Infineon EB 2ED2410 3M Series User manual
User guide Please read the Important notice and the Safety precautions and the Warnings Rev.1.00
www.infineon.com page 1 of 30 2022-08-05
Z8F80306082
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Scope and purpose
This user guide is intended to enable users to eas
•EB 2ED2410 3D 1BCD
•EB 2ED2410 3D 1BCS
•EB 2ED2410 3D 1BCDP
•EB 2ED2410 3D 1BCSP
and assesses the features it offers.
This document describes functionalities, set-up protections, layout choices that have been implemented, and
shows how to test them.
Intended audience
This document is intended for qualified electronic engineers who need a smart N-channel MOSFET gate driver
with integrated bi-directional current sense, wire protection and strong gate drive capability for automotive or
industrial fail safe and fail operational applications.
User guide 2 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Table of contents
About this document....................................................................................................................... 1
Table of contents............................................................................................................................ 2
1Overview............................................................................................................................... 3
1.1 Motherboard EB 2ED2410 3M..................................................................................................................3
1.2 Daughterboards EB 2ED2410 3D.............................................................................................................4
1.2.1 Daughterboards current rating..........................................................................................................5
1.3 High level diagrams.................................................................................................................................5
2Connecting and operating the board ........................................................................................ 8
2.1 Boards assembly .....................................................................................................................................8
2.2 Power connection ...................................................................................................................................9
2.3 Pin assignment and pin ratings ..............................................................................................................9
2.4 Jumpers.................................................................................................................................................11
2.5 Voltage ranges.......................................................................................................................................11
2.6 Operation to avoid ................................................................................................................................11
2.7 Quiescent current..................................................................................................................................12
3Switching behavior ...............................................................................................................13
3.1 Basic switching......................................................................................................................................13
3.2 Short-circuit event.................................................................................................................................14
3.3 Pre-charge for capacitive loads (daughterboards -1BCSP / -1BCDP only) .........................................15
4Protections...........................................................................................................................17
4.1 2ED2410-EM short-circuit protection ...................................................................................................17
4.2 I-t wire protection with comparator CP................................................................................................17
4.3 Overtemperature protection with comparator CP ..............................................................................18
5Electrical schematic ..............................................................................................................20
5.1 BOM........................................................................................................................................................20
5.1.1 EB 2ED2410 3M.................................................................................................................................20
5.1.2 EB 2ED2410 3D 1BCD or 1BCS..........................................................................................................21
5.1.3 EB 2ED2410 3D 1BCDP or 1BCSP .....................................................................................................21
5.2 Electrical diagrams................................................................................................................................22
6PCB details ...........................................................................................................................25
6.1 Layers EB 2ED2410 3M...........................................................................................................................26
6.2 Layers EB 2ED2410 3D 1BCD .................................................................................................................27
6.3 Layers EB 2ED2410 3D 1BCDP...............................................................................................................27
7References ...........................................................................................................................28
Revision history.............................................................................................................................29
User guide 3 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Overview
1
-h a semiconductor-
based solution of a fail-safe/fail operational power switch for automotive or industrial applications including
electronic fuse functionality plus an I-t wire protection.
These boards are primarily intended to test the basic functionality of the 2ED2410-EM gate driver in different
setups and not the switching or thermal performance in a real application.
1.1
EB 2ED2410 3M features the 2ED2410-EM driver, control interface to microcontroller or waveform generators
accessible via pin headers. 2ED2410-EM integrated protection logic, sensors inputs and diagnostics allows:
•Switch self- and wire protection (e.g. short-circuit or I-t wire protection)
•Fault identifications (via DGx pins)
•Switch operating conditions monitoring (PCB temperature and MOSFET gate source leakage)
•Failure mode analysis of connected MOSFET
Note: Failure mode analysis of connected MOSFET needs a specific set-up: it is not treated in this
document and will be described in a separate Infineon Application Note
The gate driver is protected against overvoltage by a 100 nF (CVS) plus optional 1 W zener (Z1) on pin VS.
Figure 1 Top & back view EB 2ED2410 3M with features
Table 1 Infineon parts used in EB 2ED2410 3M
See Chapter 1.3 for high-level diagram of the motherboard.
Type
Reference
PCS
Comment
Driver
2ED2410-EM (IC1)
1
Full analog driver
Power supply
TLE42962GV50 (TLE)
1
Can be replaced 1:1 with GV33 version
Signal PMOS
BSS83P (Q2)
1
Controls LED_INT to view SAFESTATE mode.
