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Lecip LV-700 User manual

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Lecip Arcontia confidential (V1.00 2019-05-13)
USER MANUAL FOR LV-700
Lecip Arcontia confidential (V1.00 2019-05-13)
1. Technical Overview of LV-700
•Software Platform
oLinux Kernel 4.1.38
oQT 5.7.1 Application Frame work
oPython 3.5.2
•NXP Application processor
oARM Cortex-9 single core 32-bit
o1 GHz
oAutomotive grade
•System
o1024 MB DDR3L SDRAM
o2x 36Mx16 x 8 banks
o4GB e-MMC flash
•External Interfaces
oEthernet 100Base-T2 with embedded EUI-48 MAC Address
o2 x RS 232
oRS-485
o2 x Isolated Bipolar Outputs (max. 200mA)
oUnique ID of the Unit Holder
•User Interface
o5.7" LCD 24 LVDS VGA (680x480) with capacitive touch
oMon audio CODEC Speaker Driver
o4 x Triple color Indicator LEDs
•4G Communication Interface
oTelit LE910 Cat. 1
oOcta-Band Cellular Embedded Antenna
(700/750/850/900/1800/1900/2100/2700 MHz)
•Bluetooth
oV4.2 BR/EDR-BLE
oPCM for Audio Data
•WLAN
o2.4GHz Radio IEEE 802.11b, 802.11g, 802.11n (single stream)
oSimultaneous BT/WLAN reception with a single antenna
•Development/Debug features
oUART (RS-232) for Linux console
oJTAG for STM32 (ARC 1500)
Lecip Arcontia confidential (V1.00 2019-05-13)
•Service Area (Service Hatch)
oUSB OTG
o2-bit Boot configuration switch
oSIM card Slot
o4 x SAM Interfaces
oRS-232 for Linux console
oTamper Switch
oManual Rest button
oVisually and by MCU readable 10-bit H/W Revision/Variant/BOM resistive
network
•Supported Smart Cards
oMifare Classic, Mifare Plus, Mifare Ultralight, Mifare Ultrlight C, Mifare
Desfire, Mifare SmartMX, GTML, GTML2, ISO 144434A tags, ISO 14443B
tags, Felica, Calypso
•Supported SAM
oMifare SAM AV1/AV2 and other ISO/IEC 7816 compliant SAMs such as
S9TSAM, Calypso SAM, Felica SAM
•SDK Support
oMifare Classic, Mifare Plus, Mifare Ultrlight, Mifare Ultralight C, Mifare
Desfire EV1/EV2
•Temperature and Humidity
oOperating temp. -20 to 60 deg.
oStorage temp. -30 to 70 deg.
oHumidity 6 to 96% (non condensing)
•Power Supply 9Vdc to 36Vdc
•Power Consumption Standard 11W, max 13W
•Dimension 245mm (L) x 140mm (W) x 88mm (H)
•Weight 1260g
•Digital ambient light sensor
•Digital accelerometer (3-axis, 12-/8-bit)
•Digital temperature sensor (typical accuracy ± 1°C from -40°C to +125°C )
•NFC High-power solution for contactless communication at 13.56 MHz
Lecip Arcontia confidential (V1.00 2019-05-13)
2. External/Electrical Interface and Access Card
Here is the detailed description of Pinout, connectors and function or available signals on
Access card.
Fig 1. Access Card
L2R
Pos.
Conn.
Pin nr.
