iWare iW-RainboW-G40M Installation manual

i.MX 8M Plus OSM LGA Module Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
REL0.1
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iW-RainboW-G40M
i.MX 8M Plus Quad/QuadLite/Dual
OSM LGA Module
Hardware User Guide
DRAFT VERSION SUBJECT TO CHANGE

i.MX 8M Plus OSM LGA Module Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
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Document Revision History
Document Number
iW-PRGLZ-UM-01-R1.0-REL0.1-Hardware
Revision
Date
Description
0.1
6th Dec 2021
Draft Release Version
PROPRIETARY NOTICE: This document contains proprietary material for the sole use of the intended recipient(s). Do
not read this document if you are not the intended recipient. Any review, use, distribution or disclosure by others is
strictly prohibited. If you are not the intended recipient (or authorized to receive for the recipient), you are hereby
notified that any disclosure, copying distribution or use of any of the information contained within this document is
STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.”

i.MX 8M Plus OSM LGA Module Hardware User Guide
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Disclaimer
iWave Systems reserves the right to change details in this publication including but not limited to any Product
specification without notice.
No warranty of accuracy is given concerning the contents of the information contained in this publication. To the
extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by iWave
Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or
inaccuracies in this document.
SoC and other major components used in this product may have several silicon errata associated with it. Under no
circumstances, iWave Systems shall be liable for the silicon errata and associated issues.
Trademarks
All registered trademarks, product names mentioned in this publication are the property of their respective owners
and used for identification purposes only.
Certification
iWave Systems Technologies Pvt. Ltd. is an ISO 9001:2015 Certified Company.
Warranty & RMA
Warranty support for Hardware: 1 Year from iWave or iWave's EMS partner.
For warranty terms, go through the below web link,
http://www.iwavesystems.com/support/warranty.html
For Return Merchandise Authorization (RMA), go through the below web link,
http://www.iwavesystems.com/support/rma.html
Technical Support
iWave Systems technical support team is committed to provide the best possible support for our customers so that
our Hardware and Software can be easily migrated and used.
For assistance, contact our Technical Support team at,
Email : [e-mail]
Website : www.iwavesystems.com
Address : iWave Systems Technologies Pvt. Ltd.
# 7/B, 29th Main, BTM Layout 2nd Stage,
Bengaluru, Karnataka,
India –560076

i.MX 8M Plus OSM LGA Module Hardware User Guide
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Table of Contents
1. INTRODUCTION ............................................................................................................................................7
1.1 Purpose .............................................................................................................................................................7
1.2 OSM LGA Module Overview .............................................................................................................................7
1.3 List of Acronyms................................................................................................................................................7
1.4 Terminology Description...................................................................................................................................9
1.5 References ........................................................................................................................................................9
1.6 Important Note ...............................................................................................................................................10
2. ARCHITECTURE AND DESIGN....................................................................................................................... 11
2.1 i.MX 8M Plus OSM LGA Module Block Diagram .............................................................................................11
2.2 i.MX 8M Plus SOM Features...........................................................................................................................12
2.3 i.MX 8M Plus SoC ............................................................................................................................................14
2.4 PCA9450C PMIC ..............................................................................................................................................15
2.5 Memory...........................................................................................................................................................15
2.5.1 LPDDR4 RAM...............................................................................................................................................15
2.5.2 eMMC Flash ................................................................................................................................................15
2.6 Network & Communiation..............................................................................................................................16
2.6.1 Wi-Fi and Bluetooth Interface.....................................................................................................................16
2.6.2 RTC Controller .............................................................................................................................................17
2.7 OSM BGA.........................................................................................................................................................18
2.7.1 RGMII Interface...........................................................................................................................................36
2.7.2 USB3.0 OTG Interface..................................................................................................................................38
2.7.3 USB3.0 Host Interface .................................................................................................................................39
2.7.4 USB 2.0 Host Interface ................................................................................................................................40
2.7.5 PCIe Interface ..............................................................................................................................................42
2.7.6 MIPI CSI Interface........................................................................................................................................43
2.7.7 HDMI TX Interface.......................................................................................................................................44
2.7.8 MIPI DSI/LVDS Display Interface .................................................................................................................45
2.7.9 Audio Interface............................................................................................................................................46
2.7.10 SPI Interface ................................................................................................................................................47
2.7.11 Data UART...................................................................................................................................................47
2.7.12 OSM GPIOs ..................................................................................................................................................48
2.7.13 CAN Interface ..............................................................................................................................................49
2.7.14 I2C Interface ................................................................................................................................................50
2.7.15 Control Signals ............................................................................................................................................50
2.7.16 Boot Select...................................................................................................................................................51
2.7.17 Power and GND...........................................................................................................................................51
2.8 Other Features................................................................................................................................................53
2.8.1 Programming Header..................................................................................................................................53
2.9 i.MX 8M Plus Pin Multiplexing on OSM BGA ..................................................................................................54
3. TECHNICAL SPECIFICATION.......................................................................................................................... 60

