Lanner HTCA-6600 User manual

Network Computing Platforms
HTCA-6600
User Manual
Rev 0.3 August 29th, 2016

Network Computing Platforms
Revision History
This document contains proprietary information of Lanner Electronics Inc. –and is not to be
disclosed or used except in accordance with applicable agreements.
Copyright © 2016. All Rights Reserved.
Copyright© 2015 Lanner Electronics Inc. All rights reserved. The information in this document
is proprietary and confidential to Lanner Electronics Inc. No part of this document may be
reproduced in any form or by any means or used to make any derivative work (such as
translation, transformation, or adaptation) without the express written consent of Lanner
Electronics Inc. Lanner Electronics Inc. reserves the right to revise this document and to make
changes in content from time to time without obligation on the part of Lanner Electronics Inc. to
provide notification of such revision or change.
The information in this document is furnished for informational use only, is subject to change
without notice, and should not be construed as a commitment by Lanner Electronics Inc. Lanner
Electronics Inc. assumes no responsibility or liability for any errors or inaccuracies that may
appear in this document or any software that may be provided in association with this document.
Rev Date Descriptions
0.1 2016/07/15 Preliminary
0.2 2016/08/04 Added hardware installation
0.3 2016/08/29 Updated block diagram

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Online Resources
The listed websites are links to the on-line product information and technical support.
Resource Website
Lanner www.lannerinc.com
Product
Resources
www.lannerinc.com/support/download-center
RMA http://eRMA.lannerinc.com
Acknowledgement
Intel, Pentium and Celeron are registered trademarks of Intel Corp.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
Compliances and Certification
CE Certification
This product has passed the CE test for environmental specifications. Test conditions for
passing included the equipment being operated within an industrial enclosure. In order to
protect the product from being damaged by ESD (Electrostatic Discharge) and EMI leakage,
we strongly recommend the use of CE-compliant industrial enclosure products.
FCC Class A Certification
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference in which case the user will be required to correct the interference
at his own expense.
EMC Notice
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if

Network Computing Platforms
not installed and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference in which case users will be required to correct the interference at
their own expense.
Safety Guidelines
zFollow these guidelines to ensure general safety:
zKeep the chassis area clear and dust-free before, during and after installation.
zDo not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie
or scarf and roll up your sleeves.
zWear safety glasses/goggles if you are working under any conditions that might be
hazardous to your eyes.
zDo not perform any action that creates a potential hazard to people or makes the
equipment unsafe.
zDisconnect all power by turning off the power and unplugging the power cord before
installing or removing a chassis or working near power supplies
zDo not work alone if potentially hazardous conditions exist.
zNever assume that power is disconnected from a circuit; always check the circuit.
LITHIUM BATTERY CAUTION:
Risk of explosion could occur if battery is replaced by an incorrect type. Please dispose of
used batteries according to the recycling instructions of your country.
zInstallation only by a trained electrician or only by an electrically trained person who knows
all the applied or related installation and device specifications..
zDo not carry the handle of power supplies when moving to other place.
zThe machine can only be used in a fixed location such as labs or computer facilities.
Operating Safety
zElectrical equipment generates heat. Ambient air temperature may not be adequate to
cool equipment to acceptable operating temperatures without adequate circulation. Be
sure that the room in which you choose to operate your system has adequate air
circulation.
zEnsure that the chassis cover is secure. The chassis design allows cooling air to circulate
effectively. An open chassis permits air leaks, which may interrupt and redirect the flow of
cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD
damage occurs when electronic components are improperly handled and can result in

