Intel BLKD102GGC2 Configuration guide

April 2006
Order Number: D44278-001US
The Intel®Desktop Board D102GGC2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D102GGC2 Specification Update.
Intel® Desktop Board
D102GGC2
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board D102GGC2 Technical Product
Specification. April 2006
This product specification applies to only standard Intel Desktop Board D102GGC2 with BIOS
identifier GC11020M.86A.
Changes to this specification will be published in the Intel Desktop Board D102GGC2
Specification Update before being incorporated into a revision of this document.
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EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
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Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
Intel®desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
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Copyright ©2006, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the Intel®Desktop Board D102GGC2. It
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
D102GGC2 and its components to the vendors, system integrators, and other engineers and
technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D102GGC2
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.

Intel Desktop Board D102GGC2 Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the board, and X is the instance of the particular part at that
general location. For example, J5J1 is a connector, located at 5J. It is the first connector in
the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview......................................................................................................................10
1.1.1 Feature Summary..........................................................................................10
1.1.2 Manufacturing Options ..................................................................................11
1.1.3 Board Layout.................................................................................................12
1.1.4 Block Diagram...............................................................................................14
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 ATI Radeon* Xpress 200 Chipset................................................................................17
1.5.1 Graphics Subsystem .....................................................................................17
1.5.2 Firmware Hub (FWH) ....................................................................................17
1.5.3 USB...............................................................................................................17
1.5.4 IDE Support...................................................................................................18
1.5.5 Real-Time Clock, CMOS SRAM, and Battery................................................20
1.6 PCI Express* Connectors ............................................................................................24
1.7 Legacy I/O Controller...................................................................................................24
1.7.1 Serial Port......................................................................................................24
1.7.2 Parallel Port...................................................................................................25
1.7.3 Diskette Drive Controller................................................................................25
1.7.4 Keyboard and Mouse Interface .....................................................................25
1.8 High Definition Audio Subsystem.................................................................................26
1.8.1 Audio Subsystem Software ...........................................................................26
1.8.2 Audio Connectors..........................................................................................27
1.9 LAN Subsystem ...........................................................................................................28
1.9.1 LAN Subsystem Software..............................................................................28
1.10 Hardware Management Subsystem.............................................................................29
1.10.1 Fan Monitoring...............................................................................................29
1.10.2 Chassis Intrusion and Detection....................................................................29
1.11 Power Management.....................................................................................................29
1.11.1 ACPI..............................................................................................................30
1.11.2 Hardware Support .........................................................................................32
2Technical Reference
2.1 Memory Map................................................................................................................37
2.2 DMA Channels.............................................................................................................38
2.3 Fixed I/O Map...............................................................................................................39
2.4 Interrupts......................................................................................................................40
2.5 PCI Configuration Space Map......................................................................................41
2.6 PCI Conventional Interrupt Routing Map .....................................................................41
2.7 Connectors...................................................................................................................42
2.7.1 Back Panel Connectors.................................................................................43
2.7.2 Component-side Connectors.........................................................................44
2.7.3 Front Panel USB Connectors........................................................................50
2.8 Jumper Block ...............................................................................................................51

Intel Desktop Board D102GGC2 Technical Product Specification
vi
2.9 Mechanical Considerations..........................................................................................52
2.9.1 Form Factor...................................................................................................52
2.9.2 I/O Shield.......................................................................................................53
2.10 Electrical Considerations..............................................................................................54
2.10.1 DC Loading....................................................................................................54
2.10.2 Add-in Board Considerations.........................................................................54
2.10.3 Fan Connector Current Capability.................................................................55
2.10.4 Power Supply Considerations .......................................................................55
2.11 Thermal Considerations...............................................................................................56
2.12 Reliability......................................................................................................................58
2.13 Environmental..............................................................................................................59
2.14 Regulatory Compliance................................................................................................60
2.14.1 Safety Regulations ........................................................................................60
2.14.2 European Union Declaration of Conformity Statement..................................60
2.14.3 Product Ecology Statements.........................................................................62
2.14.4 EMC Regulations...........................................................................................65
2.14.5 Product Certification Markings (Board Level)................................................66
3Overview of BIOS Features
3.1 Introduction ..................................................................................................................67
3.2 BIOS Flash Memory Organization ...............................................................................68
3.3 Resource Configuration ...............................................................................................68
3.3.1 PCI Autoconfiguration....................................................................................68
3.3.2 PCI IDE Support............................................................................................68
3.4 System Management BIOS (SMBIOS) ........................................................................69
3.5 Legacy USB Support....................................................................................................69
3.6 BIOS Updates..............................................................................................................70
3.6.1 Language Support.........................................................................................70
3.6.2 Custom Splash Screen..................................................................................70
3.7 Boot Options ................................................................................................................71
3.7.1 CD-ROM Boot ...............................................................................................71
3.7.2 Network Boot.................................................................................................71
3.7.3 Booting Without Attached Devices................................................................71
3.7.4 Changing the Default Boot Device During POST..........................................71
3.8 Adjusting Boot Speed...................................................................................................72
3.8.1 Peripheral Selection and Configuration.........................................................72
3.8.2 BIOS Boot Optimizations...............................................................................72
3.9 BIOS Security Features ...............................................................................................73
4Error Messages and Beep Codes
4.1 Speaker .......................................................................................................................75
4.2 BIOS Beep Codes........................................................................................................75
4.3 BIOS Error Messages..................................................................................................75
4.4 Port 80h POST Codes .................................................................................................76

