Lantronix Open-Q 865 User manual

Open-Q™ 865 Development Kit
Quick Start Guide
Your use of this document is subject to and governed by those terms and conditions in the LICENSE AND PURCHASE TERMS AND CONDITIONS FOR INTRINSYC DEVELOPMENT PLATFORM KITS, which you or the legal entity you represent, as the case may be, accept-
ed and agreed to when purchasing a Development Kit from Intrinsyc Technologies Corporation (“Agreement”). You may use this document, which shall be considered part of the defined term “Documentation” for purposes of the Agreement, solely in support of your permitted use of
the Development Kit under the Agreement. Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors, which they can withhold, condition or delay in its sole discretion. Lantronix is a
trademark of Lantronix, Inc., registered in the United States and other countries. Intrinsyc is a trademark of Intrinsyc Technologies Corporation, registered in Canada and other countries. Qualcomm® is a trademark of Qualcomm® Incorporated, registered in the United States and other
countries. Other product and brand names used herein may be trademarks or registered trademarks of their respective owners.
Package Contents
1. Open-Q 865 Carrier Board compable with Open-Q 865 family of
System-on-Modules (SOM)
2. AC Power Adapter (not shown)
3. CPU Heatsink (not shown)
4. ST Micro Sensor Board (not shown)
SOM SOLD SEPARATELY
1. 12V DC power jack
2. Power source switch (DC/Ba)
3. Baery connector
4. USB 3.0 Type-A Connector
5. Power buon
6. Volume +
7. Volume - / Reset buon
8. General Purpose Buon
9. Audio Headset Jack
10. USB 3.0 Type-C connector
11. USB debug UART Micro B
12. Debug UART Header
13. WLAN/BT Channel 0 Antenna (PCB
trace)
14. Audio I/O expansion header
15. MIPI Camera 3 Connector
16. Coin Cell Baery Holder
17. Power Header
18. MIPI Camera 2 Connector
19. VPH_PWR current sense header
20. MIPI Camera 1 Connector
21. Sensor expansion header
22. System conguraon switches
23. SOM current sense header
24. Micro SD socket*
25. Open-Q LCD Touch Panel (Sold Sepa-
rately)
26. WLAN Channel 1 Antenna (PCB trace)
27. Digital I/O connector
28. SIM Card connector*
29. Audio Output expansion header
30. M.2 PCIe Socket (B-key) *
31. Audio Input expansion header
32. WLAN Channel 1 U.FL Antenna Con-
nector
33. WLAN/BT Channel 0 U.FL Antenna
Connector
34. Qualcomm System-on-Chip (SoC)
with PoP DDR memory on top
35. Open-Q System on Module (Sold
separately)
* On Boom side
4
12
Specifications are subject to change - 895-0047-00 Rev. B
14
22
10 11
20
18
13
32
2125 24
27
29
31 15
3
33
26
35
16
17
23
5
34
6
7
8
9
19
28
30
12

Open-Q™ 865 Development Kit
Quick Start Guide
Specifications are subject to change - 895-0047-00 Rev. B
SOM Installation and Development Kit Setup
CAUTION: The SOM and Dev Kit are susceptible to damage from
static discharge.
1. At a static-safe workstation, remove the development kit board and the SOM
carefully from their antistatic bags. Do not apply power until after following the
steps below to install the SOM, connect the antenna cables, and install the heatsink.
2. SOM Installation: To prevent damage, be gentle while inserting the SOM onto the
carrier board. Ensure that the three board-to-board connectors are properly aligned
between the SOM and carrier board before applying any force. Then apply vertical
force only along both long edges of the SOM above the board-to-board connectors.
Force should be applied on the indicated locations (see figure below) until the SOM
is fully seated on the carrier board connectors. For further information and removal
instructions refer to the Development Kit User Guide document.
3. Antenna Connection: After the
SOM is installed onto the carrier
board, connect the two WLAN/BT
antenna cables (32/33) to the SOM
as shown on page 1. Gently align
the U.FL cable connectors over top
of the corresponding SOM
connectors and then apply gentle
vertical pressure on top until you feel
them click into place.
4. Heatsink Installation: A stick-on
heatsink for the Qualcomm SoC is included with the development kit. It is safe to
operate the SOM without the heatsink installed but the processor performance may
be limited. For better thermal performance, install the heatsink on top of the SoC by
removing the adhesive covering and sticking the heatsink on top of the SoC (34).
5. Power Up: Connect the AC Power Adapter to the 12V DC Jack (1), connect a PC
with serial console program to the USB debug UART connector (11), and then press
and hold the power button (5) until you see the boot indicator LED light (~3
seconds).
6. Further Information: Refer to the SW release notes and Development Kit User
Guide for your specific SOM and SW package for more information about supported
features, connecting peripherals, and how to log in.
Development Kit Support
Documentation and software
To access the documentation (schematics, user guides, datasheets, programming
guides, tech notes…), platform BSP software and much more, please register at:
Technical Support
Should you require more information or assistance, you can contact us at:
https://www.lantronix.com/support
Lantronix also provides technical information and videos on Qualcomm processors
at:
https://www.lantronix.com/resources
Should you require additional technical support for your Development Kit you can
easily purchase a technical support package from the Lantronix store:
http://lantronix.com/embedded-compute-support-packages
Thank you for purchasing an Open-Q 865 Development Kit
The Lantronix Team
http://tech.intrinsyc.com
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