JETWAY MU03 Series User manual

MU03 Series
User’s Manual
NO.: G03-MU03-F
Revision: 1.0
Release date: July 5, 2022
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

iii
ENVIRONMENTAL SAFETY INSTRUCTION................................................................................... iv
USER’S NOTICE.................................................................................................................................... v
MANUAL REVISION INFORMATION................................................................................................ v
ITEM CHECKLIST..................................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD.........................................................................................1
1-2 SPECIFICATION.................................................................................................................... 2
1-3 LAYOUT DIAGRAM...............................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................................ 7
2-2 CONNECTORS,WAFERS AND HEADERS...................................................................... 11
2-2-1 CONNECTORS & WAFERS................................................................................. 11
2-2-2 HEADERS................................................................................................................ 15
2-2-3 MAXIMUM VOLTAGE & CURRENT LIMIT........................................................17
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................................ 18
3-2 BIOS MENU SCREEN...........................................................................................................19
3-3 FUNCTION KEYS...................................................................................................................20
3-4 GETTING HELP......................................................................................................................20
3-5 MEMU BARS...........................................................................................................................21
3-6 MAIN MENU............................................................................................................................ 22
3-7 ADVANCED MENU................................................................................................................23
3-8 CHIPSET MENU..................................................................................................................... 36
3-9 SECURITY MENU.................................................................................................................. 38
3-10 BOOT MENU...........................................................................................................................41
3-11 SAVE & EXIT MENU..............................................................................................................43
TABLE OF CONTENT

iv
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition July 5, 2022
Item Checklist
Motherboard
Cable(s)

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel®Elkhart Lake series SoC processor, with low power consumption
never denies high performance
Support 1* DDR4 3200MHz SO-DIMM, maximum capacity up to 16GB
Onboard 2* i225V 2.5GbE LAN port
Support 2* HDMI, 1* DP
Onboard 1* M.2 M-key slot, type-2260/2280 interface supports NVME
Onboard 1* M.2 E-key slot,type-2230 interface
Onboard 32GB eMMC (Option for MU03-03 & MU03-07 series)
Onboard TPM 2.0 (Option for MU03-07 series)
Support 1* SATAIII device
Support 2* USB 3.1(Gen.2) type-A ports, 2* USB 3.1(Gen.2) type-C ports, 3* USB
2.0 Ports
Support 1* RS232/RS422/RS485 COM Port
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
Solution for Digital Signage/Cloud Applications/IoT /Industrial Automation

2
1-2 Specification
Spec
Description
Design
NUC form factor; PCB size: 10.1 cm x 10.1 cm
Embedded CPU
Integrated with Intel®Elkhart Lake series CPU (TDP 10W)
*Note: CPU model varies from different IPC options. Please consult your
dealer for more information of onboard CPU.TDP varies depending on CPU.
Memory Slot
1* DDR4 SO-DIMM slot support 1* DDR4 3200MHz SDRAM up to
16GB
*Note: Memory clock supporting range is decided by specific CPU of the
model. For more memory compatibility information please consults your
local dealer.
Expansion Slot
M2E1:1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface)
Storage
SATA1:1* SATAIII 6Gb/s port
M2M1: 1* M.2 M-key (2260/2280, PCIe Gen.3 x2/SATA interface)
support NVME
Onboard 32GB eMMC (optional for MU03-03 & MU03-07)
LAN Chip
Integrated with 2* Intel i225V 2.5Gigabit LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000/2500Mbps Ethernet data transfer rate
Audio Chip
Realtek HD audio chip
BIOS
AMI Flash ROM
Rear I/O
1* 12V DC-in power Jack
2* HDMI port
1* Display Port
2* 2.5Gbps RJ-45 LAN port
1* USB 3.1(Gen.2) port
Front I/O
2* USB 3.1 (Gen.2) type-C port supporting USB only
1* USB 3.1 (Gen.2) port
1* USB 2.0port
1* Line-out/MIC combo
1* Front panel power switch (FP_SW)
Internal I/O
1* SATA HDD Power Out wafer

3
1* JW_FPB1(Backside) power wafer
1* CPUFANB1 (Backside) fan wafer
1* SMBUS header
1* 9-Pin USB 2.0/1.1 header for 2* USB 2.0/1.1 ports
1* RS232/422/485 serial port header
1* GPIO header (default GPIO/selectable by jumper )
TPM 2.0
Option for MU03-07 series
1-3 Layout Diagram
Rear IO Panel Diagram:
Front IO Panel Diagram:
12V DC-in
Power Jack
Display Port
HDMI Port
HDMI Port
USB 3.1 (Gen.2) Port
2.5Gbps RJ-45
LAN Ports
USB 3.1 (Gen.2) Port
USB 2.0 Port
Type-C
USB 3.1 (Gen.2)
Ports
Line-OUT/MIC
Combo Port
Power On/Off Button

4
Internal Diagram-Front Side:
12V DC-in
Power Jack
HDMI Port
RJ-45 LAN Port
Display Port
Over HDMI Port
COM1
Serial Port
Header
Top:USB2 .0 Port
Bottom:USB 3.1(Gen.2) Port
M.2 E-Key Slot
(M2E1)
Line_Out / MIC
Combo Port
SATAIII Port
USB 2.0 Port
Header
SATA HDD
Power-Out
Wafer
DDR4 SODIMM Slot
SMBUS Header
GPIO Port
Header
JPCOM1
AT_MODE
JBAT
M.2 M-Key Slot
(M2M1)
RJ-45 LAN Port
Over
USB 3.1(Gen.2) Port
JPCAS_80P
Front Panel
Power Switch
Type-C
USB 3.1 (Gen.2)
Ports