Contents
vii
Figures
1. Board Components......................................................................................................12
2. Block Diagram..............................................................................................................14
3. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......27
4. LAN Connector LED Locations....................................................................................28
5. Location of the Standby Power Indicator LED .............................................................35
6. Back Panel Connectors................................................................................................43
7. Component-side Connectors .......................................................................................44
8. Connection Diagram for Front Panel Connector..........................................................49
9. Connection Diagram for Front Panel USB Connectors................................................50
10. Location of the Jumper Block.......................................................................................51
11. Board Dimensions........................................................................................................52
12. I/O Shield Dimensions..................................................................................................53
13. Processor Heatsink for Omni-directional Airflow..........................................................56
14. Localized High Temperature Zones.............................................................................57
Tables
1. Feature Summary ........................................................................................................10
2. Manufacturing Options.................................................................................................11
3. Board Components Shown in Figure 1........................................................................13
4. Supported Memory Configurations ..............................................................................16
5. LAN Connector LED States .........................................................................................28
6. Effects of Pressing the Power Switch ..........................................................................30
7. Power States and Targeted System Power.................................................................31
8. Wake-up Devices and Events......................................................................................31
9. System Memory Map ...................................................................................................37
10. DMA Channels.............................................................................................................38
11. I/O Map ........................................................................................................................39
12. Interrupts......................................................................................................................40
13. PCI Configuration Space Map......................................................................................41
14. PCI Interrupt Routing Map ...........................................................................................41
15. Back Panel Connectors Shown in Figure 6..................................................................43
16. Component-side Connectors Shown in Figure 7 .........................................................45
17. Front Panel Audio Connector.......................................................................................45
18. Chassis Intrusion Connector........................................................................................46
19. Serial ATA Connectors.................................................................................................46
20. Processor Fan Connector............................................................................................46
21. Chassis Fan Connectors..............................................................................................46
22. Main Power Connector.................................................................................................47
23. ATX12V Power Connector...........................................................................................47
24. Auxiliary Front Panel Power/Sleep LED Connector.....................................................48
25. Front Panel Connector.................................................................................................48
26. States for a One-Color Power LED..............................................................................49
27. States for a Two-Color Power LED..............................................................................49
28. BIOS Setup Configuration Jumper Settings.................................................................51
29. DC Loading Characteristics .........................................................................................54
30. Fan Connector Current Capability................................................................................55
31. Thermal Considerations for Components ....................................................................58

Intel Desktop Board D102GGC2 Technical Product Specification
viii
32. Environmental Specifications.......................................................................................59
33. Safety Regulations.......................................................................................................60
34. Lead-Free Board Markings ..........................................................................................64
35. EMC Regulations.........................................................................................................65
36. Product Certification Markings.....................................................................................66
37. BIOS Setup Program Menu Bar...................................................................................68
38. BIOS Setup Program Function Keys............................................................................68
39. Boot Device Menu Options ..........................................................................................71
40. Supervisor and User Password Functions...................................................................73
41. Beep Codes .................................................................................................................75
42. BIOS Error Messages..................................................................................................75
43. Port 80h POST Code Ranges......................................................................................76
44. Port 80h POST Codes .................................................................................................77
45. Typical Port 80h POST Sequence...............................................................................80

9
1 Product Description
What This Chapter Contains
1.1 Overview......................................................................................................................10
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 ATI Radeon* Xpress 200 Chipset................................................................................17
1.6 PCI Express* Connectors ............................................................................................24
1.7 Legacy I/O Controller...................................................................................................24
1.8 High Definition Audio Subsystem.................................................................................26
1.9 LAN Subsystem ...........................................................................................................28
1.10 Hardware Management Subsystem.............................................................................29
1.11 Power Management.....................................................................................................29