User guide 4 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Overview
1.2
EB 2ED2410 3D-1BCD, -1BCS, -1BCDP, -1BCSP feature N-channel MOSFET common drain, common sources
structure with or without pre-charge circuit. It allows replacement of any mechanical relay by cutting the
current flow in both directions. Additionally, the back-to-back structure blocks current in case of reverse
battery situation.
The boards are designed for easy plug-and-play banana connectors.
Note: 2ED2410-EM driving capabilities are not limited to one MOSFET on each gate output: These
daughterboards are primarily used to test basic functionality and not switching or thermal
performance
Note: Daughterboards EB 2ED2410 3D are intended to be used only with EB 2ED2410 3M. Gate-source
resistors are not needed when operating with EB 2ED2410 3M, but can be added to check
daughterboard stand-alone operation
Table 2 EB 2ED2410 3D daughterboards overview
Pre-charge
circuit
Figure 2 Top (main switch path) & back view of daughterboards EB 2ED2410 3D-1BCD and -1BCDP
Table 3 Infineon parts used in EB 2ED2410-EM 3D
See Chapter 1.3 for high-level diagram of the different versions.
Type
Topology
Comment
-1BCD
Common drain
Fully bi-directional
-1BCS
Common source
Recommended connection with shunt to the battery
-1BCDP
Common drain with pre-charge
Mandatory connection with pre-charge circuit to load side
-1BCSP
Common source with pre-charge
Mandatory connection with pre-charge circuit to load side
Type
Reference
PCS
Comment
MOSFET
IAUC120N06S5N011
(2)
3
(2: -1BCD, -1BCS)
(3: -1BCDP, -1BCSP)
Signal NMOS
2N7002 (Q)
1
For pre-charge level shifter
Signal PMOS
BSS83P (T)
1
For pre-charge level shifter
User guide 5 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Overview
1.2.1
The daughterboards are designed for continuous 20 A operation, 30 A for 10 minutes and 60 A for one minute
without the I-t wire protection. See Chapter 4.2 for I-t wire protection adjustment.
Short-circuit limit is by default using 5 V Enable from TLE42926GV50 @ 80 A, see Chapter 4.1 for details.
1.3
The motherboard features a small low voltage generator to generate 5 V voltage, +VDC. It can be replaced 1:1
by the same TLE42962GV33 in 3.3 V version. +VDC supplies the reference voltage for INT, CPN and EN pins. A
push-button allows to pull-down this voltage, therefore, when the button remains pushed, the driver is in
SLEEP mode and a RESET is performed. See datasheet [1] Chapter 5 for details on driver operating modes.
Figure 3 Overview of motherboard
-charge circuit can be implemented as an
add-on with no interference on main current MOSFET switch.
User guide 6 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Overview
Figure 4 Overview of daughterboard -1BCD
Figure 5 Overview of daughterboard -1BCDP
User guide 7 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Overview
Figure 6 Overview of daughterboard -1BCS
Figure 7 Overview of daughter board -1BCSP
User guide 8 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Connecting and operating the board
2
This chapter describes how to connect the motherboard with the daughterboard and gives a non-exhaustive
list of actions to avoid in order to keep 2ED2410-EM and the board operational.
2.1
Step1: Bring the boards together, so top overlay (text) can be read on both boards.
Figure 8 Board stack connection step 1
Step2: Pile up the boards gently, avoid bending the headers
Figure 9 Board stack connection step 2
Boards are ready for use.
User guide 9 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Connecting and operating the board
2.2
Refer to table 2 for connection options for each daughterboard.
Figure 10 Power connection diagrams with 3D-1BCD
Figure 11 Power connection diagram with 3D-1BCDP, 3D-1BCS, 3D-1BCSP
LOAD: Electronic loads as well as classical passive elements are usable.
Battery: Lab bench power supplies and real batteries are usable.
2.3
2ED2410-EM control, diagnostics and measurement pins are directly accessible through the left pin headers for
direct use with waveform generators and oscilloscope. Can also be connected to a microcontroller control
board/kit with small wires.
User guide 10 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Connecting and operating the board
The right pin headers allow readings of all signals from and to the MOSFET and shunt for observation purposes,
for example an oscilloscope.
Figure 12 Pin header details with top view
Refer to 2ED2410-EM datasheet [1] for detailed operating modes in Chapter 5.1 Operating modes.
Table 4 Pin ratings and visualization. Refer to component datasheet in case of doubt.
Pin
Min.
Max.
Unit
Visualization
Comment
CSO1, CSO2, TMPO
0
5.5
V
-
Analog outputs
ENABLE
0
5.5
V
LED_VDC: Green
when ENABLE is
supplied
Turn--
default if jumper JTLE is placed. JTLE can
be removed and ENABLE supplied
externally with pin header.