Interface
Function
Wire
Wire-end
ferrule
Digi-key
(mm2)
AWG
1
J2
1
RS232-1
RTS
0.25
24
966066-3
A136908-ND
2
2
CTS
0.25
24
3
3
GND
0.25
24
4
4
RXD
0.25
24
5
5
TXD
0.25
24
6
6
IGN
IGN
0.5
20
966067-1
A114629-ND
7
7
BATT FWD
0.5
20
8
J3
1
POWER
SUPPLY
BATT +
1.5
16
902-569-0000
9
2
BATT -
1.5
16
10
J4
1
ETHERNET
ETH RX-
1
0.25
24
11
2
ETH RX+
0.25
24
12
3
GND
0.25
24
13
4
ETH TX-
2
0.25
24
14
5
ETH TX+
0.25
24
15
6
RS232-2
GND
0.25
24
16
7
RTS
0.25
24
17
J5
1
CTS
0.25
24
18
2
RXD
0.25
24
19
3
TXD
0.25
24
20
4
RS485
485-B
0.25
24
21
5
GND
0.25
24
22
6
485-A
0.25
24
23
7
GPO1
OUT-A
0.5
20
24
J6
1
OUT-B
0.5
20
25
2
GPO2
OUT-A
0.5
20
26
3
OUT-B
0.5
20
27
4
GPI1
IN-A
0.5
20
28
5
IN-B
0.5
20
29
6
GPI2
IN-A
0.5
20
30
7
IN-B
0.5
20
1RX lines: Green, Green/White, with positions 6 and 3 in the RJ45 connector respectively
2TX lines: Orange, Orange/White, with positions 2 and 1 in the RJ45 connector respectively
Lecip Arcontia confidential (V1.00 2019-05-13)
Highly recommended crimp tool is KNIPEX 975314 or any other with a hexagonal crimp shape.
Figure 2: Flat shape
Figure 3: Hexagonal shape
Using crimp tool with a non-hexagonal shape (Figure 2) will produce a flat form of wire-end ferrule
that cannot be pushed in the hole of spring-cage terminal block. Hexagonal form (Figure 3) however
is a good approximation of the circle and pushing in should be easily done.
Lecip Arcontia confidential (V1.00 2019-05-13)
3. Board to Board Connector
The passive part (Access Card) of the Arcontia validator is connected to the active part (Main
Board) through a pair of B2B connectors. Access card is equipped with receptacle side (J1)
while main board with mating header side (J1).
The connector pair is Hirose FX23 and FX23L series. It is a pair of 40+4 hybrid power/signal
contacts with floating ability.
Figure 4: FX23/FX23L XY-Floating Ability
Floating movable amount in both X and Y-direction is ± 0.6mm a side so totally floating
movable amount of both the receptacle and the header when they are connected with each
other is ±1.2 in both X and Y-direction.
Connectors are intended to be used with high speed transmission signals up to 8Gbps that is
applicable in the Arcontia Validator as communication lines such as Ethernet, RS-485 and RS-
232 need to go through the connector. Further, the differential impedance between a pair
signal pins is 100±Ω which is especially applicable on both Ethernet and RS-485.
As mentioned, the connectors are hybrid meaning that beside signal pins (40) they contain
also power pin (+4). The guide posts on the both sides of the connector are equipped with 4
lines of power contacts with 3A/pin capability.
Figure 5: FX23 Hybrid Construction
Lecip Arcontia confidential (V1.00 2019-05-13)
The applied pair of the receptacle and the header gives a stacked height of 19mm.
Figure 6: The Applied Combination
Lecip Arcontia confidential (V1.00 2019-05-13)
4. User Interface
An overview of user Interface is shown in the picture below. The user interface is consist of:
•5.7" LCD 24 LVDS VGA (680x480 Resolution)
•4 x Indication LEDs
•Smart Card Reader
•QR code Reader
•Speaker
Figure 7: User Interface
5.7” LCD
(680x480)
Indication LEDs
QR Code
Reader
Smart Card
Reader Area
Speaker
Lecip Arcontia confidential (V1.00 2019-05-13)
5.Mechanical Interface
140 (mm)
Figure 8: Dimension Front View (mm)
Figure 9: Dimension Side View (mm)
47mm
245mm
Lecip Arcontia confidential (V1.00 2019-05-13)
5. Electrical Interface Overview
5.1 Top Placement of LV-700 Main Board
SD1
J1 J10
J6 SIM SAM (1-4)
Figure 10: Top Placement of LV-700 Main Board J9
•SAM1 – Secure Access Module Slot no 1
•SAM2 – Secure Access Module Slot no 2
•SAM3 – Secure Access Module Slot no 3
•SAM4 – Secure Access Module Slot no 4
•SIM1 – SIM Module Slot
•SD1 – Micro SD slot for additional memory
•J1 (Hirose: FX23-40P-0.5SV20) – Connection Board Connector
•J6 (FCI: SFV8R-3STBE1HLF) – Touch Screen Interface
•J10(Wurth: 614105150621) – For MCU Update
•J9 (FCI: 10051922-1210EHLF) – QR Camera Interface