Network Computing Platforms
complete or intermittent failures. Be sure to follow ESD-prevention procedures when removing
and replacing components to avoid these problems.
zWear an ESD-preventive wrist strap, ensuring that it makes good skin contact. If no wrist
strap is available, ground yourself by touching the metal part of the chassis.
zPeriodically check the resistance value of the antistatic strap, which should be between 1
and 10 megohms (Mohms).
Mounting Installation Environment Precaution
1. Elevated Operating Ambient - If installed in a closed or multi-unit rack assembly, the
operating ambient temperature of the rack environment may be greater than room ambient.
Therefore, consideration should be given to installing the equipment in an environment
compatible with the maximum ambient temperature (Tma) specified by the manufacturer.
2. Reduced Air Flow - Installation of the equipment in a rack should be such that the amount of
air flow required for safe operation of the equipment is not compromised.
3. Mechanical Loading - Mounting of the equipment in the rack should be such that a
hazardous condition is not achieved due to uneven mechanical loading.
4. Circuit Overloading - Consideration should be given to the connection of the equipment to
the supply circuit and the effect that overloading of the circuits might have on over-current
protection and supply wiring. Appropriate consideration of equipment nameplate ratings
should be used when addressing this concern.
5. Reliable Earthing - Reliable earthing of rack-mounted equipment should be maintained.
Particular attention should be given to supply connections other than direct connections to the
branch circuit (e.g. use of power strips).”
Consignes de sécurité
Suivez ces consignes pour assurer la securite generale :
zLaissez la zone du chassis propre et sans poussiere pendant et apres l’installation.
zNe portez pas de vetements amples ou de bijoux qui pourraient etre pris dans le chassis.
Attachez votre cravate ou echarpe et remontez vos manches.
zPortez des lunettes de securite pour proteger vosmyeux.
zN’effectuez aucune action qui pourrait creer un dangermpour d’autres ou rendre
l’equipement dangereux.
zCoupez completement l’alimentation en eteignant l’alimentation et en debranchant le
cordon d’alimentation avant d’installer ou de retirer un chassis ou de travailler a proximite
de sources d’alimentation.
zNe travaillez pas seul si des conditions dangereuses sont presentes.

Network Computing Platforms
zNe considerez jamais que l’alimentation est coupee d’un circuit, verifiez toujours le circuit.
Cet appareil genere, utilise et emet une energie radiofrequence et, s’il n’est pas installe et
utilise conformement aux instructions des fournisseurs de composants sans fil, il risque de
provoquer des interferences dans les communications radio.
Avertissement concernant la pile au lithium
zRisque d’explosion si la pile est remplacee par une autre d’un mauvais type.
zJetez les piles usagees conformement aux instructions.
zL’installation doit etre effectuee par un electricien forme ou une personne formee a
l’electricite connaissant toutes les specifications d’installation et d’appareil du produit.
zNe transportez pas l’unite en la tenant par le cable d’alimentation lorsque vous deplacez
l’appareil.
zLa machine ne peut etre utilisee qu’a un lieu fixe comme en laboratoire, salle d’ordinateurs
ou salle de classe.
Sécurité de fonctionnement
zL’equipement electrique genere de la chaleur. La temperature ambiante peut ne pas etre
adequate pour refroidir l’equipement a une temperature de fonctionnement acceptable
sans circulation adaptee. Verifiez que votre site propose une circulation d’air adequate.
zVerifiez que le couvercle du chassis est bien fixe. La conception du chassis permet a l’air
de refroidissement de bien circuler. Un chassis ouvert laisse l’air s’echapper, ce qui peut
interrompre et rediriger le flux d’air frais destine aux composants internes.
zLes decharges electrostatiques (ESD) peuvent endommager l’equipement et gener les
circuits electriques. Des degats d’ESD surviennent lorsque des composants electroniques
sont mal manipules et peuvent causer des pannes totales ou intermittentes. Suivez les
procedures de prevention d’ESD lors du retrait et du remplacement de composants.
- Portez un bracelet anti-ESD et veillez a ce qu’il soit bien au contact de la peau. Si aucun
bracelet n’est disponible, reliez votre corps a la terre en touchant la partie metallique du
chassis. Verifiez regulierement la valeur de resistance du bracelet antistatique, qui doit etre
comprise entre 1 et 10 megohms (Mohms).
Consignes de sécurité électrique
zAvant d’allumer l’appareil, reliez le cable de mise a la terre de l’equipement a la terre.
zUne bonne mise a la terre (connexion a la terre) est tres importante pour proteger l
equipement contre les effets nefastes du bruit externe et reduire les risques d’electrocution
en cas de foudre.
zPour desinstaller l’equipement, debranchez le cable de mise a la terre apres avoir eteint
l’appareil.

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zUn cable de mise a la terre est requis et la zone reliant les sections du conducteur doit
faire plus de 4 mm2 ou 10 AWG.
Procédure de mise à la terre pour source
d’alimentation CC Procédure de mise à la terre pour
source d’alimentation CC
• Desserrez la vis du terminal de mise a la terre.
• Branchez le cable de mise a la terre a la terre.
• L’appareil de protection pour la source d’alimentation
CC doit fournir 30 A de courant. Cet appareil de protection doit etre branche a la source
d’alimentation avant l’alimentation CC.