INA, INB
0
5.5
V
-
Turn--
driven separately or together.
INT
0
VENABLE
V
LED_INT: Red when
SAFESTATE active
SAFESTATE.
CPP, CPN
0
5.5
V
-
Place JCPP to connect CPP to CSO2
through RC I-t wire. Adjust
potentiometers to adjust wire protection.
DG0, DG1
0
VENABLE
V
-
Digital outputs
VS, SB, SA, ISxx, TMP
-42
45
V
-
Limited due to TLE42962 max. ratings. It
is possible to remove and RREG1 and
JTLE to enable board use up to VS = 60 V.
Adapt Z1 accordingly. Supply Enable pin
externally via pin header J1-12.
Pre-charge / 2N7002
0
10
V
-
To activate the level shifter which
controls pre-charge MOSFET, only with
1BCDP and 1BCSP daughterboards.
User guide 11 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Connecting and operating the board
2.4
Two 2 mm jumpers are present on the board.
Table 5 Jumpers
2.5
Thanks to 2ED2410-EM wide operating and extended range, the next figure shows the voltage range that can be
applied to 2ED2410-EM boards back-to-back compared to commonly accepted ranges based on ISO16750-2.
On the motherboard the TLE42862 is the limiting part regarding the maximum operating range.
Motherboard: - 45 V to + 45 V (or +58 V if TLE is disabledJTLE open)
Daughterboards: - 60V to + 60 V (back to back 60 V MOSFET)
Figure 13 Voltage range for EB 2ED2410 3M/3D
2.6
Please never short the output BC of 2ED2410-EM to GND or to a potential lower than VBAT.
2ED2410-EM will behave like a diode and will be destroyed (See diodes block diagram from 2ED2410-EM
datasheet [1])
Example: if a test for UVLO protection feature is required (boost converter supply output), short BC to
VS pin or battery-side connector
Pin
Location
Comment
JCPP
On the top
Enables or disables the I-t wire protection. When taken off, RCPP and C are
disconnected from CSO2. Connect the right side of JCPP pin header side to J1-4
(GND) to ground CPP pin if CP comparator is not used in your application.
JTLE
On the bottom
Enables or disables TLE42962GV50. When taken off, enable voltage can then be
supplied externally from motherboard pin header J1-12.
User guide 12 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Connecting and operating the board
2.7
Quiescent current of 2ED2410-EM can easily be verified with back-to-back demoboard. The quiescent current is
measured in SLEEP mode, the consumption is measured in IDLE mode and in ON mode in open load (to
simulate no current drawn by load and consider only the consumption by the driver itself).
To assess quiescent current, ENABLE must be supplied externally and TLE42962GV50 must be disabled (take off
jumper JTLE). Also, RENABLE must be removed (unsoldered) to save current consumption from LED_VDC (see
schematic).
Figure 14 Test setup of quiescent current measurement
In some cases, CSA2 may not be needed in the application. Therefore, in the IBAT ON graph the consumption is
represented with the CSA2 disabled, as per datasheet chapter 7.2. This allows a typical consumption <100 µA,
at 12 V battery voltage, of the driver in ON mode when the load is not active or open.
Figure 15 Quiescent current and consumption drawn from battery in SLEEP, IDLE and ON mode
User guide 13 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Switching behavior
3
Note: Values shown in this chapter are measured under lab conditions and will vary for different cooling
conditions and setups, and samples used.
3.1
Next figure shows switching behavior from SLEEP to IDLE mode. As soon as VEN threshold is met, 2ED2410-EM
powers up and the boost converter charges the driver supply CBC (monitored by VBC) in ~550 µs, given CBC=1 µF,
L1=100 µH, VS=12 V. State machine is described in Chapter 5 of 2ED2410-EM datasheet [1].
Figure 16 Waveforms from SLEEP to IDLE mode [Yellow VEN; Green VDG0; Purple VBC; Blue VDG1]
Next figure shows switching behavior from IDLE to ON mode. As current is pulled from CBC to supply the gates,
VBC-VS lowers and boost converter kicks in to regulate back the CBC voltage. The pulses of the boost converter
switch can be monitored on RS test point (TP_RS) or DG0 pin.
Figure 17 Waveforms from IDLE to ON [Yellow VIN; Green VDG0; Purple VGS; Blue ILOAD]
The next figure shows switching behavior from ON to IDLE mode, e.g. normal switch off of the switch.