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3.1 Electrical Characteristics .................................................................................................................................60
3.1.1 Power Input Requirement ...........................................................................................................................60
3.1.2 Power Input Sequencing..............................................................................................................................61
3.1.3 Power Consumption ....................................................................................................................................62
3.2 Environmental Characteristics........................................................................................................................63
3.2.1 Environmental Specification........................................................................................................................63
3.2.2 Heat Sink/ Heat Spreader............................................................................................................................63
3.2.3 RoHS Compliance ........................................................................................................................................64
3.2.4 Electrostatic Discharge................................................................................................................................64
3.3 Mechanical Characteristics .............................................................................................................................65
3.3.1 i.MX 8M Plus OSM LGA Module Mechanical Dimensions...........................................................................65
4. ORDERING INFORMATION .......................................................................................................................... 66
5. APPENDIX................................................................................................................................................... 67
5.1 i.MX 8M Plus Development platform .............................................................................................................67

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List of Figures
FIGURE 1: I.MX 8M PLUS OSM LGA MODULE BLOCK DIAGRAM ................................................................................................................ 11
FIGURE 2: I.MX 8M PLUS BLOCK DIAGRAM ............................................................................................................................................... 14
FIGURE 3: WI-FI AND BLUETOOTH ANTENNA CONNECTOR ............................................................................................................................ 16
FIGURE 4: OSM LGA/BGA BALLS ........................................................................................................................................................... 18
FIGURE 5: POWER INPUT SEQUENCING ...................................................................................................................................................... 61
FIGURE 6: I.MX 8M PLUS OSM DEVELOPMENT PLATFORM.......................................................................................................................... 67
List of Tables
TABLE 1: ACRONYMS &ABBREVIATIONS ...................................................................................................................................................... 7
TABLE 2: TERMINOLOGY ........................................................................................................................................................................... 9
TABLE 3: OSM BGA PINOUTS ................................................................................................................................................................. 19
TABLE 4: PROGRAMMING HEADER PIN ASSIGNMENT .................................................................................................................................... 53
TABLE 6: I.MX 8M PLUS SOCIOMUX FOR OSM EDGE CONNECTOR INTERFACES ............................................................................................ 54
TABLE 7: POWER INPUT REQUIREMENT...................................................................................................................................................... 60
TABLE 8: POWER SEQUENCE TIMING......................................................................................................................................................... 61
TABLE 9: POWER CONSUMPTION.............................................................................................................................................................. 62
TABLE 10: ENVIRONMENTAL SPECIFICATION ............................................................................................................................................... 63
TABLE 11: ORDERABLE PRODUCT PART NUMBERS ....................................................................................................................................... 66

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1. INTRODUCTION
1.1 Purpose
This document is the Hardware User Guide for the NXP’s i.MX 8M Plus (Quad/QuadLite/Dual) Application processor
based OSM v1.0 specification compatible LGA module. This board is fully supported by iWave Systems Technologies
Pvt. Ltd. This Guide provides detailed information on the overall design and usage of the i.MX 8M Plus OSM Module
from a Hardware Systems perspective.
1.2 OSM LGA Module Overview
The OSM V1.0 (“Open Standard Modules™”) is a future proof and versatile standard for small size, low-cost embedded
computer modules. Combining the following key characteristics like Completely machine processible during soldering,
assembly and testing, Pre-tinned LGA package for direct PCB soldering without connector.
The OSM Module definition targeting application that requires low power, low costs, and high performance. The
Modules are used as building blocks for portable and stationary embedded systems. The core SoC and support circuits,
including DRAM, boot flash, power sequencing, SoC power supplies are concentrated on the Module. The Modules
are used with application specific Carrier Boards that implement other features such as audio CODECs, touch
controllers, wireless devices, etc. The modular approach allows scalability, fast time to market and upgradability while
still maintaining low costs, low power and small physical size.
NXP’s i.MX 8M Plus SoC based OSM LGA Module is rich with i.MX 8M Plus features along with on SOM LPDDR4, eMMC,
USB2.0 Hub, Wi-Fi & BT module and comes in compact 45mm x 45mm form factor (Size L). The Module PCB has 662
contacts which can be mounted as LGA/BGA on OSM carrier card.
1.3 List of Acronyms
The following acronyms will be used throughout this document.
Table 1: Acronyms & Abbreviations
Acronyms
Abbreviations
ARM
Advanced RISC Machine
BT
Bluetooth
CAN
Controller Area Network
CODEC
Coder-Decoder
CPU
Central Processing Unit
CSI
Camera Serial Interface
CTS
Clear to Send
DP
Display Port
DRAM
Dynamic Random Access Memory
DSI
Display Serial Interface