Network Computing Platforms
Table of Contents
Revision History ............................................................................................................2
Chapter 1: Introduction................................................................................................10
System Specification............................................................................................10
Ordering Information (TBD) ...............................................................................12
Package Contents (TBD) .....................................................................................12
Optional Accessories (TBD)................................................................................12
Chapter 2: System Overview.......................................................................................13
Mechanical Drawing............................................................................................13
Block Diagram.....................................................................................................14
Front I/Os.............................................................................................................15
Rear I/Os..............................................................................................................16
Chapter 3: Board Layout..............................................................................................17
Jumpers and Connectors on the Motherboard .....................................................17
Chapter 4: Hardware Setup..........................................................................................23
Accessing the CPU Blade(s)................................................................................23
Installing the CPU and Heatsink..........................................................................24
Installing the System Memory.............................................................................27
Installing an IPMI Card .......................................................................................27
Replacing Cooling Fans.......................................................................................28
Installing Disk Drives..........................................................................................29
Replacing Front Network I/O Blades & Switch Boards......................................30
Replacing Power Supply Units............................................................................31
Chapter 5: BIOS Setup (TBD).....................................................................................33
Main.......................................................................................................................34
Advanced ................................................................................................................35
Super IO Configuration................................................................................35
HW Monitor.................................................................................................39
Serial Port Console Redirection...................................................................40
COM Console Redirection Settings.............................................................41
CPU Configuration ......................................................................................46
SATA Configuration....................................................................................49
USB Configuration ......................................................................................53
LAN Boot Select..........................................................................................55
Chipset .................................................................................................................56
System Agent (SA) Configuration:..............................................................56
Memory Configuration ................................................................................57
PCH-IO Configuration.................................................................................58

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Security ..................................................................................................................60
Boot.......................................................................................................................61
Save & Exit ..............................................................................................................66
Appendix A: Programming Watchdog Timer ..............................................................71
Appendix B: Setting up Console Redirection..............................................................72
Appendix C: Programming Generation 3 LAN Bypass ..............................................73
Appendix D: Programming the LCM..........................................................................75
Appendix E: Terms and Conditions.............................................................................80

Network Computing Platforms
Chapter 1: Introduction
Thank you for choosing HTCA-6600. The network appliance is designed for high-availability
telecommunication application. Built in 6U form factor chassis, HTCA-6600 supports up to 6
Intel x86 motherboards and 6 swappable, front-panel I/O blades. The blades can be
configured to max. 5 line cards and/or max. 2 x switches. Each I/O blade supports 4 x GbE
LAN + 16 x 10GbE ports or 32 x 10GbE ports. HTCA-6600 also integrates switch fabric for
enhanced communications between motherboards.
Internally, each motherboard of HTCA-6600 is empowered by 2 x Intel Xeon E5-2600 series
v3/v4 CPUs and 16 x DDR4 R-DIMMs. Storage wise, each motherboard supports 1 x SATA
3.5” disk drive bay, therefore, there will be a total of 6 HDD/SSD externally accessible drive
bay for HTCA-6600. As designed for telecommunication application, HTCA-6600 is NEBS
compliant.
Here is the summary of the key features:
z2 x Intel Xeon E5-2600 series v3/v4 CPUs for each motherboard
zPCH: Intel® C612
z16 x 288-pin DIMM DDR4 up to 2,133MHz registered DIMM sockets on each
motherboard
zDual 2011pin-R3 LGAsockets
z6 x externally accessible SATA 3.5” HDD/SSD drive bays
zEthernet: 6 swappable I/O blades on front panel, each supporting 4 x GbE + 16 x 10GbE
or 32 x 10GbE networking ports
zEthernet controller: Intel XL710
zSwitch fabric: Broadcom Trident-II Switch BCM56854
zForm factor: 6U rackmount supporting 6 x motherboards
Please refer to the following chart for a detailed description of the system's specifications.
System Specification
Processor Options 2 x Intel Haswell EP E5-2600 series v3/v4 for
each motherboard
PCH Intel C612
Socket Dual 2011pin-R3 LGA sockets
CPU TDP Approximately 135W
Super I/O NCT6776F