5
Internal Diagram-Back Side:
Intel CPU
CPUFANB1 Wafer
JW_FPB1
Wafer

6
Connectors
Connector
Name
DCIN1
12V DC–in System Power Jack
DP1_HDMI2
Top: Display Port Connector
Bottom: HDMI Connector
UL2
Top: 2.5Gbps RJ-45 LAN Port Connector
Bottom: USB 3.1 (Gen.2) Port Connector
HDMI1
HDMI Connector
LAN1
2.5Gbps RJ-45 LAN Port Connector
USB31
Top: USB 2.0 Port Connector
Bottom: USB 3.1 (Gen.2) Port Connector
AUDIO1
Line-Out/MIC Combo Connector
USBC1/USBC2
USB 3.1 (Gen.2) Type-C Port Connector
SATA1
SATAIII Port Connector
SATAPWR
SATA HDD Power out Wafer
JW_FPB1 (backside)
Front Panel Power Wafer
CPUFANB1(backside)
CPUFAN Wafer
Headers
Header
Name
Description
Pitch
SMBUS
SMBUS Header
5-pin Block
2.0mm
FP_USB21
USB 2.0 Port Header
9-pin Block
2.0mm
COM1
Serial Port Header
9-pin Block
2.0mm
GPIO
GPIO Header
10-pin Block
2.0mm

7
Jumper
Jumper
Name
Description
Pitch
AT_MODE
ATX Mode/ AT Mode Select
3-Pin Block
2.0mm
JPCAS_80P
Pin (1-2): Case Open Display Select
Pin (3-4): GPIO/80 Port Function Select
4-Pin Block
2.0mm
JPCOM1
COM1 Port Pin9 Function Select
4-Pin Block
2.0mm
JBAT
Pin (1-2): Clear RTC
Pin (3-4): Clear CMOS
Pin (5-6): ME Disabled
6-Pin Block
2.0mm
Chapter 2
Hardware Installation
2-1 Jumper Setting
AT_MODE (2-pin): ATX Mode &AT Mode Select (Pitch:2.0mm)
ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.User needs to restart the system for
the settings to take effect.
AT_MODE

8
Pin 1&2 of JPCAS_80P (4-pin): Case Open Display Select (Pitch 2.0mm)
Pin (1&2) short:When Case open function pin short to GND, the Case open function was
detected. When used, needs to enter BIOS and enable ‘Case Open Detect’function. In this
case if your case is removed, next time when you restart your computer, a message will be
displayed on screen to inform you of this.
Pin 3&4 of JPCAS_80P (4-pin): GPIO Header GPIO/80 Port Select (Pitch 2.0mm)
JPCAS_80P
JPCAS_80P

9
JPCOM1 (4-pin): COM1 Port Pin9 Function Select (Pitch:2.0mm)
Pin 1&2 of JBAT (6-pin): Clear RTC (Pitch:2.0mm)
JPCOM1
JBAT

10
Pin (3&4) of JBAT (6-pin): Clear CMOS RAM Settings (Pitch:2.0mm)
Pin 5&6 of JBAT (6-pin): ME Disabled (Pitch:2.0mm)
JBAT
JBAT

11
2-2 Connectors,Wafers and Headers
2-2-1 Connectors & Wafers
Rear IO Panel Diagram:
Front IO Panel Diagram:
12V DC-in
Power Jack
Display Port
HDMI Port
HDMI Port
USB 3.1 (Gen.2) Port
2.5Gbps RJ-45
LAN Ports
USB 3.1 (Gen.2) Port
USB 2.0 Port
Type-C
USB 3.1 (Gen.2)
Ports
Line-OUT/MIC
Combo Port
Power On/Off Button

12
Icon
Name
Function
Power Connector
12V DC–in system power connector
For user to connect compatible power adapter to
provide power supply for the system.
RJ-45 LAN Port
This connector is standard RJ-45 LAN jack for
Network connection.
USB 3.1(Gen.2) Port
To connect USB keyboard, mouse or other devices
compatible with USB 3.1(Gen.2) specification. Ports
support up to 5Gbps data transfer rate.
HDMI Port
To connect display device that support HDMI
specification.
Display Port
To the system to corresponding display device
with compatible display port cable.
Line-Out/MIC
Combo Connector
This connector can functions as audio Line-Out
jack and MIC jack with compatible cables &
devices.
USB 2.0 Port
To connect USB keyboard, mouse or other devices
compatible with USB 2.0 specification.
Type-C USB Port
Type-C USB3.1 (Gen.2) port supports USB device
connection.
Power Button
For user to power on/off the system.

13
SATA1 (7-pin Block): SATAIII Port connector
The board comes with a SATAIII port that supports 6GB/s transfer rate.
Pin No.
Definition
1
GND
2
TXP
3
TXN
4
GND
5
RXN
6
RXP
7
GND
SATAPWR (4-pin): SATA HDD Power-Out Wafer (Pitch:2.5mm)

14
JW_FPB1 (4-pin): Front Panel Wafer (Pitch:1.25mm)
(Backside)
CPUFANB1 (3-pin): CPUFAN Wafer (Pitch:1.25mm)
(Backside)

15
2-2-2 Headers
SMBUS (5-Pin): SM BUS Header (Pitch:2.0mm)
FP_USB21 (9-pin): USB 2.0 Port Header (Pitch:2.0mm)
Pin 1
VCC
-DATA
GND
+DATA
VCC
NC
C
-DATA
GND
+DATA
2
FP_USB21
SMBUS