JETWAY NU95 Series User manual

NU95 Series
User’s Manual
NO. G03-NU95-F
Revision: 1.0
Release date: December 4, 2020
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

iii
ENVIRONMENTAL SAFETY INSTRUCTION................................................................................... iv
USER’S NOTICE.................................................................................................................................... v
MANUAL REVISION INFORMATION................................................................................................ v
ITEM CHECKLIST..................................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD.........................................................................................1
1-2 SPECIFICATION.................................................................................................................... 2
1-3 LAYOUT DIAGRAM...............................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................................ 7
2-2 CONNECTORS, WAFERS AND HEADERS..................................................................... 9
2-2-1 CONNECTORS........................................................................................................9
2-2-2 WAFERS & HEADERS.......................................................................................... 13
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................................ 15
3-2 BIOS MENU SCREEN........................................................................................................... 16
3-3 FUNCTION KEYS...................................................................................................................17
3-4 GETTING HELP......................................................................................................................17
3-5 MEMU BARS...........................................................................................................................18
3-6 MAIN MENU............................................................................................................................ 19
3-7 ADVANCED MENU................................................................................................................20
3-8 CHIPSET MENU..................................................................................................................... 33
3-9 SECURITY MENU.................................................................................................................. 36
3-10 BOOT MENU........................................................................................................................... 39
3-11 SAVE & EXIT MENU..............................................................................................................40
TABLE OF CONTENT

iv
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition December 4, 2020
Item Checklist
Motherboard
Cable(s)

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel®10th Comet Lake i5-10210U Series MCP Processor, with low
power consumption never denies high performance
Support 2* DDR4 2666 MHz SO-DIMM, up to 64GB
Integrated with 2 *Intel Gigabit Ethernet LAN chip
1* M.2 E-key 2230 slot, PCIex1/USB2.0 interface with support for CNVi
1* M.2 M-key 2242 slot, SATA interface
1* SATAIII device
2* HDMI ports & 1* Display port, supports Triple Independent Display
1* Line-out/MIC combo
Support up to 4 * USB 3.2 Gen.2 port (External) & 2 * USB 2.0 port (Internal)
1 * COM port supports RS232/422/485
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
Solution for Digital Signage, Cloud Applications, IoT & Industrial Automation

2
1-2 Specification
Spec
Description
Design
NUC form factor; PCB size: 10.1 cm x 10.1 cm
Embedded CPU
Intel®10th Comet Lake series MCP CPU,I5-10210U QC, 1.6GHz,
15W
*Note:CPU model may vary from different IPC options. Please consult
your dealer for more information of onboard CPU.
Memory Slot
2*DDR4 SO-DIMM slot
Support 2* DDR4 2666MHz SO-DIMM up to 64GB
Expansion Slot
1* M.2 E-key,type-2230 slot supports CNVi (M2E)
*Note:M2E slot maximum current limit is 1A while using 3.3V.
Storage
1* SATAIII 6Gb/s port
1* M.2 M-key,type-2242 SATAIII interface slot (M2M)
*Note:M2Mslot maximum current limit is 1A while using 3.3V.
LAN Chip
Integrated with 1* Intel i211AT Gigabit Ethernet LAN chip & 1*
Intel i219-LM Gigabit PHY LAN chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip
Realtek ALC662-GR HD audio chip
BIOS
AMI 128MB Flash ROM
Rear Panel I/O
1* 12V~24V DC-in system power Jack
1* Display Port (PS:This function is converted from EDP to DP,
only display no audio output)
1* HDMI 2.0 port (Max Resolution: 4096×2304@60Hz)
1* HDMI 1.4 port (Max Resolution: 4096×2304@30Hz)
2* RJ-45 GbE LAN port
2* USB 3.2 (Gen.2) port
Front Panel I/O
1* Serial port (COM supports RS232/422/485 function)
2* USB 3.2 (Gen.2) port
1* Audio Line-Out & MIC combo jack

3
Internal I/O
1* SATA Power connector
1* CPU FAN wafer (on the backside)
1* JW_FP front panel header
1* GPIO header
1* 9-Pin USB 2.0/1.1 header for 2* USB 2.0/1.1 ports
*Note: Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and
higher USB speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB
controllers within platforms. However, legacy operating systems (OS) may not natively recognize
XHCI controllers. You might need to pre-install XHCI driver while desiring to install a non-XHCI OS
(ex.Windows* 7) on Intel platforms which do not include EHCI controllers. Please contact your
representative for more details.
1-3 Layout Diagram
Rear IO Panel Diagram:
Front IO Panel Diagram:
Line-OUT/MIC
Combo Port
RS232/422/485
Serial Port
USB 3.2(Gen.2) Ports
RJ-45 LAN Ports
Display Port
HDMI 2.0 Port
HDMI 1.4 Port
12V~24V DC-in
Power Jack
USB 3.2(Gen.2) Ports

4
Internal Diagram-Front Side:
M.2 M-Key Slot
(M2M)
SATA HDD
Power-Out
Connector
RJ-45 LAN Port
Over
USB 3.2(Gen.2) Port
RJ-45 LAN Port
Over
USB 3.2(Gen.2) Port
HDMI Ports
Display Ports
12V~24V DC-in
Power Jack
M.2 E-Key Slot
(M2E)
USB 2.0 Port Header
SATAIII Port
Serial Port
DDR4
SODIMM Slots
GPIO Header
Front Panel
Header
JPCOM
JP1
JBAT
Line_Out / MIC
Combo Port
USB 3.2(Gen.2)
Ports

5
Internal Diagram-Back Side:
Intel CPU
CPUFAN Wafer