User guide 14 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Switching behavior
Figure 18 Waveforms from ON to IDLE [Yellow VIN; Green VDG0; Purple VDG1; Blue ILOAD]
3.2
Next figure shows switching behavior from ON to SAFESTATE mode. SAFESTATE mode is triggered here by a
short circuit across the load resistor made by a loose wire, manually. The red LED_INT is lit.
In this example, Gain is set to 66.7 (RCSO1RISx1, therefore the short-circuit limit is set to ISC = 111 A.
Figure 19 Waveforms from ON to SAFESTATE [Yellow VINT; Green VDG0; Purple VDG1; Blue VGS]
To reset from SAFESTATE, press the push button S1 switch once. The driver will briefly go to SLEEP mode while
the switch is pressed then will go back to IDLE mode if INA & INB are set to low. If INA or INB or both are
set/remain high, the driver will go back to ON mode.
Note: INT signal in Figure 15 is slowed down by the Q2 PMOS (backside of the board) used to light the red
LED_INT. Remove Q2 (unsolder) to check out INT pin falling edge signal. See 2ED2410-EM
datasheet [1] for INT pin details
User guide 15 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Switching behavior
3.3
Note: This pre-charge circuit is only necessary if the embedded low by-pass current is not enough. See
Chapter 6 of 2ED2410-EM‘s datasheet [1] for a description of a low by-pass current feature.
Pre-charge is controlled by pin J2-12 from motherboard, provided that either board -1BCSP or -1BCDP is used.
The goal of the pre-charge circuitry is to avoid or limit the inrush current due to the capacitive nature of the
load, avoiding the unintended trigger of the short-circuit protection.
If no pre-charge is used, a capacitive load would trigger the short-circuit protection during turn-on of the
switch, under normal operating conditions. In the example below, the inrush current reaches 79 A and the
driver enters SAFESTATE (INT
+
Battery
CLOAD
VINA & VINB
Figure 20 Switching capacitive load with no pre-charge [Yellow VLOAD; Green VCS01; Purple ILOAD; Blue VINT]
The pre-charged concept implemented on boards -1BCSP and -1BCDP, is a simple SMD resistor limiting the
inrush current. The current is let through the resistor with a MOSFET (M_pch), by-passing the main current
path, and the MOSFET is driven by a push-pull providing the boosted BC voltage to the M_pch MOSFET gate.
This circuit is an example of circuit re-using the 2ED2410-EM boost converter (BC) voltage and small signal
Infineon MOSFET BSS83P and 2N7002.
Note: There is no specific protection for the resistor R_pwr (6W resistor, see BOM). It is advised to limit the
activation time of pre-charge pin to 150ms (either waveform generator or microcontroller). The
circuit can be improved with two resistors in parallel.
The following diagram shows the test set-up to for pre-charge control with a waveform generator. See table 4
for pre-charge pin rating J2-12.
User guide 16 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Switching behavior
+
Battery
CLOAD
VPRE-CH.
VINA & VINB
Waveform generator
t
150ms max.
Pre-ch. starts
Pre-ch. is off,
main switch starts
GND
Figure 21 Test circuit of pre-charge control
The figure below shows a 150 ms pre-charge of a capacitor CLOAD = 6.8 mF. The inrush is limited to 25 A and
therefore short circuit protection/2ED2410-EM
Figure 22 Switching capacitive load with pre-charge [Yellow VLOAD; Green VCS01; Purple ILOAD; Blue VINT]
User guide 17 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Protections
4
4.1
Note: The EB 2ED2410-EM 3D boards are not designed for repetitive short-circuit operation. Short-circuit
energy dissipation relies on MOSFET avalanche performance. Therefore the number of short-
circuit cycles possible have to be calculated based on the customer’s short-circuit test set-up
2ED2410-EM has an internal short-circuit protection. By default, on the EB 2ED2410-EM 3M/3D this protection is
set-up with:
-Shunt resistor value [on daughterboards 3D: RSHUNT = 500 ].
-Gain used on amplifiers CSA1 [on motherboard 3M: G= 91]. To adjust the gain on board, adapt RCSO1 or
RCSO2 or RTMPO within datasheet range and adapt RISx resistors based on datasheet gain range.
Recommended to use 1% error resistors or better.
-VENABLE [on motherboard 3M] is 5 V from TLE42962GV50, but externally adjustable from 3 V to 5.5 V if
jumper JTLE is removed.
See 2ED2410-EM Getting started application note [2] for details on calculation.
Table 6 Current short-circuit protection set on EB 2ED2410 3M depending on VENABLE
4.2
On the EB 2ED2410 3M board, jumper JCPP allow analog output CSO2 to be looped to comparator CP input CPP
(positive input of comparator CP, see 2ED2410-EM datasheet [2]).
