CMOS Setup Utility will lay Menu, as shown in
the next section.
The Main Menu
p am, t disp the Main
Once you enter the AwardBIOS ) C Setup Utility, the Main M wil ar on the screen. The
Main Menu allows you to select from several setup functions and two ch Use the arrow keys to
select among the items and press <En o accept and enter the sub nu
(tm MOS enu l appe
exit oices.
ter> t -me .
Note that a brief description n appears at the bottom of the screen.
Setup Items: The main m e following main setup categories. Recall that some systems
may not include all tries.
Standard CMOS Features tem configuration.
Advanced BIOS Feature: ced Features available on your system.
e values in the chipset registers and optimise
ystem's performance.
of each highlighted selectio
enu includes th
en
: Use this menu for basic sys
Use this menu to set the Advan
Advanced Chipset Features: Use this menu to change th
our sy

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rals: Use this menu to specify your settings for integrated peripherals.
Power Management Setup: Use this menu to specify your power management settings.
tus: This entry displays the current system temperature, Voltage, and FAN settings.
.
Loa his menu to load the BIOS default values for the minimal/stable
performance of your system to operate.
Load Opt s menu to load the BIOS default values that are factory-set for optimal
ile Award has designed the custom BIOS to maximize performance, the factory has
ese defaults to meet users' needs.
ble password protection. This
allows you to limit access to the system and Setup, or only to Setup.
Integrated Periphe
PnP / PCI Configurations: This entry appears if your system supports PnP / PCI.
PC Health Sta
Frequency/ rol: Use this menu to specify your settings for frequency/voltage controlVoltage Cont
d Fail-Safe Defaults: Use t
imized Defaults: Use thi
system operation. Wh
the righ to change th
t
Set Supervisor / User Password: Use this menu to change, set, or disa
Save & Exit Setup: Save CMOS value changes in CMOS and exit from setup.
Exit Without Saving: Abandon all CMOS value changes and exit from setup.
Standard CMOS Features
The items in the Standard CMOS Setup Menu are divided into several categories. Each category includes
none, one or more than one setup items. Use the arrow keys to highlight the item and then use the
<PgUp> or <PgDn> keys to select the value you want in each item.
Date: <Month> <DD> <YYYY> Set the system date. Note that the 'Day' automatically changes when you
set the date.
Time: <HH : MM : SS> The time is converted based on the 24-hour military-time clock. For example, 5
p.m. is 17:00:00.
IDE Channel 0 Master/Slave, IDE Channel 2, 3 Master: Options are in its sub-menu. Press <Enter>
to enter the sub-menu of detailed options.
rive A: Select the type of floppy disk drive installed in your system. The choice: None, 360K, 5.25 in,
The
N/A.
D
1
.2M, 5.25 in, 720K, 3.5 in, 1.44M, 3.5 in, or 2.88M, 3.5 in.
Video: Select the default video device. The choice: EGA/VGA, CGA 40, CGA 80, or MONO.
alt On: Select the situation in which you want the BIOS to stop the POST process and notify you.H
c
hoice: All Errors, No Errors, or All, But Keyboard.
ase Memory: Displays the amount of conventional memory detected during boot up. The choice:B
Extended Memory: Displays the amount of extended memory detected during boot up. The choice: N/A.

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Total Memory: Displays the total memory available in the system.The choice: N/A.
DE Adapters: The IDE adapters control the hard disk drive. Use a separate sub-menu toIconfigure each
ful, it
ns NONE ! The choice: None, Auto, or Manual.
isplay your disk drive size.
ng a value of 65535 means no hard disk. Min = 0, Max = 65535
dvan d BIOS Features
hard disk drive.
IDE HDD Auto-Detection: Press <Enter> to auto-detect HDD on this channel. If detection is success
fills the remaining fields on this menu. Press Enter
IDE Channel 0 Master/Slave, IDE Channel 2, 3 Master: Selecting 'manual' lets you set the remaining fields on
this screen and select the type of fixed disk. "User Type" will let you select the number of cylinders,
eads, etc., Note: PRECOMP=65535 meah
Access Mode: Choose the access mode for this hard disk. The choice: CHS, LBA, Large, or Auto.
Capacity: Disk drive capacity (Approximated). Note that this size is usually slightly greater than the size of
formatted disk given by a disk checking program. Auto-D
a
The following options are selectable only if the 'IDE Primary Master' item is set to 'Manual', and Access
ode set to CHS.
m
ylinder: Set the number of cylinders for this hard disk. Min = 0, Max = 65535
C
ead: Set the number of read/write heads. Min = 0, Max = 255
H
Precomp: Warning: Setti
Sector: Number of sector per track. Min = 0, Max = 255
Landing zone: Set the Landing zone size. Min = 0, Max = 65535
A ce
This section allows you to configure your system for basic operation. You have the opportunity to select
the system's default speed, boot-up sequence, keyboard operation, shadowing, and security.
CPU Feature: Press <Enter> to enter the sub-menu of detailed options.
die throtting).
atio of the throttled performance state that will be
Delay prior to Thermal: This sets the delay time before the CPU enters auto thermal mode. The choice:
one, 1/2/4/8/16/32/64Min.
N
Thermal Management: This item is select Thermal Management. Thermal Monitor 1 (On
Thermal Monitor 2 Ratio & VID transition). The Choice: Thermal Monitor 1 or Thermal Monitor 2.
M2 Bus Ratio: Represents the frequency (bus rT
initiated when the on-diesensor gose from not hot to hot.
ote: CPU support TM2, item appear.
N