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System Bus Intel QuickPath Interconnect up to 9.6GT/s link
speeds
BIOS Features AMI SPI Flash BIOS
System Memory 16 x 288-pin DIMM DDR4 up to 2,133MHz
registered DIMM sockets (each CPU
supports 8 DIMMs)
Supports up to 32GB each DIMM
USB 1 x USB 2.0 Type-A port
Storage 6 x 3.5” SATA 6.0Gb/s removable
hot-swappable drive bays
Interface 6 swappable I/O blades on the front.
Each blade supports 4 x GbE + 16 x 10GbE or
32 x 10GbE networking ports
Controller Intel XL710
Management Optional with LOM port for IPMI
Console 1 x RJ-45 console port
LOM 1 x LOM port
Networking
IPMI OPMA socket to support IPMI
Switch fabric Broadcom Trident-II Switch BCM56854
Speed 10Gbps per port, 1Gbps per port
Switch Node
Interface Up to 16 x SFP+, 4 x GbE RJ45
Fan 5 x Cooling fans per CPU blade
LCM 1x character type LCM
LED POWER/STATUS/HDD
Display
Keypad 4x Keypads
PCI (Express) Interface 6x PCI-Express Gen3 x8 (To front side module)
from each MB, max 8x PCI-Express Gen3x8
Each MB 1x PCI-Express Gen3 x8 Slot
Operating Systems Requirements TBD
Buttons 1 x Reset Button
1 x ESD Jack
Thermal CPU heatsink with fan duct
Form Factor 6U rackmount
Housing SPGC
Dimensions 438 x 265.9 x 685.8 mm
Physical
Characteristics
Weight 55kg

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Mounting
Options
Rackmount
Operating
Temperature
0℃~40°C
Non-operating
Temperature
-20℃~70℃(TBD)
Environment
Ambient
Humidity
5 to 95% (non-condensing)
Input AC 85~264V
DC -36~-72V
Power
Power supply AC 1200 watt N+1 Redundant /each
DC 1010 watt N+1 Redundant /each
EMC CE/FCC Class A/UL
Green product RoHS
Certifications
Ordering Information (TBD)
Package Contents (TBD)
Please unpack your package carefully and inspect all the following items
Note:If you should find any components missing or damaged, please contact your
dealer immediately for assistance
Optional Accessories (TBD)

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Chapter 2: System Overview
Mechanical Drawing
Unit: mm

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Block Diagram

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Front I/Os
F1 LCM LCM with 4 x keypads
F2 Removable HDD/SSD
Trays
6 x 3.5” SATA HDD/SSD removable trays
F3 Console 1 x RJ-45 console port
F4 LOM 1 x RJ-45 LOM port
F5 USB 1 x USB 2.0 Type-A port
F6 Switch Blade Max. 2 x Switch Boards (swappable)
F7 LAN I/O Blades Max. 5 LAN I/O Blades (swappable)
F1
F2
F3
F4
F5
F6
F7

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Rear I/Os
R1 CPU Blades 6 x Swappable CPU blades
R2 Fans 5 x Cooling fans per CPU blade
R3 Power supply 5 x redundant power supply units
R1
R2
R3

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Chapter 3: Board Layout
Jumpers and Connectors on the Motherboard
JFAN1-5
ATX2 ATX3
DDR
JRISER1
CF1
J25
MGT1
JSPIROM
JTPM1
JSDO1
USB1
JSATA2
J26 & J28
JOPMA1
J27
CONN1
CONN2
ATX1&4
J80PORT1
OPEN1
CONN3

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MGT1: 2x6 pin header for RJ-45 LAN management port
Pin Description Pin Description
1 MGT2_MDIP_0 2 MGT2_MDIN_0
3 MGT2_MDIP_1 4 MGT2_MDIN_1
5 MGT2_MDIP_2 6 MGT2_MDIN_2
7 MGT2_MDIP_3 8 MGT2_MDIN_3
9 MGT_LAN2_100# 10 MGT_LAN2_ACT#
11 MGT_LAN2_1G# 12 P3V3_AUX
ATX1~ATX4: four 8-pin ATX power connectors
SATA1: 7-pin SATA signal connector for SATA storage device
Pin Description
1 GND
2 TX_P
3 TX_M
Pin Description
1 GND
2 +12V
3 GND
4 +12V
5 GND
6 +12V
7 GND
8 +12V
MGT1 11
122
1

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4 GND
5 RX_M
6 RX_P
7 GND
FAN1~5: 5-pin FAN connectors
Pin Description
1 Ground
2 12V
3 RPM Sense
4 RPM Sense
5 PWM Status
SW2: Reset Switch
Pin Description
1-2 GND
3-4 FP_RST_SEL
SW1: PSON power switch for debug.
Pin Description
1-2 GND
3-4 FP_SWIN_R
CONN2: PSON power switch
Pin Description
1 GND
2 FP_SWIN_R

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USB1: 2x5-pin internal USB pin header
Pin Description Pin Description
1 USB_VCC 2 USB_VCC
3 USBD0- 4 USBD1-
5 USBD0+ 6 USBD1+
7 Ground 8 Ground
9 USB Port#1Ground 10 USB Port#2 Ground
OPMA1: OPMA socket for IPMI card.
2 10
9
1 USB1
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