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Acronyms
Abbreviations
eMMC
Enhanced Multi Media Card
EMS
Electronics manufacturing services
ESAI
Enhanced Serial Audio Interface
FLEXCAN
Flexible Control Area Network
FlexSPI
Flexible Serial Peripheral Interface
GB
Giga Byte
Gbps
Gigabits per sec
GPIO
General Purpose Input Output
GPU
Graphics Processing Unit
HDCP
High-bandwidth Digital Content Protection
HDMI
High-Definition Multimedia Interface
I2C
Inter-Integrated Circuit
I2S
Inter-Integrated Sound
IC
Integrated Circuit
JTAG
Joint Test Action Group
LPDDR4
Low Power Double Data Rate4
MHz
Mega Hertz
MIPI
Mobile Industry Processor Interface
MLB
Media Local Bus
OSM
Open Standard Module
OTG
On-The-Go
PCB
Printed Circuit Board
PCIe
Peripheral Component Interconnect express
PMIC
Power management integrated circuits
RAM
Random Access Memory
RGMI
Reduced gigabit media-independent interface
RoHS
Restriction of Hazardous Substances
RTC
Real Time Clock
RTS
Request to Send
SAI
Serial Audio Interface
SATA
Serial Advanced Technology Attachment
SD
Secure Digital
SDIO
Secure Digital Input Output
SoC
System on Chip
SOM
System On Module
SPDIF
The Sony/Philips Digital Interface
SPI
Serial Peripheral Interface
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
VPU
Video Processing Unit
Wi-Fi
Wireless Fidelity

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1.4 Terminology Description
In this document, wherever Signal Type is mentioned, below terminology is used.
Table 2: Terminology
Terminology
Description
I
Input Signal
O
Output Signal
IO
Bidirectional Input/output Signal
CMOS
Complementary Metal Oxide Semiconductor Signal
HCSL
High speed Current Steering Logic
LVDS
Low Voltage Differential Signal
HDMI
High-Definition Multimedia Interface Differential Signal
DP
Display Port Differential Signal
GBE
Gigabit Ethernet Signal
PCIe
PCIe differential pair signals
SATA
Serial Advanced Technology Attachment differential pair signals
USB HS
Universal Serial Bus High Speed differential pair signals
USB SS
Universal Serial Bus Super Speed differential pair signals
MIPI
Mobile Industry Processor Interface differential pair signals
OD
Open Drain Signal
OC
Open Collector Signal
Power
Power Pin
PU
Pull Up
PD
Pull Down
NA
Not Applicable
NC
Not Connected
Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes
the pull-ups or pull-downs implemented On-OSM SOM.
1.5 References
•IMX8MPXEC_Rev_x.pdf
•iMX_8M_Plus_RM_Revx.pdf
•OSM Specification V1.0

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1.6 Important Note
In this document, wherever i.MX 8M Plus SoC signal name is mentioned, it is followed as per below format for easy
understanding.
•If SoC pin doesn’t have multiplexing option or used for dedicated functionality then the signal name is
mentioned as functionality name.
“Functionality Name”
Example: ENET1_RGMII_TXC
In this signal, ENET1_RGMII_TXC pad is used for same functionality.
•If SoC pin selected as GPIO function, then the signal name is mentioned as
“Functionality Description (GPIO Number)”
Example: BCONFIG_0(GPIO1_05)
In this signal, BCONFIG_0 is the GPIO functionality and GPIO1_05 is the GPIO number.
Note: The above naming is not applicable for other signals which are not connected to SoC.