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TM2 Bus VID: Represents the voltageof the throttled performance state that will be initiated when the on
iesensor gose from not hot to hot.
imit CPUID MaxVal: Set Limit CPUID MaxVal to 3,Should Be "Disabled" for WinXp. The Choice: Disabled
andle a CPUID MaxVal greater than 3. Please choose
and voltage. The
. If you want to flash
inboard use internal level1 (L1),
lt value for
nes a high-speed calculating ability to
rtual, one physical) in a multi-task environment. The
irst/Second/Third Boot Device: The BIOS attempts to load the operating system from the devices in
the sequence selected in these items. The Choice: LS120, Hard Disk, CDROM, ZIP100, USB-FDD, USB-
ZIP,USB-CDROM, LAN, Disabled or Floppy.
Boot Other Device: If BIOS can't load O.S. from First/Second/Third boot device you select above, BIOS
will search other devices and attempt to load O.S. The choice: Enabled or Disabled.
Boot Up Floppy Seek: Seeks disk drives during boot-Up. Disabling speed boots up. The choice: Enabled
or Disabled.
Boot Up NumLock Status: Selects power on state for NumLock. The choice: Off or On.
Gate A20 Option: This entry allows you to select how the Gate A20 is handled. The gate A20 is a device
used for above 1MByte of address memory. Initially, the gate A20 was handled via a pin on the keyboard.
Today, while a keyboard still provides this support, it is more common and much faster in setting to fast
for the system chipset to provide support for gate A20. The choice: Normal or Fast.
Security Option: Select whether the password is required every time the system boots or only when you
enter setup.
System The system will not boot and access to Setup will be denied if the correct password is not entered
romptly.
etup The system will boot, but access to Setup will be denied if the correct password is not entered
ng and just press <Enter>; it will disable security. Once the security is
to choose
tiprocessor support version. The choice:
d
Note: CPU support TM2, item appear.
L
or Enabled.
ote: Some older O.S.'s (Win98,WinMe..) cannot h
N
"Enabled" if you use one of those O.S. If your O.S. is WinXP or Win2000, we suggest you "Disabled" the
item.
1E Function: When disabled, processor can't transitions to a lower core frequencyC
Choice: Auto or Disabled.
Execute Disable Bit: When disabled, forces the XD feature flag to always return 0. The Choice: Enabled
or Disabled.
ote: CPU support, Execute Disable Bit item appears.
N
Hard Disk Boot Priority: This item allows you to select Hard Disk Book Device Priority.
Bios Write Protect: This item allows you to enable or disable the Bios Write Protect
IOS, u must set it [Disabled]. The choice: Enabled or Disabled.
B yo
PU L1&L2&L3 Cache: All processors that can be installed in this maC
external 2(L2) and (L3) cache memory to improve performance. Leave this item at the defau
better performance. The choice: Enabled or Disabled.
ote: CPU support, L3 item appear.
N
Hyper-Threading Technology: The latest Intel application defi
optimize your system by two CUPs supported (one vi
choice: Enabled, or Disabled.
Quick Power On Self-Test: This item speeds up Power-On Self Test (POST) after you power on the
computer. If it is set to enabled, BIOS will shorten or skip some check items during POST. The choice:
Enabled, or Disabled.
F
p
S
promptly.
The choice: System or Setup.
Note: To disabled security, select PASSWORD SETTING at Main Menu, and then you will be asked to enter
assword. Don't type anythi
p
disabled, the system will boot, and you can enter Setup freely.
PIC Mode: Via the routing, I/O APIC supports a total of 24 interrupts. We recommendA
[Enabled] for Windows XP and Windows 2000. The choice: Enabled or Disabled.
s the operating system mulMPS Version Control For OS: Select
1.1 or 1.4