I-t wire protection settings possibilities
•Cvalue is fixed (10 µF)
•RCPP VRCPP potentiometer
•VCP(REF) on pin CPN is adjustable with potentiometer VRCPN, adapting voltage divider between VENABLE and
CPN pin (see schematics for details). As a result, VCP(REF) can be set between 4.16 V and 1 V (see datasheet
for VCP(REF) limitations [2]).
Note: RCPN can be unsoldered and VCP(REF) fixed externally with pin header. C can be changed to desired
value. VRCPP can also be changed for a fixed higher value resistor up to 470 kΩ.
VENABLE
3
3.3
4
5
5.5
V
Given G = 91 and RSHUNT
mounted on daughterboards.
Short-circuit current limit
49
54
65
80
90
A
User guide 18 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Protections
Jumper to enable/disable
I-t wire protection
Potentiometer VRCPN for
adjusting CPN reference
Potentiometer VRCPP for
adjusting tau of wire protection
Figure 23 How to set I-t wire protection
The following graph shows the I-t wire protection curve adjustment area (in orange color) with VRCPN and
VRCPP given the default short-circuit value and components on EB 2ED2410 3M/3D (EiceDRIVER2ED2410 Tool,
downloadable from the 2ED2410-EM website [3]or Infineon Development Center [4] in future).
Figure 24 I-t wire setting range
4.3
To simply check overtemperature protection, disconnect JCPP and connect TMPO pin header to CPP pin
header with a jump wire.
User guide 19 of 30 Rev.1.00
2022-08-05
EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Protections
Connecting TMPO J1-3,
directly to CPP J1-8
Figure 25 How to wire overtemperature protection
The threshold of overtemperature can be set with VCP(REF) on CPN pin, same operation as I-t wire threshold.
The below graph shows the implemented temperature curve in the EB 2ED2410 3M/3D boards, given VEN= 5 V,
RTMP, RNTC and RTMPO as described in the BOM chap. 5.1.
Depending on the target PCB temperature for shutdown, the threshold of the temperature has to be set
accordingly. For example, for an overtemperature shutdown at a PCB temperature of 100°C, the threshold on
CPN pin has to be set to VCP(REF) = 2.3 V.
Figure 26 Temperature output curve vs. top PCB temperature
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
VTMPO (V)
PCB Temperature (°C)
User guide 20 of 30 Rev.1.00
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EB 2ED2410 3M/3D Family
Evaluation mother/daughterboards
Electrical schematic
5
5.1
5.1.1
Reference
Description
Designator
Qty
10 µF / 10 V
Capacitor
C
1
1 µF / 25 V
Capacitor
CBC
1
100 pF/10 V
Capacitor
CCSO1, CCSO2
2
100 nF / 100 V
Capacitor
CREG_in, CVS
2
4.7 µF / 10 V
Capacitor
CREG_out
1
10 nF / 6.3 V
Capacitor
CRS
1
1N4148W-V-GS08
Diode
DA, DB
2
2ED2410-EM
Integrated Circuit
IC1
1
SSQ-112-03-G-S
Connector
J1, J2
2
TMM-102-01-F-S-SM
Connector
JCPP, JTLE
2
VLS3015CX-101M-H
Inductor
L1
1
597-3003-407F (RED)
LED
LED_INT
1
150080GS75000 (GREEN)
LED
LED_VDC
1
BSS83P
MOSFET (P-Channel)
Q2
1
1K (0805)
Resistor
RCPN, RENABLE,
RLED_INT, RLED_VDC
4
20K (0805) 1%
Resistor
RCSO1, RCSO2, RTMPO
3
22R (0805) 1%
Resistor
RGA_OFF, RGB_OFF
2
2.2K (0805)
Resistor
RGA_ON, RGB_ON
2
0R (0805)
Resistor
RGND
1
150K (0805)
Resistor
RINT
1
220R (0805) 1%
Resistor
RISN1, RISN2, RISP1, RISP2
4
10R (0805)
Resistor
RQ1
1
100R (0805)
Resistor
RREG1
1
N.C. (0805)
Resistor
RREG2
1
10R (1206, 0.5 W min.)
Resistor
RRS
1
1.2K (0805)
Resistor
RTMP
1
7914G-1-000E
Switch
S1
1
TLE42962GV50
Integrated Circuit
TLE
1
20-313143
Test Point
TP_BC, TP_RS
2
3314G-1-502E
Variable Resistor
VRCPN
1
3314G-1-254E
Variable Resistor
VRCPP
1
SML4758AHE3_A_H
Zener Diode
Z1
1
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5
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