Intel Desktop Board D102GGC2 Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor microATX (9.60 inches by 8.60 inches [243.84 millimeters by 218.44 millimeters])
Processor Support for the following:
•Intel®Pentium®D processor in an LGA775 socket with an 800 or 533 MHz
system bus
•Intel®Pentium®4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
•Intel®Celeron®D processor in an LGA775 socket with a 533 MHz system bus
Memory •Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 533 MHz and DDR2 400 MHz DIMMs
•Support for up to 2 GB of system memory
Chipset •ATI Radeon* Xpress 200 Northbridge
•ATI IXP 450 Southbridge
•4 Mbit Firmware Hub (FWH)
Video ATI Radeon X300 integrated graphics
Audio High Definition Audio subsystem using the Realtek ALC883 audio codec
Legacy I/O Control SMSC SCH5017 Legacy I/O controller for hardware management, diskette drive,
serial, parallel, and PS/2* ports
USB Support for USB 2.0 devices
Peripheral
Interfaces
•Eight USB ports
•One serial port
•One parallel port
•Four Serial ATA interfaces
•Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support
•One diskette drive interface
•PS/2 keyboard and mouse ports
LAN Support 10/100 Mbits/sec LAN subsystem using the Realtek 8101L LAN adapter device
BIOS Intel®BIOS resident in the 4 Mbit FWH
Expansion
Capabilities
•Two PCI Conventional* bus connectors
•One PCI Express* x1 bus add-in card connector
•One PCI Express x16 bus add-in card connector
Instantly Available
PC Technology
•Support for PCI Local Bus Specification Revision 2.2
•Support for PCI Express Revision 1.0a
•Suspend to RAM support
•Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Hardware Monitor
Subsystem
(controlled by SMSC
SCH5017 I/O
controller)
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Three fan connectors
•Three fan sense inputs used to monitor fan activity
•Fan speed control

Product Description
11
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2. Manufacturing Options
SATA RAID Support for RAID 0 (data striping) and RAID 1 (data mirroring) on the SATA ports
For information about Refer to
Available configurations for the Desktop Board D102GGC2 Section 1.1.4, page 14

Intel Desktop Board D102GGC2 Technical Product Specification
12
1.1.3 Board Layout
Figure 1 shows the location of the major components.
OM18247
A
T RS
DC E B
H
I
J
K
L
F
G
Y
BB
Z
AA
U
V
W
X
O N MPQ
DD
CC
Figure 1. Board Components
Table 3 lists the components identified in Figure 1.

Product Description
13
Table 3. Board Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Front panel audio connector
B Audio codec
C PCI Express x16 add-in card connector
D Ethernet device
E Back panel connectors
F +12V power connector (ATX12V)
G Rear chassis fan connector
H LGA775 processor socket
I ATI Radeon Xpress 200 Northbridge
J DIMM Channel A sockets [2]
K Processor fan connector
L Chassis intrusion connector
M Legacy I/O controller
N Main power connector
O Diskette drive connector
P Parallel ATE IDE connectors [2]
Q Battery
R Front chassis fan connector
S Serial ATA connectors [4]
T Auxiliary front panel power LED connector
U Front panel connector
V 4 Mbit Firmware Hub (FWH)
W IXP 450 Southbridge
X Speaker
Y Front panel USB connector
Z BIOS Setup configuration jumper block
AA PCI Conventional bus add-in card connectors [2]
BB Front panel USB connector
CC PCI Express x1 bus add-in card connector
DD Standby power indicator LED

Intel Desktop Board D102GGC2 Technical Product Specification
14
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
ATI IXP 450
Southbridge
ATI Radeon Xpress 200
Northbridge
4 Mbit
Firmware Hub
(FWH)
System Bus
(800/533 MHz)
LGA775
Processor Socket
Parallel ATA
IDE Connectors (2)
Diskette Drive
Connector
SMSC
SCH5017
Legacy
I/O
Controller PS/2 Keyboard
PS/2 Mouse
Parallel Port
Serial Port
Parallel ATA
IDE Interface
LPC Bus
OM18294
Realtek
ALC883
Audio
Codec Mic In [Front Panel]
Mic In or Center/LFE Out
Line Out [Front Panel]
LAN
Connector
Realtek
8101L
LAN Controller
= connector or socket
PCI Bus
SMBus
High Definition Audio Link
USB
Memory Bus
SMBus
PCI Slot 1
PCI Slot 2 Line In or Rear Left/Right Out
Line Out or Front Left/Right Out
Serial ATA IDE
Connectors (4)
Serial ATA
IDE Interface
VGA
Port Display Interface
Channel A
DIMMs (2)
Back Panel/
Front Panel
USB Ports
PCI Express x4
Interface
PCI Bus
PCI Express x1 Slot 1 PCI Express x1 Interface
Figure 2. Block Diagram

Product Description
15
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D102GGC2 under
“Desktop Board Products” or “Desktop
Board Support”
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
Available configurations for the Desktop
Board D102GGC2 http://developer.intel.com/design/motherbd/gc2/gc2_available.htm
Processor data sheets http://www.intel.com/products/index.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
1.3 Processor
The board is designed to support the following processors:
•Intel PentiumD processor in an LGA775 processor socket with an 800 or 533 MHz system bus
•Intel Pentium4 processor in an LGA775 processor socket with an 800 or 533 MHz system bus
•Intel Celeron D processor in an LGA775 processor socket with a 533 MHz system bus
For information about… Refer to:
Supported processors for the
D102GGC2 board http://www.intel.com/design/motherbd/gc2/gc2_documentation.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
# INTEGRATOR’S NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.1, page 47

Intel Desktop Board D102GGC2 Technical Product Specification
16
1.4 System Memory
The board has two 240-pin DIMM sockets and supports the following memory features:
•1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
•Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
•2 GB maximum total system memory.
•Minimum total system memory: 128 MB
•Non-ECC DIMMs
•Serial Presence Detect
•DDR2 533 or DDR2 400 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly
configure the memory settings, but performance and reliability may be impacted or the DIMMs
may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity Configuration SDRAM Density SDRAM Organization Front-side/Back-side Number of SDRAM Devices
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).

Product Description
17
1.5 ATI Radeon*Xpress 200 Chipset
The ATI Radeon Xpress 200 chipset consists of the following devices:
•ATI Radeon Xpress 200 Northbridge
•IXP 450 Southbridge
The ATI Radeon Xpress 200 Northbridge is a centralized controller for the system bus, the memory
bus, and the PCI Express bus. The ATI Radeon Xpress 200 Northbridge also provides integrated
graphics capabilities supporting 3D, 2D and display capabilities. The IXP 450 is a centralized
controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.
For information about Refer to
The ATI Radeon Xpress 200 Northbridge http://www.ati.com/
The IXP 450 Southbridge http://www.ati.com/
Resources used by the chipset Chapter 2
1.5.1 Graphics Subsystem
The board contains two separate, mutually exclusive graphics options. Either the integrated
graphics processor (based on the ATI Radeon X300 core contained within the ATI Radeon
Xpress 200 Northbridge) is used, or a PCI Express x16 add-in card can be used.
1.5.2 Firmware Hub (FWH)
The Firmware Hub provides the nonvolatile storage of the Intel BIOS.
1.5.3 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The IXP 450 Southbridge provides the USB controller for all ports. The port arrangement is as
follows:
•Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
•Four ports are routed to two separate front panel USB connectors
 NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 6, page 43
The location of the front panel USB connectors Figure 7, page 44

Intel Desktop Board D102GGC2 Technical Product Specification
18
1.5.4 IDE Support
The board provides six IDE interface connectors:
•Two parallel ATA IDE connector that supports two devices
•Four serial ATA IDE connectors that support one device per connector
1.5.4.1 Parallel ATE IDE Interface
The IXP 450’s Parallel ATA IDE controller has two bus-mastering Parallel ATA IDE interfaces.
The Parallel ATA IDE interfaces support the following modes:
•Programmed I/O (PIO): processor controls data transfer.
•8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
•Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
•ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
•ATA-100: DMA protocol on IDE bus allows host and target throttling. The IXP 450’s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
•ATA-133: DMA protocol on IDE bus allows host and target throttling. The IXP 450’s
ATA-133 logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer
rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
For information about Refer to
The location of the Parallel ATA IDE connectors Figure 7, page 44

Product Description
19
1.5.4.2 Serial ATA Interfaces
The IXP 450’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows* XP and Windows 2000 operating systems.
 NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 7, page 44
1.5.4.3 Serial ATA RAID (Optional)
As a manufacturing option, the board’s Serial ATA controller supports the following RAID
(Redundant Array of Independent Drives) levels:
•RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical
drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus
increasing the throughput. The Serial ATA controller allows for more than two drives to be
used in a RAID 0 configuration.
•RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on
separate disk drives. Level 1 provides the highest data reliability because two complete copies
of all information are maintained. The Serial ATA controller allows for two or four drives to
be used in a RAID 1 configuration.

Intel Desktop Board D102GGC2 Technical Product Specification
20
1.5.5 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ±13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one. Figure 1 on page 12 shows the location of the battery.
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled
where possible. Disposal of used batteries must be in accordance with local environmental
regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées
doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit
respecter les réglementations locales en vigueur en matière de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt
genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende
miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i
henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de
lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista.
Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch
denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden.
Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.